Adrien LaVoie

Person

Newberg, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Gapfill of variable aspect ratio features with a composite PEALD an...
- Patent number 12,261,038
- Issue date Mar 25, 2025
- Lam Research Corporation
- Hu Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Temperature control of a multi-zone pedestal
- Patent number 12,209,312
- Issue date Jan 28, 2025
- Lam Research Corporation
- Ramesh Chandrasekharan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Use of vacuum during transfer of substrates
- Patent number 12,186,851
- Issue date Jan 7, 2025
- Lam Research Corporation
- Ramesh Chandrasekharan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated dry processes for patterning radiation photoresist patte...
- Patent number 12,183,604
- Issue date Dec 31, 2024
- Lam Research Corporation
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal atomic layer deposition of silicon-containing films
- Patent number 12,157,945
- Issue date Dec 3, 2024
- Lam Research Corporation
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic chuck with seal surface
- Patent number 12,142,509
- Issue date Nov 12, 2024
- Lam Research Corporation
- Patrick G. Breiling
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for providing doped silicon using a diffusion barrier layer
- Patent number 12,125,705
- Issue date Oct 22, 2024
- Lam Research Corporation
- Purushottam Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pedestals for modulating film properties in atomic layer deposition...
- Patent number 12,110,586
- Issue date Oct 8, 2024
- Lam Research Corporation
- Adrien Lavoie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Variable cycle and time RF activation method for film thickness mat...
- Patent number 12,077,859
- Issue date Sep 3, 2024
- Lam Research Corporation
- Ishtak Karim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Trim and deposition profile control with multi-zone heated substrat...
- Patent number 12,071,689
- Issue date Aug 27, 2024
- Lam Research Corporation
- Ramesh Chandrasekharan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for cleaning plasma chambers
- Patent number 12,057,300
- Issue date Aug 6, 2024
- Lam Research Corporation
- Adrien Lavoie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dielectric gapfill using atomic layer deposition (ALD), inhibitor p...
- Patent number 12,049,699
- Issue date Jul 30, 2024
- Lam Research Corporation
- Joseph Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for reducing effluent build-up in a pumping exh...
- Patent number 12,049,698
- Issue date Jul 30, 2024
- Lam Research Corporation
- Antonio Xavier
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective carbon deposition
- Patent number 12,037,686
- Issue date Jul 16, 2024
- Lam Research Corporation
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Modulated atomic layer deposition
- Patent number 12,040,181
- Issue date Jul 16, 2024
- Lam Research Corporation
- Chan Myae Myae Soe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low-κ ALD gap-fill methods and material
- Patent number 12,020,923
- Issue date Jun 25, 2024
- Lam Research Corporation
- Joseph R. Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dynamic precursor dosing for atomic layer deposition
- Patent number 11,970,772
- Issue date Apr 30, 2024
- Lam Research Corporation
- Purushottam Kumar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fill on demand ampoule refill
- Patent number 11,959,175
- Issue date Apr 16, 2024
- Lam Research Corporation
- Tuan Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for modulating film uniformity
- Patent number 11,913,113
- Issue date Feb 27, 2024
- Lam Research Corporation
- Pulkit Agarwal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of atomic layer deposition
- Patent number 11,670,503
- Issue date Jun 6, 2023
- Lam Research Corporation
- Jun Qian
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of improving deposition induced CD imbalance using spatially...
- Patent number 11,651,963
- Issue date May 16, 2023
- Lam Research Corporation
- Ishtak Karim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin atomic layer deposition film accuracy thickness control
- Patent number 11,646,198
- Issue date May 9, 2023
- Lam Research Corporation
- Jun Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for providing station to station uniformity
- Patent number 11,542,599
- Issue date Jan 3, 2023
- Lam Research Corporation
- Adrien Lavoie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-cycle ALD process for film uniformity and thickness profile m...
- Patent number 11,479,856
- Issue date Oct 25, 2022
- Lam Research Corporation
- Purushottam Kumar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Planar substrate edge contact with open volume equalization pathway...
- Patent number 11,443,975
- Issue date Sep 13, 2022
- Lam Research Corporation
- Patrick Breiling
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing system with tandem source activation for CVD
- Patent number 11,434,567
- Issue date Sep 6, 2022
- Lam Research Corporation
- Adrien LaVoie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface modified depth controlled deposition for plasma based depos...
- Patent number 11,373,862
- Issue date Jun 28, 2022
- Lam Research Corporation
- Joseph Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for reducing effluent build-up in a pumping exh...
- Patent number 11,332,824
- Issue date May 17, 2022
- Lam Research Corporation
- Antonio Xavier
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Controller for controlling core critical dimension variation using...
- Patent number 11,322,416
- Issue date May 3, 2022
- Lam Research Corporation
- Pulkit Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric gapfill using atomic layer deposition (ALD), inhibitor p...
- Patent number 11,293,098
- Issue date Apr 5, 2022
- Lam Research Corporation
- Joseph Abel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INCREASING DEPOSITION RATES OF OXIDE FILMS
- Publication number 20250087481
- Publication date Mar 13, 2025
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROSTATIC CHUCK WITH SEAL SURFACE
- Publication number 20250062150
- Publication date Feb 20, 2025
- LAM RESEARCH CORPORATION
- Patrick Girard Breiling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS
- Publication number 20250053080
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Jeffrey Marks
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PROVIDING DOPED SILICON USING A DIFFUSION BARRIER LAYER
- Publication number 20250046613
- Publication date Feb 6, 2025
- LAM RESEARCH CORPORATION
- Purushottam KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTALS FOR MODULATING FILM PROPERTIES IN ATOMIC LAYER DEPOSITION...
- Publication number 20250019825
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Adrien LAVOIE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRIM AND DEPOSITION PROFILE CONTROL WITH MULTI-ZONE HEATED SUBSTRAT...
- Publication number 20240392443
- Publication date Nov 28, 2024
- LAM RESEARCH CORPORATION
- Ramesh CHANDRASEKHARAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS FOR CLEANING PLASMA CHAMBERS
- Publication number 20240395513
- Publication date Nov 28, 2024
- LAM RESEARCH CORPORATION
- Adrien LAVOIE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE CARBON DEPOSITION
- Publication number 20240368761
- Publication date Nov 7, 2024
- LAM RESEARCH CORPORATION
- Awnish GUPTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW-K ALD GAP-FILL METHODS AND MATERIAL
- Publication number 20240347337
- Publication date Oct 17, 2024
- LAM RESEARCH CORPORATION
- Joseph R. Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS
- Publication number 20240327973
- Publication date Oct 3, 2024
- LAM RESEARCH CORPORATION
- Ravi KUMAR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MODULATED ATOMIC LAYER DEPOSITION
- Publication number 20240332007
- Publication date Oct 3, 2024
- LAM RESEARCH CORPORATION
- Chan Myae Myae Soe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DYNAMIC PRECURSOR DOSING FOR ATOMIC LAYER DEPOSITION
- Publication number 20240240316
- Publication date Jul 18, 2024
- LAM RESEARCH CORPORATION
- Purushottam Kumar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILL ON DEMAND AMPOULE REFILL
- Publication number 20240218515
- Publication date Jul 4, 2024
- LAM RESEARCH CORPORATION
- Tuan Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR MODULATING FILM UNIFORMITY
- Publication number 20240183034
- Publication date Jun 6, 2024
- LAM RESEARCH CORPORATION
- Pulkit Agarwal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IN-SITU FILM ANNEALING IN SUBSTRATE PROCESSING
- Publication number 20240167153
- Publication date May 23, 2024
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTE...
- Publication number 20240145272
- Publication date May 2, 2024
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTl-STATION TOOL WITH ROTATABLE TOP PLATE ASSEMBLY
- Publication number 20230420289
- Publication date Dec 28, 2023
- LAM RESEARCH CORPORATION
- Karl Frederick Leeser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PHOTO-SENSITIVE HYBRID FILMS
- Publication number 20230314946
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Eric Calvin Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPURITY REDUCTION IN SILICON-CONTAINING FILMS
- Publication number 20230317449
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ULTRATHIN ATOMIC LAYER DEPOSITION FILM ACCURACY THICKNESS CONTROL
- Publication number 20230298884
- Publication date Sep 21, 2023
- LAM RESEARCH CORPORATION
- Jun Qian
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTE...
- Publication number 20230290657
- Publication date Sep 14, 2023
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS
- Publication number 20230273516
- Publication date Aug 31, 2023
- LAM RESEARCH CORPORATION
- Jeffrey Marks
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS
- Publication number 20230266662
- Publication date Aug 24, 2023
- LAM RESEARCH CORPORATION
- Jeffrey Marks
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONFORMAL THERMAL CVD WITH CONTROLLED FILM PROPERTIES AND HIGH DEPO...
- Publication number 20230245896
- Publication date Aug 3, 2023
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IN-FEATURE WET ETCH RATE RATIO REDUCTION
- Publication number 20230220544
- Publication date Jul 13, 2023
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE PRECISION ETCHING OF SEMICONDUCTOR MATERIALS
- Publication number 20230207328
- Publication date Jun 29, 2023
- LAM RESEARCH CORPORATION
- Nathan MUSSELWHITE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAM MITIGATION AND INTEGRATED LINER FOR GAP FILL
- Publication number 20230175117
- Publication date Jun 8, 2023
- LAM RESEARCH CORPORATION
- Dustin Zachary AUSTIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STABILIZATION OF CARBON DEPOSITION PRECURSORS LIKE C2H2
- Publication number 20230167545
- Publication date Jun 1, 2023
- LAM RESEARCH CORPORATION
- Kapu Sirish Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AUTOMATED FEEDFORWARD AND FEEDBACK SEQUENCE FOR PATTERNING CD CONTROL
- Publication number 20230170195
- Publication date Jun 1, 2023
- LAM RESEARCH CORPORATION
- Ravi Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECURSORS FOR HIGH-TEMPERATURE DEPOSITION OF SILICON-CONTAINING FILMS
- Publication number 20230098270
- Publication date Mar 30, 2023
- LAM RESEARCH CORPORATION
- Douglas Walter Agnew
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Adrien LaVoie

Person

Patents Grantslast 30 patents

Gapfill of variable aspect ratio features with a composite PEALD an...

Temperature control of a multi-zone pedestal

Use of vacuum during transfer of substrates

Integrated dry processes for patterning radiation photoresist patte...

Thermal atomic layer deposition of silicon-containing films

Electrostatic chuck with seal surface

Method for providing doped silicon using a diffusion barrier layer

Pedestals for modulating film properties in atomic layer deposition...

Variable cycle and time RF activation method for film thickness mat...

Trim and deposition profile control with multi-zone heated substrat...

Apparatus for cleaning plasma chambers

Dielectric gapfill using atomic layer deposition (ALD), inhibitor p...

Systems and methods for reducing effluent build-up in a pumping exh...

Selective carbon deposition

Modulated atomic layer deposition

Low-κ ALD gap-fill methods and material

Dynamic precursor dosing for atomic layer deposition

Fill on demand ampoule refill

Method and apparatus for modulating film uniformity

Method of atomic layer deposition

Method of improving deposition induced CD imbalance using spatially...

Ultrathin atomic layer deposition film accuracy thickness control

Method and apparatus for providing station to station uniformity

Multi-cycle ALD process for film uniformity and thickness profile m...

Planar substrate edge contact with open volume equalization pathway...

Substrate processing system with tandem source activation for CVD

Surface modified depth controlled deposition for plasma based depos...

Systems and methods for reducing effluent build-up in a pumping exh...

Controller for controlling core critical dimension variation using...

Dielectric gapfill using atomic layer deposition (ALD), inhibitor p...

Patents Applicationslast 30 patents

INCREASING DEPOSITION RATES OF OXIDE FILMS

ELECTROSTATIC CHUCK WITH SEAL SURFACE

VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS

METHOD FOR PROVIDING DOPED SILICON USING A DIFFUSION BARRIER LAYER

PEDESTALS FOR MODULATING FILM PROPERTIES IN ATOMIC LAYER DEPOSITION...

TRIM AND DEPOSITION PROFILE CONTROL WITH MULTI-ZONE HEATED SUBSTRAT...

APPARATUS FOR CLEANING PLASMA CHAMBERS

SELECTIVE CARBON DEPOSITION

LOW-K ALD GAP-FILL METHODS AND MATERIAL

PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS

MODULATED ATOMIC LAYER DEPOSITION

DYNAMIC PRECURSOR DOSING FOR ATOMIC LAYER DEPOSITION

FILL ON DEMAND AMPOULE REFILL

METHOD AND APPARATUS FOR MODULATING FILM UNIFORMITY

IN-SITU FILM ANNEALING IN SUBSTRATE PROCESSING

INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTE...

MULTl-STATION TOOL WITH ROTATABLE TOP PLATE ASSEMBLY

METHOD OF FORMING PHOTO-SENSITIVE HYBRID FILMS

IMPURITY REDUCTION IN SILICON-CONTAINING FILMS

ULTRATHIN ATOMIC LAYER DEPOSITION FILM ACCURACY THICKNESS CONTROL

INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTE...

VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS

VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS

CONFORMAL THERMAL CVD WITH CONTROLLED FILM PROPERTIES AND HIGH DEPO...

IN-FEATURE WET ETCH RATE RATIO REDUCTION

SELECTIVE PRECISION ETCHING OF SEMICONDUCTOR MATERIALS

SEAM MITIGATION AND INTEGRATED LINER FOR GAP FILL

STABILIZATION OF CARBON DEPOSITION PRECURSORS LIKE C2H2

AUTOMATED FEEDFORWARD AND FEEDBACK SEQUENCE FOR PATTERNING CD CONTROL

PRECURSORS FOR HIGH-TEMPERATURE DEPOSITION OF SILICON-CONTAINING FILMS