Ai-Tee Ang

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure including a thermal isolation material
- Patent number 11,776,945
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure
- Patent number 11,532,498
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for processing semiconductor devices
- Patent number 11,355,471
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure
- Patent number 11,239,103
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of integrated fan-out package
- Patent number 10,867,953
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ai-Tee Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing boat design with pressure sensor
- Patent number 10,734,263
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package on-package structure
- Patent number 10,622,240
- Issue date Apr 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package structure including a thermal isolation material...
- Patent number 10,490,539
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing boat design with pressure sensor
- Patent number 10,475,679
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 10,276,537
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ai-Tee Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 10,109,612
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing boat design with pressure sensor
- Patent number 9,911,633
- Issue date Mar 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for processing semiconductor devices, and methods of proces...
- Patent number 9,888,527
- Issue date Feb 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package structure
- Patent number 9,768,048
- Issue date Sep 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package joint structure with molding open bumps
- Patent number 9,576,888
- Issue date Feb 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of fabricating same
- Patent number 9,437,564
- Issue date Sep 6, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing boat design with pressure sensor
- Patent number 9,427,818
- Issue date Aug 30, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package structure including a thermal isolation material...
- Patent number 9,418,971
- Issue date Aug 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow process and tool
- Patent number 9,373,603
- Issue date Jun 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine-pitch package-on-package structures and methods for forming th...
- Patent number 8,900,922
- Issue date Dec 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for metal bump die assembly
- Patent number 8,853,002
- Issue date Oct 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in a package-on-package structure
- Patent number 8,846,448
- Issue date Sep 30, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure Including a Thermal Isolation Material
- Publication number 20230378153
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CHIP MANUFACTURING
- Publication number 20220208559
- Publication date Jun 30, 2022
- ADVANCED MICRO DEVICES, INC.
- Ai-Tee Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure
- Publication number 20200350197
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure
- Publication number 20200243370
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR
- Publication number 20200035529
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package-on-Package Structure Including a Thermal Isolation Material...
- Publication number 20200020677
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF INTEGRATED FAN-OUT PACKAGE
- Publication number 20190252339
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ai-Tee Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190096840
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ai-Tee Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20180358325
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR
- Publication number 20180166308
- Publication date Jun 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package-on-Package Structure
- Publication number 20180019151
- Publication date Jan 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Processing Boat Design with Pressure Sensor
- Publication number 20160358797
- Publication date Dec 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure Including a Thermal Isolation Material...
- Publication number 20160343698
- Publication date Nov 24, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflow Process and Tool
- Publication number 20150249062
- Publication date Sep 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR
- Publication number 20150206779
- Publication date Jul 23, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems for Processing Semiconductor Devices, and Methods of Proces...
- Publication number 20150201462
- Publication date Jul 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Jen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20150171051
- Publication date Jun 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FABRICATING SAME
- Publication number 20150014851
- Publication date Jan 15, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure
- Publication number 20140264840
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Joint Structure with Molding Open Bumps
- Publication number 20140264858
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Metal Bump Die Assembly
- Publication number 20140193952
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE INCLUDING A THERMAL ISOLATION MATERIAL...
- Publication number 20140124955
- Publication date May 8, 2014
- Meng-Tse CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fine Pitch Package-on-Package Structure
- Publication number 20140042622
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WARPAGE CONTROL IN A PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20140045300
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fine-Pitch Package-on-Package Structures and Methods for Forming th...
- Publication number 20130214431
- Publication date Aug 22, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Tools and systems for processing semiconductor devices, and methods...

Package-on-package structure including a thermal isolation material

Package-on-package structure

System for processing semiconductor devices

Package-on-package structure

Manufacturing method of integrated fan-out package

Semiconductor processing boat design with pressure sensor

Package on-package structure

Package on-package structure including a thermal isolation material...

Semiconductor processing boat design with pressure sensor

Integrated fan-out package and manufacturing method thereof

Tools and systems for processing semiconductor devices, and methods...

Semiconductor processing boat design with pressure sensor

Systems for processing semiconductor devices, and methods of proces...

Package on-package structure

Package on-package joint structure with molding open bumps

Interconnect structure and method of fabricating same

Semiconductor processing boat design with pressure sensor

Package-on-package structure including a thermal isolation material...

Reflow process and tool

Fine-pitch package-on-package structures and methods for forming th...

Methods for metal bump die assembly

Warpage control in a package-on-package structure

Patents Applicationslast 30 patents

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

Package-on-Package Structure Including a Thermal Isolation Material

Tools and Systems for Processing Semiconductor Devices, and Methods...

METHOD AND APPARATUS FOR CHIP MANUFACTURING

Package-on-Package Structure

Package-on-Package Structure

SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR

Package-on-Package Structure Including a Thermal Isolation Material...

MANUFACTURING METHOD OF INTEGRATED FAN-OUT PACKAGE

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

Tools and Systems for Processing Semiconductor Devices, and Methods...

SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR

Package-on-Package Structure

Semiconductor Processing Boat Design with Pressure Sensor

Package-on-Package Structure Including a Thermal Isolation Material...

Reflow Process and Tool

SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR

Systems for Processing Semiconductor Devices, and Methods of Proces...

Tools and Systems for Processing Semiconductor Devices, and Methods...

INTERCONNECT STRUCTURE AND METHOD OF FABRICATING SAME

Package-on-Package Structure

Package-on-Package Joint Structure with Molding Open Bumps

Methods for Metal Bump Die Assembly

PACKAGE-ON-PACKAGE STRUCTURE INCLUDING A THERMAL ISOLATION MATERIAL...

Fine Pitch Package-on-Package Structure

WARPAGE CONTROL IN A PACKAGE-ON-PACKAGE STRUCTURE

Fine-Pitch Package-on-Package Structures and Methods for Forming th...