Aibin Yu

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon spacers with improved adhesion and semiconductor device ass...
- Patent number 12,255,128
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad with micro-protrusions for direct metallic bonding
- Patent number 12,087,719
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad with micro-protrusions for direct metallic bonding
- Patent number 10,923,448
- Issue date Feb 16, 2021
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making semiconductor devices
- Patent number 10,734,370
- Issue date Aug 4, 2020
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies with heat sink and associated systems...
- Patent number 10,636,678
- Issue date Apr 28, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising protected side surfaces and relate...
- Patent number 10,312,226
- Issue date Jun 4, 2019
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies with heat sink and associated systems...
- Patent number 10,153,178
- Issue date Dec 11, 2018
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing multi-die semiconductor device packages an...
- Patent number 10,103,134
- Issue date Oct 16, 2018
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing multi-die semiconductor device packages an...
- Patent number 9,865,578
- Issue date Jan 9, 2018
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing wafer-level assemblies to reduce warpage, and...
- Patent number 9,786,612
- Issue date Oct 10, 2017
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising protected side surfaces and relate...
- Patent number 9,786,643
- Issue date Oct 10, 2017
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies with heat sink and associated systems...
- Patent number 9,716,019
- Issue date Jul 25, 2017
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing wafer-level assemblies to reduce warpage, and...
- Patent number 9,589,933
- Issue date Mar 7, 2017
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies with heat sink and associated systems...
- Patent number 9,349,670
- Issue date May 24, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of protecting peripheries of in-process semiconductor wafer...
- Patent number 9,337,064
- Issue date May 10, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor device packages
- Patent number 9,202,714
- Issue date Dec 1, 2015
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20240429190
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATED SEMICONDUCTOR DEVICES AND ASSOCIATED METHODS
- Publication number 20230395430
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Marc Anthony Romana de Guzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON SPACERS WITH IMPROVED ADHESION AND SEMICONDUCTOR DEVICE ASS...
- Publication number 20230268263
- Publication date Aug 24, 2023
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20210175194
- Publication date Jun 10, 2021
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MAKING SEMICONDUCTOR DEVICES
- Publication number 20190252362
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...
- Publication number 20190109019
- Publication date Apr 11, 2019
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING PROTECTED SIDE SURFACES AND RELATE...
- Publication number 20180033780
- Publication date Feb 1, 2018
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING MULTI-DIE SEMICONDUCTOR DEVICE PACKAGES AN...
- Publication number 20180033781
- Publication date Feb 1, 2018
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...
- Publication number 20170323802
- Publication date Nov 9, 2017
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20170287864
- Publication date Oct 5, 2017
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROCESSING WAFER-LEVEL ASSEMBLIES TO REDUCE WARPAGE, AND...
- Publication number 20170179045
- Publication date Jun 22, 2017
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING MULTI DIE SEMICONDUCTOR DEVICE PACKAGES AN...
- Publication number 20160358898
- Publication date Dec 8, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...
- Publication number 20160233110
- Publication date Aug 11, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20160093583
- Publication date Mar 31, 2016
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROTECTING PERIPHERIES OF IN-PROCESS SEMICONDUCTOR WAFER...
- Publication number 20160079094
- Publication date Mar 17, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...
- Publication number 20160035648
- Publication date Feb 4, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING PROTECTED SIDE SURFACES AND RELATE...
- Publication number 20160013154
- Publication date Jan 14, 2016
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROCESSING WAFER-LEVEL ASSEMBLIES TO REDUCE WARPAGE, AND...
- Publication number 20150371969
- Publication date Dec 24, 2015
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20130280861
- Publication date Oct 24, 2013
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Silicon spacers with improved adhesion and semiconductor device ass...

Bond pad with micro-protrusions for direct metallic bonding

Bond pad with micro-protrusions for direct metallic bonding

Methods of making semiconductor devices

Semiconductor die assemblies with heat sink and associated systems...

Semiconductor devices comprising protected side surfaces and relate...

Semiconductor die assemblies with heat sink and associated systems...

Methods of manufacturing multi-die semiconductor device packages an...

Methods of manufacturing multi-die semiconductor device packages an...

Methods of processing wafer-level assemblies to reduce warpage, and...

Semiconductor devices comprising protected side surfaces and relate...

Semiconductor die assemblies with heat sink and associated systems...

Methods of processing wafer-level assemblies to reduce warpage, and...

Semiconductor die assemblies with heat sink and associated systems...

Methods of protecting peripheries of in-process semiconductor wafer...

Methods for forming semiconductor device packages

Patents Applicationslast 30 patents

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

SINGULATED SEMICONDUCTOR DEVICES AND ASSOCIATED METHODS

SILICON SPACERS WITH IMPROVED ADHESION AND SEMICONDUCTOR DEVICE ASS...

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

METHODS OF MAKING SEMICONDUCTOR DEVICES

SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...

SEMICONDUCTOR DEVICES COMPRISING PROTECTED SIDE SURFACES AND RELATE...

METHODS OF MANUFACTURING MULTI-DIE SEMICONDUCTOR DEVICE PACKAGES AN...

SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

METHODS OF PROCESSING WAFER-LEVEL ASSEMBLIES TO REDUCE WARPAGE, AND...

METHODS OF MANUFACTURING MULTI DIE SEMICONDUCTOR DEVICE PACKAGES AN...

SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

METHODS OF PROTECTING PERIPHERIES OF IN-PROCESS SEMICONDUCTOR WAFER...

SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS...

SEMICONDUCTOR DEVICES COMPRISING PROTECTED SIDE SURFACES AND RELATE...

METHODS OF PROCESSING WAFER-LEVEL ASSEMBLIES TO REDUCE WARPAGE, AND...

METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES