AJIT K. TRIVEDI

Person

ENDWELL, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Placement of sacrificial solder balls underneath the PBGA substrate
- Patent number 7,227,268
- Issue date Jun 5, 2007
- International Business Machines Corporation
- Chi Shih Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Placement of sacrificial solder balls underneath the PBGA substrate
- Patent number 6,829,149
- Issue date Dec 7, 2004
- International Business Machines Corporation
- Chi Shih Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low or no-force bump flattening structure and method
- Patent number 6,674,647
- Issue date Jan 6, 2004
- International Business Machines Corporation
- Mark V. Pierson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for semiconductor testing using electrically cond...
- Patent number 6,559,666
- Issue date May 6, 2003
- International Business Machines Corporation
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Grant
Wafer scale encapsulation for integrated flip chip and surface moun...
- Patent number 6,492,071
- Issue date Dec 10, 2002
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling method for electronic components
- Patent number 6,453,537
- Issue date Sep 24, 2002
- International Business Machines Corporation
- Craig G. Heim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for printed circuit board repair
- Patent number 6,437,254
- Issue date Aug 20, 2002
- International Business Machines Corporation
- Alan Harris Crudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proper choice of the encapsulant volumetric CTE for different PGBA...
- Patent number 6,353,182
- Issue date Mar 5, 2002
- International Business Machines Corporation
- Chi Shih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for printed circuit board repair
- Patent number 6,295,724
- Issue date Oct 2, 2001
- International Business Machines Corporation
- Alan Harris Crudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor testing using electrically conductive adhesives
- Patent number 6,288,559
- Issue date Sep 11, 2001
- International Business Machines Corporation
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Grant
Method and device for semiconductor testing using electrically cond...
- Patent number 6,268,739
- Issue date Jul 31, 2001
- International Business Machines Corporation
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Grant
Relocating the neutral plane in a PBGA substrate to eliminate chip...
- Patent number 6,255,599
- Issue date Jul 3, 2001
- IBM
- Chi Shih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for printed circuit board repair
- Patent number 6,115,912
- Issue date Sep 12, 2000
- International Business Machines Corporation
- Alan Harris Crudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling structure for electronic components
- Patent number 6,034,875
- Issue date Mar 7, 2000
- International Business Machines Corporation
- Craig G. Heim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for printed circuit board repair
- Patent number 6,018,866
- Issue date Feb 1, 2000
- International Business Machines Corporation
- Alan Harris Crudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Construction of PBGA substrate for flip chip packing
- Patent number 5,959,348
- Issue date Sep 28, 1999
- International Business Machines Corporation
- Chi Shih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for printed circuit board repair
- Patent number 5,809,641
- Issue date Sep 22, 1998
- International Business Machines Corporation
- Alan Harris Crudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making printed circuit board
- Patent number 5,685,070
- Issue date Nov 11, 1997
- International Business Machines Corporation
- Warren Alan Alpaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a flex laminate package
- Patent number 5,620,782
- Issue date Apr 15, 1997
- International Business Machines Corporation
- Charles R. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a flex laminate package
- Patent number 5,509,196
- Issue date Apr 23, 1996
- International Business Machines Corporation
- Charles R. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling plated through holes
- Patent number 5,435,480
- Issue date Jul 25, 1995
- International Business Machines Corporation
- Paul J. Hart
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board or card for direct chip attachment and fabric...
- Patent number 5,418,689
- Issue date May 23, 1995
- International Business Machines Corporation
- Warren A. Alpaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flex laminate package for a parallel processor
- Patent number 5,384,690
- Issue date Jan 24, 1995
- International Business Machines Corporation
- Charles R. Davis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Placement of sacrificial solder balls underneath the PBGA substrate
- Publication number 20050063165
- Publication date Mar 24, 2005
- Chi Shih Chang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Low or no-force bump flattening structure and method
- Publication number 20030127499
- Publication date Jul 10, 2003
- International Business Machines Corporation
- Mark V. Pierson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for printed circuit board repair
- Publication number 20020059721
- Publication date May 23, 2002
- International Business Machines Corporation
- Alan Harris Crudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device for semiconductor testing using electrically cond...
- Publication number 20010035759
- Publication date Nov 1, 2001
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR TESTING USING ELECTRICALLY CONDUCTIVE ADHESIVES
- Publication number 20010024127
- Publication date Sep 27, 2001
- WILLIAM E. BERNIER
- G01 - MEASURING TESTING

AJIT K. TRIVEDI

Person

Patents Grantslast 30 patents

Placement of sacrificial solder balls underneath the PBGA substrate

Placement of sacrificial solder balls underneath the PBGA substrate

Low or no-force bump flattening structure and method

Method and device for semiconductor testing using electrically cond...

Wafer scale encapsulation for integrated flip chip and surface moun...

Cooling method for electronic components

Apparatus and method for printed circuit board repair

Proper choice of the encapsulant volumetric CTE for different PGBA...

Apparatus for printed circuit board repair

Semiconductor testing using electrically conductive adhesives

Method and device for semiconductor testing using electrically cond...

Relocating the neutral plane in a PBGA substrate to eliminate chip...

Apparatus and method for printed circuit board repair

Cooling structure for electronic components

Apparatus and method for printed circuit board repair

Construction of PBGA substrate for flip chip packing

Method for printed circuit board repair

Method of making printed circuit board

Method of fabricating a flex laminate package

Method of fabricating a flex laminate package

Method for filling plated through holes

Printed circuit board or card for direct chip attachment and fabric...

Flex laminate package for a parallel processor

Patents Applicationslast 30 patents

Placement of sacrificial solder balls underneath the PBGA substrate

Low or no-force bump flattening structure and method

Apparatus and method for printed circuit board repair

Method and device for semiconductor testing using electrically cond...

SEMICONDUCTOR TESTING USING ELECTRICALLY CONDUCTIVE ADHESIVES