Akemi Kawaguchi

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Layer forming material and wiring forming method
- Patent number 6,372,928
- Issue date Apr 16, 2002
- Matsushita Electric Industrial Co., Ltd.
- Akemi Kawaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming wiring for a semiconductor device
- Patent number 5,953,628
- Issue date Sep 14, 1999
- Matsushita Electric Industrial Co., Ltd.
- Akemi Kawaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 5,863,834
- Issue date Jan 26, 1999
- Matsushita Electric Industrial Co., Ltd.
- Akemi Kawaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal surface state evaluation method and semiconductor device prod...
- Patent number 5,820,746
- Issue date Oct 13, 1998
- Matsushita Electric Industrial Co., Ltd.
- Akemi Kawaguchi
- G01 - MEASURING TESTING
Information Patent Grant
Electroless plating bath used for forming a wiring of a semiconduct...
- Patent number 5,795,828
- Issue date Aug 18, 1998
- Matsushita Electric Industrial Co., Ltd.
- Masayuki Endo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Layer forming material and wiring forming method
- Patent number 5,773,639
- Issue date Jun 30, 1998
- Matsushita Electric Industrial Co., Ltd.
- Akemi Kawaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless plating bath used for forming a wiring of a semiconduct...
- Patent number 5,645,628
- Issue date Jul 8, 1997
- Matsushita Electric Industrial Co., Ltd.
- Masayuki Endo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Akemi Kawaguchi

Person

Patents Grantslast 30 patents

Layer forming material and wiring forming method

Method for forming wiring for a semiconductor device

Semiconductor device and method of manufacturing the same

Metal surface state evaluation method and semiconductor device prod...

Electroless plating bath used for forming a wiring of a semiconduct...

Layer forming material and wiring forming method

Electroless plating bath used for forming a wiring of a semiconduct...