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Akifumi SHIKANO

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  • Ogaki, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wiring substrate
    • Patent number 12,219,704
    • Issue date Feb 4, 2025
    • Ibiden Co., Ltd.
    • Naoki Mizutani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230180386
    • Publication date Jun 8, 2023
    • IBIDEN CO., LTD.
    • Naoki MIZUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING PRINTED WIRING BOARD
    • Publication number 20230164925
    • Publication date May 25, 2023
    • IBIDEN CO., LTD.
    • Katsuhiko TANNO
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METHOD FOR MANUFACTURING PRINTED WIRING BOARD
    • Publication number 20220046806
    • Publication date Feb 10, 2022
    • IBIDEN CO., LTD.
    • Satoru KAWAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR