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Akihiro Yaguchi

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Patents Grantslast 30 patents

  • Information Patent Grant

    Method for manufacturing semiconductor device
    • Patent number 7,572,674
    • Issue date Aug 11, 2009
    • Renesas Technology Corp.
    • Kouta Nagano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-chip module
    • Patent number 7,388,295
    • Issue date Jun 17, 2008
    • Renesas Technology Corp.
    • Atsushi Kazama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-chip module
    • Patent number 7,038,322
    • Issue date May 2, 2006
    • Hitachi, Ltd.
    • Atsushi Kazama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device provided with rewiring layer
    • Patent number 6,927,489
    • Issue date Aug 9, 2005
    • Renesas Technology Corp.
    • Akihiro Yaguchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,919,622
    • Issue date Jul 19, 2005
    • Renesas Technology Corp.
    • Gen Murakami
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device and lead frame therefor
    • Patent number 6,844,219
    • Issue date Jan 18, 2005
    • Renesas Technology Corp.
    • Makoto Kitano
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Multi-chip module
    • Patent number 6,777,816
    • Issue date Aug 17, 2004
    • Hitachi, Ltd.
    • Atsushi Kazama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,720,208
    • Issue date Apr 13, 2004
    • Renesas Technology Corporation
    • Gen Murakami
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Multi-chip module
    • Patent number 6,696,765
    • Issue date Feb 24, 2004
    • Hitachi, Ltd.
    • Atsushi Kazama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device and mounted semiconductor device structure
    • Patent number 6,639,315
    • Issue date Oct 28, 2003
    • Hitachi, Ltd.
    • Atsushi Kazama
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor apparatus having stress cushioning layer
    • Patent number 6,621,154
    • Issue date Sep 16, 2003
    • Hitachi, Ltd.
    • Toshiya Satoh
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,531,760
    • Issue date Mar 11, 2003
    • Gen Murakami
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,512,176
    • Issue date Jan 28, 2003
    • Hitachi, Ltd.
    • Akihiro Yaguchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device and lead frame therefor
    • Patent number 6,465,876
    • Issue date Oct 15, 2002
    • Hitachi, Ltd.
    • Makoto Kitano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,452,256
    • Issue date Sep 17, 2002
    • Hitachi, Ltd.
    • Atsushi Kazama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Lead frame and semiconductor device
    • Patent number RE37690
    • Issue date May 7, 2002
    • Hitachi, Ltd.
    • Makoto Kitano
    • 257 - Active solid-state devices
  • Information Patent Grant

    Semiconductor apparatus and a manufacturing method thereof
    • Patent number 6,348,741
    • Issue date Feb 19, 2002
    • Hitachi, Ltd.
    • Masahiko Ogino
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,340,793
    • Issue date Jan 22, 2002
    • Hitachi, Ltd.
    • Akihiro Yaguchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,326,681
    • Issue date Dec 4, 2001
    • Hitachi, Ltd.
    • Gen Murakami
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,303,982
    • Issue date Oct 16, 2001
    • Hitachi, Ltd.
    • Gen Murakami
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,297,073
    • Issue date Oct 2, 2001
    • Hitachi, Ltd.
    • Makoto Kitano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    TSOP type semiconductor device
    • Patent number 6,232,653
    • Issue date May 15, 2001
    • Hitachi, Ltd.
    • Naotaka Tanaka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,204,552
    • Issue date Mar 20, 2001
    • Hitachi, Ltd.
    • Gen Murakami
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,130,112
    • Issue date Oct 10, 2000
    • Hitachi, Ltd.
    • Makoto Kitano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,130,114
    • Issue date Oct 10, 2000
    • Hitachi, Ltd.
    • Gen Murakami
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device including a resin sealing member which exposes...
    • Patent number 6,124,629
    • Issue date Sep 26, 2000
    • Hitachi, Ltd.
    • Gen Murakami
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,100,115
    • Issue date Aug 8, 2000
    • Hitachi, Ltd.
    • Gen Murakami
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device having all outer leads extending from one side...
    • Patent number 6,100,580
    • Issue date Aug 8, 2000
    • Hitachi, Ltd.
    • Gen Murakami
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,081,023
    • Issue date Jun 27, 2000
    • Hitachi, Ltd.
    • Gen Murakami
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,072,231
    • Issue date Jun 6, 2000
    • Hitachi, Ltd.
    • Gen Murakami
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Multi-chip module
    • Publication number 20060125116
    • Publication date Jun 15, 2006
    • Atsushi Kazama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method for manufacturing semiconductor device
    • Publication number 20050227384
    • Publication date Oct 13, 2005
    • Kouta Nagano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-chip module
    • Publication number 20050029674
    • Publication date Feb 10, 2005
    • Atsushi Kazama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor device
    • Publication number 20040155323
    • Publication date Aug 12, 2004
    • Gen Murakami
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTI-CHIP MODULE
    • Publication number 20040108579
    • Publication date Jun 10, 2004
    • Atsushi Kazama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor device and mounted semiconductor device structure
    • Publication number 20040087130
    • Publication date May 6, 2004
    • Atsushi Kazama
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Semiconductor device
    • Publication number 20030127712
    • Publication date Jul 10, 2003
    • Gen Murakami
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Multi-chip module
    • Publication number 20030094702
    • Publication date May 22, 2003
    • Atsushi Kazama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor device
    • Publication number 20020056561
    • Publication date May 16, 2002
    • Akihiro Yaguchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor device and mounted semiconductor device structure
    • Publication number 20020034872
    • Publication date Mar 21, 2002
    • Atsushi Kazama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor device
    • Publication number 20010008302
    • Publication date Jul 19, 2001
    • Gen Murakami
    • H01 - BASIC ELECTRIC ELEMENTS