Claims
- 1. A method of manufacturing a semiconductor device which has:
- a semiconductor chip having a main surface, and an integrated circuit and external terminals formed on said main surface;
- leads each having an inner lead and an outer lead which is continuous with said inner lead, each inner lead having a first portion which is disposed on said main surface;
- bonding wires electrically connecting the external terminals with the first portions of said the inner leads; and
- a resin member sealing said semiconductor chip, said inner leads and said bonding wires, said outer leads protruding outwardly from said resin member,
- the method comprising the steps of:
- (a) adhering said first portions of said inner leads to said main surface of said semiconductor chip by a first resin material;
- (b) electrically connecting said external terminals with said first portions of said leads by said bonding wires; and
- (c) after the steps (a) and (b), sealing said semiconductor chip, said inner leads, said first resin material and said bonding wires by a second resin material, thereby forming said resin member.
- 2. A method of manufacturing a semiconductor device according to claim 1, wherein said first resin material includes a thermoplastic resin, and wherein said second resin material includes a thermosetting resin.
- 3. A method of manufacturing a semiconductor device according to claim 2, wherein said thermosetting resin is a resin composite to which inorganic filler is added.
- 4. A method of manufacturing a semiconductor device according to claim 2, wherein said thermosetting resin is said resin composite with at least 70 wt. % of said inorganic filler.
- 5. A method of manufacturing a semiconductor device according to claim 4, wherein said inorganic filler is spherical particles having a particle size distribution of 0.1 to 100 microns, an average particle diameter of 5 to 20 microns, and a maximum packing density of at least 0.8.
- 6. A method of manufacturing a semiconductor device according to claim 1, wherein said first resin material includes a thermosetting resin, and wherein said second resin material includes a thermosetting resin which is a resin composite to which inorganic filler is added.
- 7. A method of manufacturing a semiconductor device according to claim 6, wherein said thermosetting resin of said second resin material is said resin composite with at least 70 wt. % of said inorganic filler.
- 8. A method of manufacturing a semiconductor device according to claim 7, wherein said inorganic filler is spherical particles having a particle size distribution of 0.1 to 100 microns, an average particle diameter of 5 to 20 microns, and a maximum packing density of at least 0.8.
- 9. A method of manufacturing a semiconductor device which has:
- a semiconductor chip having a main surface, and an integrated circuit and external terminals formed on said main surface;
- leads each having a first portion which is disposed on said main surface;
- bonding wires electrically connecting said external terminals with said first portions of said leads; and
- a resin member sealing said semiconductor chip, said first portions of said leads and said bonding wires,
- the method comprising the steps of:
- (a) adhering the first portions of said leads to said main surface of said semiconductor chip by a first resin material;
- (b) electrically connecting said external terminals with said first portions of said leads by said bonding wires; and
- (c) after the steps (a) and (b), sealing said semiconductor chip, said first portions of said leads, said first resin material and said bonding wires by a second resin material, thereby forming said resin member.
Priority Claims (2)
Number |
Date |
Country |
Kind |
63-236156 |
Sep 1988 |
JPX |
|
1-65844 |
Mar 1989 |
JPX |
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CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a divisional application of Ser. No. 08/790,985, filed Jan. 29, 1997, now U.S. Pat. No. 5,821,606 which is a divisional application of Ser. No. 08/464,131, filed Jun. 5, 1995, now U.S. Pat. No. 5,612,569, which is a continuation application of Ser. No. 08/293,555, filed Aug. 22, 1994, now U.S. Pat. No. 5,530,286, which is a divisional application of Ser. No. 07/990,272, filed Dec. 14, 1992, now U.S. Pat. No. 5,358,904, which is a divisional application of Ser. No. 07/915,861, filed Jul. 20, 1992, abandoned, which is a continuation application of Ser. No. 07/690,551, filed Apr. 24, 1991, abandoned, which is a continuation application of Ser. No. 07/409,332, filed Sep. 19, 1989 (now U.S. Pat. No. 5,068,712), the contents of which are incorporated herein by reference in their entirety.
US Referenced Citations (21)
Foreign Referenced Citations (7)
Number |
Date |
Country |
57-45961 |
Mar 1982 |
JPX |
59-43534 |
Mar 1984 |
JPX |
60-167454 |
Aug 1985 |
JPX |
60-208847 |
Oct 1985 |
JPX |
61-241959 |
Oct 1986 |
JPX |
63-44749 |
Feb 1988 |
JPX |
63-211744 |
Sep 1988 |
JPX |
Non-Patent Literature Citations (1)
Entry |
"Thin Small Outline Packages", IBM TDB, vol. 34, No. 1, Jun. 1991, pp. 358-359. |
Divisions (4)
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Number |
Date |
Country |
Parent |
790985 |
Jan 1997 |
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Parent |
464131 |
Jun 1995 |
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Parent |
990272 |
Dec 1992 |
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Parent |
915861 |
Jul 1992 |
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Continuations (3)
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Number |
Date |
Country |
Parent |
293555 |
Aug 1994 |
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Parent |
690551 |
Apr 1991 |
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Parent |
409332 |
Sep 1989 |
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