Akihisa Hongo

Person

Kanagawa-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing apparatus and substrate processing apparatus
- Patent number 7,862,402
- Issue date Jan 4, 2011
- Ebara Corporation
- Akihisa Hongo
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and substrate processing apparatus
- Patent number 7,682,225
- Issue date Mar 23, 2010
- Ebara Corporation
- Akihisa Hongo
- B24 - GRINDING POLISHING
Information Patent Grant
Plating apparatus
- Patent number 7,297,210
- Issue date Nov 20, 2007
- Ebara Corporation
- Akihisa Hongo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of managing a plating liquid used in a plating apparatus
- Patent number 7,172,683
- Issue date Feb 6, 2007
- Ebara Corporation
- Yasushi Isayama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate processing apparatus and method
- Patent number 7,172,979
- Issue date Feb 6, 2007
- Ebara Corporation
- Akihisa Hongo
- B08 - CLEANING
Information Patent Grant
Wafer cleaning apparatus
- Patent number 7,037,853
- Issue date May 2, 2006
- Ebara Corporation
- Akihisa Hongo
- B08 - CLEANING
Information Patent Grant
Substrate plating method and apparatus
- Patent number 7,033,463
- Issue date Apr 25, 2006
- Ebara Corporation
- Akihisa Hongo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate plating apparatus
- Patent number 6,929,722
- Issue date Aug 16, 2005
- Ebara Corporation
- Akihisa Hongo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Revolution member supporting apparatus and semiconductor substrate...
- Patent number 6,921,466
- Issue date Jul 26, 2005
- Ebara Corporation
- Akihisa Hongo
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate plating method and apparatus
- Patent number 6,908,534
- Issue date Jun 21, 2005
- Ebara Corporation
- Akihisa Hongo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for forming interconnects
- Patent number 6,811,658
- Issue date Nov 2, 2004
- Ebara Corporation
- Akihisa Hongo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate plating apparatus and method
- Patent number 6,793,794
- Issue date Sep 21, 2004
- Ebara Corporation
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of and apparatus for forming interconnection
- Patent number 6,730,596
- Issue date May 4, 2004
- Ebara Corporation
- Akira Fukunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless plating apparatus and method
- Patent number 6,716,330
- Issue date Apr 6, 2004
- Ebara Corporation
- Akihisa Hongo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of measuring the concentration of a leveler in a plating liquid
- Patent number 6,627,066
- Issue date Sep 30, 2003
- Ebara Corporation
- Yasushi Isayama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wafer cleaning apparatus
- Patent number 6,615,854
- Issue date Sep 9, 2003
- Ebara Corporation
- Akihisa Hongo
- B08 - CLEANING
Information Patent Grant
Substrate plating apparatus
- Patent number 6,582,580
- Issue date Jun 24, 2003
- Ebara Corporation
- Akihisa Hongo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plating substrate and plating facility
- Patent number 6,558,518
- Issue date May 6, 2003
- Ebara Corporation
- Satoshi Sendai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plating a substrate
- Patent number 6,544,585
- Issue date Apr 8, 2003
- Ebara Corporation
- Fumio Kuriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating device
- Patent number 6,517,689
- Issue date Feb 11, 2003
- Ebara Corporation
- Akihisa Hongo
- G01 - MEASURING TESTING
Information Patent Grant
Method for plating a first layer on a substrate and a second layer...
- Patent number 6,517,894
- Issue date Feb 11, 2003
- Ebara Corporation
- Akihisa Hongo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating apparatus for detecting the conductivity between plating co...
- Patent number 6,500,317
- Issue date Dec 31, 2002
- Ebara Corporation
- Junichiro Yoshioka
- G01 - MEASURING TESTING
Information Patent Grant
Substrate plating apparatus
- Patent number 6,495,004
- Issue date Dec 17, 2002
- Ebara Corporation
- Fumio Kuriyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Positive displacement type liquid-delivery apparatus
- Patent number 6,419,462
- Issue date Jul 16, 2002
- Ebara Corporation
- Kuniaki Horie
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Substrate plating device
- Patent number 6,365,017
- Issue date Apr 2, 2002
- Ebara Corporation
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate plating apparatus
- Patent number 6,294,059
- Issue date Sep 25, 2001
- Ebara Corporation
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Spin processing apparatus
- Patent number 6,269,548
- Issue date Aug 7, 2001
- Ebara Corporation
- Hiroyuki Shinozaki
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Liquid material vaporizer apparatus and gas ejection device
- Patent number 6,036,783
- Issue date Mar 14, 2000
- Ebara Corporation
- Yukio Fukunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vaporizer apparatus
- Patent number 5,862,605
- Issue date Jan 26, 1999
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reactant gas ejector head and thin-film vapor deposition apparatus
- Patent number 5,728,223
- Issue date Mar 17, 1998
- Ebara Corporation
- Takeshi Murakami
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
POLISHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20100136886
- Publication date Jun 3, 2010
- Akihisa Hongo
- B24 - GRINDING POLISHING
Information Patent Application
Polishing apparatus and substrate processing apparatus
- Publication number 20090117828
- Publication date May 7, 2009
- Akihisa Hongo
- B24 - GRINDING POLISHING
Information Patent Application
Revolution member supporting apparatus and semiconductor substrate...
- Publication number 20090026068
- Publication date Jan 29, 2009
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Revolution member supporting apparatus and semiconductor substrate...
- Publication number 20070113977
- Publication date May 24, 2007
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus for managing a plating liquid
- Publication number 20070102285
- Publication date May 10, 2007
- Yasushi Isayama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate plating method and apparatus
- Publication number 20060144714
- Publication date Jul 6, 2006
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate plating method and apparatus
- Publication number 20050098439
- Publication date May 12, 2005
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Revolution member supporting apparatus and semiconductor substrate...
- Publication number 20050087441
- Publication date Apr 28, 2005
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus
- Publication number 20040237896
- Publication date Dec 2, 2004
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate processing apparatus and method
- Publication number 20040231794
- Publication date Nov 25, 2004
- Akihisa Hongo
- B08 - CLEANING
Information Patent Application
Plating device and method
- Publication number 20040234696
- Publication date Nov 25, 2004
- Akihisa Hongo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate processing apparatus and substrate processing method
- Publication number 20040226654
- Publication date Nov 18, 2004
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for forming interconnects, and polishing liqui...
- Publication number 20040200728
- Publication date Oct 14, 2004
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus
- Publication number 20040194698
- Publication date Oct 7, 2004
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate plating apparatus
- Publication number 20040163947
- Publication date Aug 26, 2004
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroless plating apparatus and method
- Publication number 20040161529
- Publication date Aug 19, 2004
- Akihisa Hongo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Polishing liquid, polishing method and polishing apparatus
- Publication number 20040154931
- Publication date Aug 12, 2004
- Akihisa Hongo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of measuring the concentration of a leveler in a plating liq...
- Publication number 20040016644
- Publication date Jan 29, 2004
- Yasushi Isayama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Wafer cleaning apparatus
- Publication number 20040007559
- Publication date Jan 15, 2004
- Akihisa Hongo
- B08 - CLEANING
Information Patent Application
Method and apparatus for forming fine circuit interconnects
- Publication number 20030186540
- Publication date Oct 2, 2003
- Nobukazu Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate plating apparatus
- Publication number 20020139683
- Publication date Oct 3, 2002
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroless plating apparatus and method
- Publication number 20020127790
- Publication date Sep 12, 2002
- Akihisa Hongo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for forming interconnects, and polishing liqui...
- Publication number 20020088709
- Publication date Jul 11, 2002
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate plating method and apparatus
- Publication number 20020064591
- Publication date May 30, 2002
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Revolution member supporting apparatus and semiconductor substrate...
- Publication number 20020006876
- Publication date Jan 17, 2002
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate plating apparatus
- Publication number 20020005359
- Publication date Jan 17, 2002
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Akihisa Hongo

Person

Patents Grantslast 30 patents

Polishing apparatus and substrate processing apparatus

Polishing apparatus and substrate processing apparatus

Plating apparatus

Method of managing a plating liquid used in a plating apparatus

Substrate processing apparatus and method

Wafer cleaning apparatus

Substrate plating method and apparatus

Substrate plating apparatus

Revolution member supporting apparatus and semiconductor substrate...

Substrate plating method and apparatus

Apparatus for forming interconnects

Substrate plating apparatus and method

Method of and apparatus for forming interconnection

Electroless plating apparatus and method

Method of measuring the concentration of a leveler in a plating liquid

Wafer cleaning apparatus

Substrate plating apparatus

Method and apparatus for plating substrate and plating facility

Method and apparatus for plating a substrate

Plating device

Method for plating a first layer on a substrate and a second layer...

Plating apparatus for detecting the conductivity between plating co...

Substrate plating apparatus

Positive displacement type liquid-delivery apparatus

Substrate plating device

Substrate plating apparatus

Spin processing apparatus

Liquid material vaporizer apparatus and gas ejection device

Vaporizer apparatus

Reactant gas ejector head and thin-film vapor deposition apparatus

Patents Applicationslast 30 patents

POLISHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS

Polishing apparatus and substrate processing apparatus

Revolution member supporting apparatus and semiconductor substrate...

Revolution member supporting apparatus and semiconductor substrate...

Apparatus for managing a plating liquid

Substrate plating method and apparatus

Substrate plating method and apparatus

Revolution member supporting apparatus and semiconductor substrate...

Plating apparatus

Substrate processing apparatus and method

Plating device and method

Substrate processing apparatus and substrate processing method

Method and apparatus for forming interconnects, and polishing liqui...

Plating apparatus

Substrate plating apparatus

Electroless plating apparatus and method

Polishing liquid, polishing method and polishing apparatus

Method of measuring the concentration of a leveler in a plating liq...

Wafer cleaning apparatus

Method and apparatus for forming fine circuit interconnects

Substrate plating apparatus

Electroless plating apparatus and method

Method and apparatus for forming interconnects, and polishing liqui...

Substrate plating method and apparatus

Revolution member supporting apparatus and semiconductor substrate...

Substrate plating apparatus