Akio Hasebe

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,141,295
- Issue date Nov 27, 2018
- Renesas Electronics Corporation
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,825,017
- Issue date Nov 21, 2017
- Renesas Electronics Corporation
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,490,218
- Issue date Nov 8, 2016
- Renesas Electronics Corporation
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,230,938
- Issue date Jan 5, 2016
- Renesas Electronics Corporation
- Akio Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,053,954
- Issue date Jun 9, 2015
- Renesas Electronics Corporation
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,945,953
- Issue date Feb 3, 2015
- Renesas Electronics Corporation
- Akio Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor integrated circuit device
- Patent number 8,357,933
- Issue date Jan 22, 2013
- Renesas Electronics Corporation
- Akio Hasebe
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a semiconductor integrated circuit device a...
- Patent number 8,206,997
- Issue date Jun 26, 2012
- Renesas Electronics Corporation
- Akio Hasebe
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a semiconductor integrated circuit device a...
- Patent number 8,062,911
- Issue date Nov 22, 2011
- Renesas Electronics Corporation
- Akio Hasebe
- G01 - MEASURING TESTING
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,901,958
- Issue date Mar 8, 2011
- Renesas Electronics Corporation
- Masayoshi Okamoto
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of semiconductor integrated circuit device
- Patent number 7,776,626
- Issue date Aug 17, 2010
- Renesas Technology Corp.
- Akio Hasebe
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of semiconductor integrated circuit device
- Patent number 7,598,100
- Issue date Oct 6, 2009
- Renesas Technology Corp.
- Hideyuki Matsumoto
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a semiconductor integrated circuit device
- Patent number 7,537,943
- Issue date May 26, 2009
- Renesas Technology Corp.
- Akio Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor integrated circuit device
- Patent number 7,534,629
- Issue date May 19, 2009
- Renesas Technology Corp.
- Teruo Shoji
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of semiconductor integrated circuit device and...
- Patent number 7,517,707
- Issue date Apr 14, 2009
- Renesas Technology Corp.
- Masayoshi Okamoto
- G01 - MEASURING TESTING
Information Patent Grant
Probe sheet adhesion holder, probe card, semiconductor test device,...
- Patent number 7,423,439
- Issue date Sep 9, 2008
- Renesas Technology Corp.
- Susumu Kasukabe
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,420,284
- Issue date Sep 2, 2008
- Renesas Technology Corp.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor integrated circuit device
- Patent number 7,407,823
- Issue date Aug 5, 2008
- Renesas Technology Corp.
- Akio Hasebe
- G01 - MEASURING TESTING
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,351,597
- Issue date Apr 1, 2008
- Renesas Technology Corp.
- Yuji Wada
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of semiconductor integrated circuit device and...
- Patent number 7,271,015
- Issue date Sep 18, 2007
- Renesas Technology Corp.
- Masayoshi Okamoto
- G01 - MEASURING TESTING
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,235,413
- Issue date Jun 26, 2007
- Renesas Technology Corp.
- Akio Hasebe
- G01 - MEASURING TESTING
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,219,422
- Issue date May 22, 2007
- Renesas Technology Corp.
- Yuji Wada
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,091,620
- Issue date Aug 15, 2006
- Renesas Technology Corp.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe sheet, probe card, semiconductor test equipment and semicondu...
- Patent number 7,049,837
- Issue date May 23, 2006
- Renesas Technology Corp.
- Susumu Kasukabe
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 6,919,622
- Issue date Jul 19, 2005
- Renesas Technology Corp.
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Probing device and manufacturing method thereof, as well as testing...
- Patent number 6,900,646
- Issue date May 31, 2005
- Hitachi, Ltd.
- Susumu Kasukabe
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 6,720,208
- Issue date Apr 13, 2004
- Renesas Technology Corporation
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket for testing of semiconductor device, and semiconductor devic...
- Patent number 6,710,610
- Issue date Mar 23, 2004
- Hitachi, Ltd.
- Naotaka Tanaka
- G01 - MEASURING TESTING
Information Patent Grant
Fabrication method of semiconductor integrated circuit device and i...
- Patent number 6,696,849
- Issue date Feb 24, 2004
- Renesas Technology Corporation
- Naoto Ban
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,670,215
- Issue date Dec 30, 2003
- Renesas Technology Corporation
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180040598
- Publication date Feb 8, 2018
- Renesas Electronics Corporation
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170005080
- Publication date Jan 5, 2017
- RENESAS ELECTRONICS CORPORATION
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150243605
- Publication date Aug 27, 2015
- RENESAS ELECTRONICS CORPORATION
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150111317
- Publication date Apr 23, 2015
- Renesas Electronics Corporation
- Akio Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20140287541
- Publication date Sep 25, 2014
- RENESAS ELECTRONICS CORPORATION
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140179032
- Publication date Jun 26, 2014
- RENESAS ELECTRONICS CORPORATION
- Akio Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIR...
- Publication number 20110281380
- Publication date Nov 17, 2011
- Renesas Electronics Corporation
- Yasunori NARIZUKA
- G01 - MEASURING TESTING
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20110175634
- Publication date Jul 21, 2011
- Masayoshi Okamoto
- G01 - MEASURING TESTING
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20110136272
- Publication date Jun 9, 2011
- Masayoshi Okamoto
- G01 - MEASURING TESTING
Information Patent Application
THIN FILM PROBE SHEET AND SEMICONDUCTOR CHIP INSPECTION SYSTEM
- Publication number 20110014727
- Publication date Jan 20, 2011
- Akira Yabushita
- G01 - MEASURING TESTING
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20100304510
- Publication date Dec 2, 2010
- Masayoshi Okamoto
- G01 - MEASURING TESTING
Information Patent Application
THIN-FILM PROBE SHEET AND METHOD OF MANUFACTURING THE SAME, PROBE C...
- Publication number 20100301884
- Publication date Dec 2, 2010
- Etsuko Takane
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTORING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20100277192
- Publication date Nov 4, 2010
- Renesas Technology Corp.
- Akio HASEBE
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE A...
- Publication number 20100279502
- Publication date Nov 4, 2010
- RENESAS TECHNOLOGY CORP.
- Akio Hasebe
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20090130785
- Publication date May 21, 2009
- Hideyuki Matsumoto
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20090017565
- Publication date Jan 15, 2009
- Akio Hasebe
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE A...
- Publication number 20080160657
- Publication date Jul 3, 2008
- Akio Hasebe
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20080096295
- Publication date Apr 24, 2008
- Akio HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20080020498
- Publication date Jan 24, 2008
- Masayoshi Okamoto
- G01 - MEASURING TESTING
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20070218572
- Publication date Sep 20, 2007
- Yuji Wada
- G01 - MEASURING TESTING
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20070207559
- Publication date Sep 6, 2007
- Akio Hasebe
- G01 - MEASURING TESTING
Information Patent Application
Manufacturing method of semiconductor integrated circuit device and...
- Publication number 20070190671
- Publication date Aug 16, 2007
- Masayoshi Okamoto
- G01 - MEASURING TESTING
Information Patent Application
Probe sheet adhesion holder, probe card, semiconductor test device,...
- Publication number 20070103178
- Publication date May 10, 2007
- Susumu Kasukabe
- G01 - MEASURING TESTING
Information Patent Application
Manufacturing method of semiconductor integrated circuit device
- Publication number 20060286715
- Publication date Dec 21, 2006
- Akio Hasebe
- G01 - MEASURING TESTING
Information Patent Application
Manufacturing method of semiconductor integrated circuit device
- Publication number 20060281222
- Publication date Dec 14, 2006
- Teruo Shoji
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060261494
- Publication date Nov 23, 2006
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin film probe sheet and semiconductor chip inspection system
- Publication number 20060094162
- Publication date May 4, 2006
- Akira Yabushita
- G01 - MEASURING TESTING
Information Patent Application
Connecting apparatus, semiconductor chip inspecting apparatus, and...
- Publication number 20060043593
- Publication date Mar 2, 2006
- Terutaka Mori
- G01 - MEASURING TESTING
Information Patent Application
Manufacturing method of semiconductor integrated circuit device and...
- Publication number 20050227383
- Publication date Oct 13, 2005
- Masayoshi Okamoto
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device and manufacturing metthod thereof
- Publication number 20050212142
- Publication date Sep 29, 2005
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS

Akio Hasebe

Person

Patents Grantslast 30 patents

Method for manufacturing semiconductor device

Method for manufacturing semiconductor device

Method for manufacturing semiconductor device

Method of manufacturing semiconductor device

Method for manufacturing semiconductor device

Method of manufacturing semiconductor device

Manufacturing method of semiconductor integrated circuit device

Method of manufacturing a semiconductor integrated circuit device a...

Method of manufacturing a semiconductor integrated circuit device a...

Fabrication method of semiconductor integrated circuit device

Manufacturing method of semiconductor integrated circuit device

Manufacturing method of semiconductor integrated circuit device

Method of manufacturing a semiconductor integrated circuit device

Manufacturing method of semiconductor integrated circuit device

Manufacturing method of semiconductor integrated circuit device and...

Probe sheet adhesion holder, probe card, semiconductor test device,...

Semiconductor device and manufacturing method thereof

Manufacturing method of semiconductor integrated circuit device

Fabrication method of semiconductor integrated circuit device

Manufacturing method of semiconductor integrated circuit device and...

Fabrication method of semiconductor integrated circuit device

Fabrication method of semiconductor integrated circuit device

Semiconductor device and manufacturing method thereof

Probe sheet, probe card, semiconductor test equipment and semicondu...

Semiconductor device

Probing device and manufacturing method thereof, as well as testing...

Semiconductor device

Socket for testing of semiconductor device, and semiconductor devic...

Fabrication method of semiconductor integrated circuit device and i...

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBE CARD AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIR...

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

THIN FILM PROBE SHEET AND SEMICONDUCTOR CHIP INSPECTION SYSTEM

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

THIN-FILM PROBE SHEET AND METHOD OF MANUFACTURING THE SAME, PROBE C...

MANUFACTORING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE A...

MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE A...

METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Manufacturing method of semiconductor integrated circuit device and...

Probe sheet adhesion holder, probe card, semiconductor test device,...

Manufacturing method of semiconductor integrated circuit device

Manufacturing method of semiconductor integrated circuit device

Semiconductor device and manufacturing method thereof

Thin film probe sheet and semiconductor chip inspection system

Connecting apparatus, semiconductor chip inspecting apparatus, and...

Manufacturing method of semiconductor integrated circuit device and...

Semiconductor device and manufacturing metthod thereof