Akio Nishikawa

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin composition for encapsulating of semiconductor and semiconduc...
- Patent number 5,225,499
- Issue date Jul 6, 1993
- Hitachi, Ltd.
- Hiroyoshi Kokaku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polymer having dihydropyridine rings or dihydrotriazine rings, proc...
- Patent number 5,166,283
- Issue date Nov 24, 1992
- Hitachi Ltd.
- Akio Nishikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polymer from nitrile terminated compounds having Schiff bonds and p...
- Patent number 4,900,807
- Issue date Feb 13, 1990
- Hitachi, Ltd.
- Akio Nishikawa
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Resin encapsulated semiconductor device
- Patent number 4,758,875
- Issue date Jul 19, 1988
- Hitachi, Ltd.
- Koji Fujisaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SF.sub.6 Gas arc extinguishing electric apparatus and process for p...
- Patent number 4,562,322
- Issue date Dec 31, 1985
- Hitachi, Ltd.
- Motoo Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memories with .alpha. shield
- Patent number 4,494,217
- Issue date Jan 15, 1985
- Hitachi, Ltd.
- Hiroshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ether imides and process for producing the same
- Patent number 4,460,783
- Issue date Jul 17, 1984
- Hitachi, Ltd.
- Akio Nishikawa
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Maleimide: aryloxy diamine resin composition and process for produc...
- Patent number 4,435,560
- Issue date Mar 6, 1984
- Hitachi, Ltd.
- Akio Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Bismide-ether compounds, compositions thereof, and method of produc...
- Patent number 4,296,219
- Issue date Oct 20, 1981
- Hitachi, Ltd.
- Akio Takahashi
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Thermosetting resin composition comprising epoxy compound and react...
- Patent number 4,278,780
- Issue date Jul 14, 1981
- Hitachi, Ltd.
- Akio Nishikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Unsaturated polyester resin composition for use in pressure molding
- Patent number 4,211,686
- Issue date Jul 8, 1980
- Hitachi, Ltd.
- Akio Nishikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin compositions containing polyepoxides and uretdiones
- Patent number 4,138,372
- Issue date Feb 6, 1979
- Hitachi, Ltd.
- Akio Nishikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Dynamoelectric machine having coil windings and core encapsulated w...
- Patent number 4,128,527
- Issue date Dec 5, 1978
- Hitachi, Ltd.
- Noriyuki Kinjo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Akio Nishikawa

Person

Patents Grantslast 30 patents

Resin composition for encapsulating of semiconductor and semiconduc...

Polymer having dihydropyridine rings or dihydrotriazine rings, proc...

Polymer from nitrile terminated compounds having Schiff bonds and p...

Resin encapsulated semiconductor device

SF.sub.6 Gas arc extinguishing electric apparatus and process for p...

Semiconductor memories with .alpha. shield

Ether imides and process for producing the same

Maleimide: aryloxy diamine resin composition and process for produc...

Bismide-ether compounds, compositions thereof, and method of produc...

Thermosetting resin composition comprising epoxy compound and react...

Unsaturated polyester resin composition for use in pressure molding

Resin compositions containing polyepoxides and uretdiones

Dynamoelectric machine having coil windings and core encapsulated w...