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Akio Shimoyama
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Hiroshima, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
7,605,057
Issue date
Oct 20, 2009
Sharp Kabushiki Kaisha
Akio Shimoyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die bonding apparatus
Patent number
5,197,650
Issue date
Mar 30, 1993
Sharp Kabushiki Kaisha
Masahiko Monzen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for sealing a semiconductor package having frosted quartz...
Patent number
5,173,147
Issue date
Dec 22, 1992
Sharp Kabushiki Kaisha
Akio Shimoyama
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor device and manufacturing method thereof
Publication number
20080032485
Publication date
Feb 7, 2008
Sharp Kabushiki Kaisha
Akio Shimoyama
H01 - BASIC ELECTRIC ELEMENTS