Akira HARAO

Person

Makinohara-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and manufacturing method thereof
- Patent number 9,980,364
- Issue date May 22, 2018
- Yazaki Corporation
- Akira Harao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and manufacturing method thereof
- Patent number 9,888,558
- Issue date Feb 6, 2018
- Yazaki Corporation
- Akira Harao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and manufacturing method thereof
- Patent number 9,693,466
- Issue date Jun 27, 2017
- Yazaki Corporation
- Akira Harao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and manufacturing method thereof
- Patent number 9,480,142
- Issue date Oct 25, 2016
- Yazaki Corporation
- Akira Harao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse connection unit
- Patent number 8,770,991
- Issue date Jul 8, 2014
- Yazaki Corporation
- Akira Harao
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Metal core substrate
- Patent number 8,586,872
- Issue date Nov 19, 2013
- Yazaki Corporation
- Tomohiro Sugiura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20160205763
- Publication date Jul 14, 2016
- YAZAKI CORPORATION
- Akira HARAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140268581
- Publication date Sep 18, 2014
- YAZAKI CORPORATION
- Akira HARAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140262451
- Publication date Sep 18, 2014
- YAZAKI CORPORATION
- Akira HARAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120211266
- Publication date Aug 23, 2012
- YAZAKI CORPORATION
- Akira Harao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FUSE CONNECTION UNIT
- Publication number 20120202383
- Publication date Aug 9, 2012
- YAZAKI CORPORATION
- Akira Harao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CORE SUBSTRATE
- Publication number 20120090881
- Publication date Apr 19, 2012
- YAZAKI CORPORATION
- Tomohiro SUGIURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20110299250
- Publication date Dec 8, 2011
- YAZAKI CORPORATION
- Akira HARAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Akira HARAO

Person

Patents Grantslast 30 patents

Wiring substrate and manufacturing method thereof

Wiring substrate and manufacturing method thereof

Wiring board and manufacturing method thereof

Wiring substrate and manufacturing method thereof

Fuse connection unit

Metal core substrate

Patents Applicationslast 30 patents

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

WIRING BOARD AND MANUFACTURING METHOD THEREOF

FUSE CONNECTION UNIT

METAL CORE SUBSTRATE

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF