Akira Shintai

Person

Obu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Conductor composition, a mounting substrate and a mounting structur...
- Patent number 7,807,073
- Issue date Oct 5, 2010
- Denso Corporation
- Masashi Totokawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 7,772,025
- Issue date Aug 10, 2010
- Denso Corporation
- Osamu Arao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic package encapsulating electronic components therein
- Patent number 7,667,978
- Issue date Feb 23, 2010
- Denso Corporation
- Shinsuke Nagasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor composition, a mounting substrate and a mounting structur...
- Patent number 7,276,185
- Issue date Oct 2, 2007
- Denso Corporation
- Masashi Totokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor physical quantity sensor device having semiconductor...
- Patent number 5,948,991
- Issue date Sep 7, 1999
- Denso Corporation
- Hiroshi Nomura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Manufacturing method for a resin sealed semiconductor device
- Patent number 5,920,768
- Issue date Jul 6, 1999
- Denso Corporation
- Akira Shintai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition and cured product thereof
- Patent number 5,362,775
- Issue date Nov 8, 1994
- Nippondenso Co., Ltd.
- Akira Shintai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin-sealed semiconductor device
- Patent number 5,202,753
- Issue date Apr 13, 1993
- Nippondenso Co., Ltd.
- Akira Shintai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealed semiconductor device and a method for making the same
- Patent number 4,957,876
- Issue date Sep 18, 1990
- Nippondenso Co., Ltd.
- Hiroshi Shibata
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Resin sealed semiconductor device
- Patent number 4,899,209
- Issue date Feb 6, 1990
- Nippondenso Co., Ltd.
- Hiroshi Shibata
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
PRODUCTION METHOD FOR COMMUNICATION APPARATUS
- Publication number 20230291110
- Publication date Sep 14, 2023
- DENSO CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADAR DEVICE
- Publication number 20220285308
- Publication date Sep 8, 2022
- DENSO CORPORATION
- Shuji HIRATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADAR APPARATUS
- Publication number 20220132711
- Publication date Apr 28, 2022
- DENSO CORPORATION
- Yusuke TAINAKA
- G01 - MEASURING TESTING
Information Patent Application
RADAR APPARATUS
- Publication number 20220128650
- Publication date Apr 28, 2022
- DENSO CORPORATION
- Yusuke TAINAKA
- G01 - MEASURING TESTING
Information Patent Application
Electronic package encapsulating electronic components therein
- Publication number 20080130246
- Publication date Jun 5, 2008
- DENSO CORPORATION
- Shinsuke Nagasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device and method of manufacturing the same
- Publication number 20080081150
- Publication date Apr 3, 2008
- DENSO CORPORATION
- Osamu Arao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Conductor composition, a mounting substrate and a mounting structur...
- Publication number 20070224511
- Publication date Sep 27, 2007
- DENSO CORPORATION
- Masashi Totokawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Conductor composition, a mounting substrate and a mounting structur...
- Publication number 20050127536
- Publication date Jun 16, 2005
- Masashi Totokawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Akira Shintai

Person

Patents Grantslast 30 patents

Conductor composition, a mounting substrate and a mounting structur...

Electronic device and method of manufacturing the same

Electronic package encapsulating electronic components therein

Conductor composition, a mounting substrate and a mounting structur...

Semiconductor physical quantity sensor device having semiconductor...

Manufacturing method for a resin sealed semiconductor device

Epoxy resin composition and cured product thereof

Resin-sealed semiconductor device

Resin sealed semiconductor device and a method for making the same

Resin sealed semiconductor device

Patents Applicationslast 30 patents

PRODUCTION METHOD FOR COMMUNICATION APPARATUS

RADAR DEVICE

RADAR APPARATUS

RADAR APPARATUS

Electronic package encapsulating electronic components therein

Electronic device and method of manufacturing the same

Conductor composition, a mounting substrate and a mounting structur...

Conductor composition, a mounting substrate and a mounting structur...