Claims
- 1. A semiconductor sensor device comprising:
- a semiconductor sensor chip which detects a physical quantity and generates a signal corresponding thereto;
- a semiconductor circuit chip which processes said signal from said semiconductor sensor chip to generate a detection signal;
- a lead frame having a semiconductor sensor lead portion for said semiconductor sensor chip to be electrically connected and a semiconductor circuit lead portion for said semiconductor circuit chip to be mounted; and
- a resin block in which said semiconductor circuit chip mounted on and electrically connected with said semiconductor circuit lead portion is enclosed therein, said resin block having a sensor mount portion at which said semiconductor sensor lead portion is exposed, and said semiconductor sensor chip being mounted on said sensor mount portion and electrically connected with said semiconductor sensor lead portion exposed at said sensor mount portion,
- wherein said sensor mount portion is formed in a recessed shape so that said resin block surrounds a periphery of said sensor mount portion, and
- wherein a groove is formed on a rear face side of said resin block in correspondence with said sensor mount portion, said groove providing resistance to a flow of resin in molding said resin block.
- 2. A semiconductor sensor device according to claim 1, wherein said resin block is formed by using a thermosetting resin.
- 3. A semiconductor sensor device according to claim 1, wherein said groove has a portion which does not reach said semiconductor sensor lead portion.
- 4. A semiconductor sensor device according to claim 1, wherein said groove has a first portion which does not reach said semiconductor sensor lead portion and a second portion which reaches said semiconductor sensor lead portion.
- 5. A semiconductor sensor device according to claim 4, wherein a longitudinal direction of said first portion is approximately perpendicular to a direction of said flow of resin in molding said resin block.
- 6. A semiconductor sensor device according to claim 1, wherein said second portion is formed in a region where said first portion is formed.
- 7. A semiconductor pressure sensor device comprising:
- a semiconductor sensor chip which detects a pressure and generates a signal corresponding thereto;
- a semiconductor circuit chip which processes said signal from said semiconductor sensor chip to generate a detection signal;
- a lead frame having a semiconductor sensor lead portion for said semiconductor sensor chip to be electrically connected and a semiconductor circuit lead portion for said semiconductor circuit chip to be mounted; and
- a resin block in which said semiconductor circuit chip mounted on and electrically connected with said semiconductor circuit lead portion is enclosed therein, said resin block having a sensor mount portion at which said semiconductor sensor lead portion is exposed, and said semiconductor sensor chip being mounted on said sensor mount portion and electrically connected with said semiconductor sensor lead portion exposed at said sensor mount portion,
- wherein said sensor mount portion is formed in a recessed shape so that said resin block surrounds a periphery of said sensor mount portion, and
- wherein a groove is formed on a rear face side of said resin block in correspondence with said sensor mount portion, said groove providing resistance to a flow of resin in molding said resin block.
- 8. A semiconductor pressure sensor device according to claim 1, wherein said resin block is formed by using a thermosetting resin.
- 9. A semiconductor pressure sensor device according to claim 1, wherein said groove has a portion which does not reach said semiconductor sensor lead portion.
- 10. A semiconductor pressure sensor device according to claim 7, wherein said groove has a first portion which does not reach said semiconductor sensor lead portion and a second portion which reaches said semiconductor sensor lead portion.
- 11. A semiconductor pressure sensor device according to claim 10, wherein a longitudinal direction of said first portion is approximately perpendicular to a direction of said flow of resin in molding said resin block.
- 12. A semiconductor pressure sensor device according to claim 10, wherein said second portion is formed in a region where said first portion is formed.
Priority Claims (2)
Number |
Date |
Country |
Kind |
8-328794 |
Dec 1996 |
JPX |
|
8-329818 |
Dec 1996 |
JPX |
|
CROSS REFERENCE TO RELATED APPLICATION
This application is based upon and claims the benefit of priority of prior Japanese Patent Applications No. H.8-328794 filed on Dec. 9, 1996 and No. H. 8-329818 filed on Dec. 10, 1996, the contents of which are incorporated by reference.
US Referenced Citations (4)
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