Akira Takashima

Person

Aizuwakamatsu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 8,810,043
- Issue date Aug 19, 2014
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device suitable for a stacked structure
- Patent number 8,216,934
- Issue date Jul 10, 2012
- Fujitsu Semiconductor Limited
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,076,785
- Issue date Dec 13, 2011
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device suitable for a stacked structure
- Patent number 7,884,459
- Issue date Feb 8, 2011
- Fujitsu Semiconductor Limited
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deformable semiconductor device
- Patent number 7,138,723
- Issue date Nov 21, 2006
- Fujitsu Limited
- Kazuyuki Aiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 7,049,692
- Issue date May 23, 2006
- Fujitsu Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi chip package structure having a plurality of semiconductor ch...
- Patent number 6,972,487
- Issue date Dec 6, 2005
- Fujitsu Limited
- Yoshiharu Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,960,827
- Issue date Nov 1, 2005
- Fujitsu Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recognition method of a mark provided on a semiconductor device
- Patent number 6,869,819
- Issue date Mar 22, 2005
- Fujitsu Limited
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an interconnecting post formed on an in...
- Patent number 6,812,066
- Issue date Nov 2, 2004
- Fujitsu Limited
- Fumihiko Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,781,241
- Issue date Aug 24, 2004
- Fujitsu Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and method of producing the same
- Patent number 6,777,799
- Issue date Aug 17, 2004
- Fujitsu Limited
- Katsuhito Kikuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with stack of semiconductor chips
- Patent number 6,740,970
- Issue date May 25, 2004
- Fujitsu Limited
- Tetsuya Hiraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and method of producing the same
- Patent number 6,621,169
- Issue date Sep 16, 2003
- Fujitsu Limited
- Katsuhito Kikuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having protruding electrodes higher than a sea...
- Patent number 6,528,348
- Issue date Mar 4, 2003
- Fujitsu Limited
- Fumihiko Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an interconnecting post formed on an in...
- Patent number 6,489,676
- Issue date Dec 3, 2002
- Fujitsu Limited
- Fumihiko Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having bonding wires serving as external conne...
- Patent number 6,472,746
- Issue date Oct 29, 2002
- Fujitsu Limited
- Fumihiko Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a BGA-type semiconductor device having reliable e...
- Patent number 6,457,633
- Issue date Oct 1, 2002
- Fujitsu Limited
- Akira Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and structure and method for mounting the same
- Patent number 6,404,062
- Issue date Jun 11, 2002
- Fujitsu Limited
- Fumihiko Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having protruding electrodes higher than a sea...
- Patent number 6,388,333
- Issue date May 14, 2002
- Fujitsu Limited
- Fumihiko Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device having increased adhesion...
- Patent number 6,383,842
- Issue date May 7, 2002
- Fujitsu Limited
- Akira Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an external connection electrode extend...
- Patent number 6,281,571
- Issue date Aug 28, 2001
- Fujitsu Limited
- Akira Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded semiconductor device and method of manufacturing semic...
- Patent number 6,166,433
- Issue date Dec 26, 2000
- Fujitsu Limited
- Akira Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an insulating substrate
- Patent number 6,160,313
- Issue date Dec 12, 2000
- Fujitsu Limited
- Akira Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved heat dissipation efficiency
- Patent number 5,834,831
- Issue date Nov 10, 1998
- Fujitsu Limited
- Akihiro Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device in which semiconductor chip has bottom surface...
- Patent number 5,821,613
- Issue date Oct 13, 1998
- Fujitsu Limited
- Akira Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device unit for a stack arra...
- Patent number 5,801,439
- Issue date Sep 1, 1998
- Fujitsu Limited
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an inner lead extending over a central...
- Patent number 5,760,471
- Issue date Jun 2, 1998
- Fujitsu Limited
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a supporting lead to support a bypass l...
- Patent number 5,648,681
- Issue date Jul 15, 1997
- Fujitsu Limited
- Akira Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of ejecting an encapsulated semiconductor device from a mol...
- Patent number 5,447,888
- Issue date Sep 5, 1995
- Fujitsu Limited
- Akira Takashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
- Publication number 20140170814
- Publication date Jun 19, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Hayato OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
- Publication number 20120104606
- Publication date May 3, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Hayato OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110278723
- Publication date Nov 17, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE
- Publication number 20110092065
- Publication date Apr 21, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Eiji YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE
- Publication number 20090008798
- Publication date Jan 8, 2009
- Fujitsu Limited
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060289972
- Publication date Dec 28, 2006
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method for manufacturing the semiconductor de...
- Publication number 20060226529
- Publication date Oct 12, 2006
- FUJITSU LIMITED
- Yoshiharu Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, three-dimensional semiconductor device, and m...
- Publication number 20050167812
- Publication date Aug 4, 2005
- FUJITSU LIMITED
- Eiji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method for manufacturing the semiconductor de...
- Publication number 20050161794
- Publication date Jul 28, 2005
- FUJITSU LIMITED
- Yoshiharu Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20050082684
- Publication date Apr 21, 2005
- FUJITSU LIMITED
- Kazuyuki Aiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing methods thereof
- Publication number 20040188855
- Publication date Sep 30, 2004
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor device
- Publication number 20040178508
- Publication date Sep 16, 2004
- FUJITSU LIMITED
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked semiconductor device and method of producing the same
- Publication number 20040051119
- Publication date Mar 18, 2004
- FUJITSU LIMITED
- Katsuhito Kikuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recognition method of a mark provided on a semiconductor device
- Publication number 20030224540
- Publication date Dec 4, 2003
- FUJITSU LIMITED
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030197260
- Publication date Oct 23, 2003
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having an interconnecting post formed on an in...
- Publication number 20030042564
- Publication date Mar 6, 2003
- FUJITSU LIMITED
- Fumihiko Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with stack of semiconductor chips
- Publication number 20020171136
- Publication date Nov 21, 2002
- FUJITSU LIMITED
- Tetsuya Hiraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method for manufacturing the semiconductor de...
- Publication number 20020140107
- Publication date Oct 3, 2002
- FUJITSU LIMITED
- Yoshiharu Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having protruding electrodes higher than a sea...
- Publication number 20020074630
- Publication date Jun 20, 2002
- Fujitsu Limited
- Fumihiko Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having an interconnecting post formed on an in...
- Publication number 20020066952
- Publication date Jun 6, 2002
- FUJITSU LIMITED
- Fumihiko Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor device and method of producing the same
- Publication number 20020027295
- Publication date Mar 7, 2002
- FUJITSU LIMITED
- Katsuhito Kikuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having bonding wires serving as external conne...
- Publication number 20020017719
- Publication date Feb 14, 2002
- FUJITSU LIMITED
- Fumihiko Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS

Akira Takashima

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device suitable for a stacked structure

Semiconductor device

Semiconductor device suitable for a stacked structure

Deformable semiconductor device

Stacked semiconductor device

Multi chip package structure having a plurality of semiconductor ch...

Semiconductor device and manufacturing method thereof

Recognition method of a mark provided on a semiconductor device

Semiconductor device having an interconnecting post formed on an in...

Semiconductor device and manufacturing method thereof

Stacked semiconductor device and method of producing the same

Semiconductor device with stack of semiconductor chips

Stacked semiconductor device and method of producing the same

Semiconductor device having protruding electrodes higher than a sea...

Semiconductor device having an interconnecting post formed on an in...

Semiconductor device having bonding wires serving as external conne...

Method of forming a BGA-type semiconductor device having reliable e...

Semiconductor device and structure and method for mounting the same

Semiconductor device having protruding electrodes higher than a sea...

Method for producing semiconductor device having increased adhesion...

Semiconductor device having an external connection electrode extend...

Resin molded semiconductor device and method of manufacturing semic...

Semiconductor device having an insulating substrate

Semiconductor device with improved heat dissipation efficiency

Semiconductor device in which semiconductor chip has bottom surface...

Semiconductor device and semiconductor device unit for a stack arra...

Semiconductor device having an inner lead extending over a central...

Semiconductor device having a supporting lead to support a bypass l...

Process of ejecting an encapsulated semiconductor device from a mol...

Patents Applicationslast 30 patents

BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE

SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE

Semiconductor device

Semiconductor device, method for manufacturing the semiconductor de...

Semiconductor device, three-dimensional semiconductor device, and m...

Semiconductor device, method for manufacturing the semiconductor de...

Semiconductor device and method for manufacturing the same

Semiconductor device and manufacturing methods thereof

Stacked semiconductor device

Stacked semiconductor device and method of producing the same

Recognition method of a mark provided on a semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device having an interconnecting post formed on an in...

Semiconductor device with stack of semiconductor chips

Semiconductor device, method for manufacturing the semiconductor de...

Semiconductor device having protruding electrodes higher than a sea...

Semiconductor device having an interconnecting post formed on an in...

Stacked semiconductor device and method of producing the same

Semiconductor device having bonding wires serving as external conne...