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Prepreg for printed circuit board
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Patent number 5,965,245
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Issue date Oct 12, 1999
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Hitachi Chemical Company, Ltd.
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Norio Okano
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Chemical reducing solution for copper oxide
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Patent number 5,736,065
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Issue date Apr 7, 1998
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Hitachi Chemical Company, Ltd.
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Akishi Nakaso
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C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
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Electroless plating process
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Patent number 5,206,052
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Issue date Apr 27, 1993
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Hitachi Chemical Company, Ltd.
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Akishi Nakaso
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Process for treating copper surface
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Patent number 4,902,551
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Issue date Feb 20, 1990
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Hitachi Chemical Company, Ltd.
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Akishi Nakaso
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Process for treating metal surface
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Patent number 4,643,793
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Issue date Feb 17, 1987
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Hitachi Chemical Company, Ltd.
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Akishi Nakaso
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Electroless copper plating solution
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Patent number 4,557,762
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Issue date Dec 10, 1985
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Hitachi Chemical Company
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Akishi Nakaso
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Electroless copper deposition solution
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Patent number 4,548,644
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Issue date Oct 22, 1985
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Hitachi Chemical Company, Ltd.
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Akishi Nakaso
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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