Claims
- 1. An aqueous solution for activation accelerating treatment prior to electroless plating consisting of water, sulfuric acid in a concentration of 0.01 to 5 mole/liter and cupric chloride in a concentration of 0.00003 to 0.03 mole/liter.
- 2. An aqueous solution for activation accelerating treatment prior to electroless plating comprising sulfuric acid in a concentration of 0.01 to 5 mole/liter, cupric chloride in a concentration of 0.00003 to 0.03 mole/liter and an organic acid in a concentration of 5 mole/liter or less.
- 3. An aqueous solution according to claim 2, wherein the organic acid is at least one member selected from the group consisting of citric acid, glyceric acid, malonic acid, malic acid, glycolic acid, lactic acid, tartaric acid, and adipic acid.
Priority Claims (1)
Number |
Date |
Country |
Kind |
1-115834 |
May 1989 |
JPX |
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Parent Case Info
This application is a divisional application of application Ser. No. 518,500, filed May 2, 1990, now U.S. Pat. No. 5,206,052.
US Referenced Citations (10)
Foreign Referenced Citations (4)
Number |
Date |
Country |
0139233 |
May 1985 |
EPX |
050690 |
Apr 1980 |
JPX |
8500387 |
Jan 1985 |
WOX |
488484 |
Apr 1983 |
SUX |
Non-Patent Literature Citations (1)
Entry |
Grant & Hackh's Chemical Dictionary, 5th Ed. 1988, p. 563. |
Divisions (1)
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Number |
Date |
Country |
Parent |
518500 |
May 1990 |
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