AKITO YOSHIDA

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KANAGAWA-KEN, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with flip-chip structure and method of manufac...
- Patent number 6,445,001
- Issue date Sep 3, 2002
- Kabushiki Kaisha Toshiba
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealed semiconductor device including a die pad uniformly hav...
- Patent number 6,326,243
- Issue date Dec 4, 2001
- Kabushiki Kaisha Toshiba
- Nobuhito Suzuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealed semiconductor device including a die pad uniformly hav...
- Patent number 5,753,969
- Issue date May 19, 1998
- Kabushiki Kaisha Toshiba
- Nobuhito Suzuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,329,068
- Issue date Jul 12, 1994
- Kabushiki Kaisha Toshiba
- Seiichi Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an opening and method of manufacturing...
- Patent number 5,291,374
- Issue date Mar 1, 1994
- Kabushiki Kaisha Toshiba
- Seiichi Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier having improved test pads
- Patent number 5,157,476
- Issue date Oct 20, 1992
- Kabushiki Kaisha Toshiba
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH FLIP-CHIP STRUCTURE AND METHOD OF MANUFAC...
- Publication number 20010011771
- Publication date Aug 9, 2001
- Kabushiki Kaisha Toshiba
- AKITO YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS