Number | Date | Country | Kind |
---|---|---|---|
8-171664 | Jun 1996 | JP |
Number | Name | Date | Kind |
---|---|---|---|
4144493 | Lee et al. | Mar 1979 | A |
4243937 | Multani et al. | Jan 1981 | A |
4254445 | Ho | Mar 1981 | A |
4413271 | Gontowski, Jr. et al. | Nov 1983 | A |
4951098 | Albergo et al. | Aug 1990 | A |
5157476 | Yoshida | Oct 1992 | A |
5249728 | Lam | Oct 1993 | A |
5367763 | Lam | Nov 1994 | A |
5418186 | Park et al. | May 1995 | A |
5466956 | Aeba | Nov 1995 | A |
5475236 | Yoshizaki | Dec 1995 | A |
5517127 | Bergeron et al. | May 1996 | A |
5532614 | Chiu | Jul 1996 | A |
5633210 | Yang et al. | May 1997 | A |
5646422 | Hashizume | Jul 1997 | A |
5684304 | Smears | Nov 1997 | A |
5719449 | Strauss | Feb 1998 | A |
5838023 | Goel et al. | Nov 1998 | A |
5891745 | Dunaway et al. | Apr 1999 | A |
5973376 | Rostoker et al. | Oct 1999 | A |
6204074 | Bertolet et al. | Mar 2002 | B1 |
6369407 | Hikita et al. | Apr 2002 | B1 |
Number | Date | Country |
---|---|---|
0660386 | Jun 1995 | EP |
52-30381 | Mar 1977 | JP |
58-15251 | Jan 1983 | JP |
2-184043 | Jul 1990 | JP |
3-82129 | Apr 1991 | JP |
Entry |
---|
“Protecting Si Wafers Against Damage During Testing” IBM Technical Disclosure Bulletin vol. 32, No. 4A, Sep. 1989, p. 121. |
“Semiconductor Chip I/O Configuration for Plastic Flat Pack, Tape Automated Bonding, or Solder Ball Joined Flip Chip Packages” IBM Technical Disclosure Bulletin vol. 33, No. 10B, Mar. 1991, pp. 332-33. |