Akiyoshi Yamamoto

Person

Ibaraki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 8,643,194
- Issue date Feb 4, 2014
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive sheet for processing semiconductor substrates
- Patent number 7,943,235
- Issue date May 17, 2011
- Nitto Denko Corporation
- Akiyoshi Yamamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING WATER-SOLUBLE POLYMER, METHOD FOR PRODUCING WA...
- Publication number 20240336760
- Publication date Oct 10, 2024
- NITTO DENKO CORPORATION
- Yosuke Yamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE TAPE PROCESSING METHOD AND PRESSURE-SEN...
- Publication number 20240191103
- Publication date Jun 13, 2024
- NITTO DENKO CORPORATION
- Yosuke Yamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LAMINATED SHEET PROCESSING METHOD AND LAMINATED SHEET PROCESSING DE...
- Publication number 20240173957
- Publication date May 30, 2024
- NITTO DENKO CORPORATION
- Akiyoshi Yamamoto
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
ADHESIVE TREATMENT LIQUID, AND METHOD FOR TREATING ADHESIVE
- Publication number 20230242732
- Publication date Aug 3, 2023
- NITTO DENKO CORPORATION
- Akiyoshi Yamamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF PRODUCING ELECTRONIC COMPONENT
- Publication number 20120291944
- Publication date Nov 22, 2012
- NITTO DENKO CORPORATION
- Yuki Higashibeppu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTING SEMICONDUCTOR WAFER
- Publication number 20120058319
- Publication date Mar 8, 2012
- Nitto Denko Corporation
- Akiyoshi YAMAMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE
- Publication number 20110254176
- Publication date Oct 20, 2011
- Nitto Denko Corporation
- Naohide TAKAMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE TAPE OR SHEET
- Publication number 20110151252
- Publication date Jun 23, 2011
- NITTO DENKO CORPORATION
- Toshio Shintani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES
- Publication number 20100028662
- Publication date Feb 4, 2010
- Nitto Denko Corporation
- Toshio Shintani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF GRINDING BACK SIDE OF SEMICONDUCTOR WAFER AND ADHESIVE SH...
- Publication number 20090314417
- Publication date Dec 24, 2009
- Nitto Denko Corporation
- Takatoshi SASAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE SHEET FOR WATER JET LASER DICING
- Publication number 20090311474
- Publication date Dec 17, 2009
- Tomokazu Takahashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES
- Publication number 20080261038
- Publication date Oct 23, 2008
- Nitto Denko Corporation
- Akiyoshi Yamamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE SHEET FOR WATER JET LASER DICING
- Publication number 20080182095
- Publication date Jul 31, 2008
- Nitto Denko Corporation
- Fumiteru Asai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFERS AND/OR SUBSTRATES
- Publication number 20080118764
- Publication date May 22, 2008
- Nitto Denko Corporation
- Toshio SHINTANI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET FOR WATER JET LASER DICING
- Publication number 20080108262
- Publication date May 8, 2008
- Nitto Denko Corporation
- Fumiteru Asai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive sheet for laser processing
- Publication number 20080085397
- Publication date Apr 10, 2008
- Nitto Denko Corporation
- Fumiteru Asai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive sheet for laser processing
- Publication number 20080057306
- Publication date Mar 6, 2008
- Nitto Denko Corporation
- Takatoshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive sheet for water jet laser dicing
- Publication number 20080057253
- Publication date Mar 6, 2008
- Nitto Denko Corporation
- Takatoshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive sheet for water jet laser dicing
- Publication number 20080057270
- Publication date Mar 6, 2008
- Nitto Denko Corporation
- Tsubasa Miki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Akiyoshi Yamamoto

Person

Patents Grantslast 30 patents

Dicing tape-integrated film for semiconductor back surface

Adhesive sheet for processing semiconductor substrates

Patents Applicationslast 30 patents

METHOD FOR PRODUCING WATER-SOLUBLE POLYMER, METHOD FOR PRODUCING WA...

PRESSURE-SENSITIVE ADHESIVE TAPE PROCESSING METHOD AND PRESSURE-SEN...

LAMINATED SHEET PROCESSING METHOD AND LAMINATED SHEET PROCESSING DE...

ADHESIVE TREATMENT LIQUID, AND METHOD FOR TREATING ADHESIVE

METHOD OF PRODUCING ELECTRONIC COMPONENT

PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTING SEMICONDUCTOR WAFER

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE

ADHESIVE TAPE OR SHEET

ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES

METHOD OF GRINDING BACK SIDE OF SEMICONDUCTOR WAFER AND ADHESIVE SH...

ADHESIVE SHEET FOR WATER JET LASER DICING

ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES

ADHESIVE SHEET FOR WATER JET LASER DICING

ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFERS AND/OR SUBSTRATES

ADHESIVE SHEET FOR WATER JET LASER DICING

Adhesive sheet for laser processing

Adhesive sheet for laser processing

Adhesive sheet for water jet laser dicing

Adhesive sheet for water jet laser dicing