Alan Cuthbertson

Person

Matfen, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating conducting plates for a high-Q MIM capacitor
- Patent number 8,022,548
- Issue date Sep 20, 2011
- Atmel Corporation
- Isaiah O. Oladeji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a thick copper line and copper inductor resu...
- Patent number 7,776,705
- Issue date Aug 17, 2010
- Atmel Corporation
- Isaiah O. Oladeji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating conducting plates for a high-Q MIM capacitor
- Patent number 7,601,604
- Issue date Oct 13, 2009
- Atmel Corporation
- Isaiah O. Oladeji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to fabricate aligned dual damascene openings
- Patent number 7,372,156
- Issue date May 13, 2008
- Chartered Semiconductor Manufacturing Ltd.
- Yeow Kheng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a bond pad structure
- Patent number 7,276,797
- Issue date Oct 2, 2007
- Chartered Semiconductor Manufacturing Ltd.
- Zhang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a bond pad structure
- Patent number 6,998,335
- Issue date Feb 14, 2006
- Chartered Semiconductor Manufacturing, Ltd.
- Zhang Fan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING CONDUCTING PLATES FOR A HIGH-Q MIM CAPACITOR
- Publication number 20100019349
- Publication date Jan 28, 2010
- ATMEL CORPORATION
- Isaiah O. Oladeji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating conducting plates for a high-Q MIM capacitor
- Publication number 20080089007
- Publication date Apr 17, 2008
- ATMEL CORPORATION
- Isaiah O. Oladeji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A THICK COPPER LINE AND COPPER INDUCTOR RESU...
- Publication number 20080057658
- Publication date Mar 6, 2008
- ATMEL CORPORATION
- Isaiah O. Oladeji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND COMPOSITIONS FOR WET ETCHING
- Publication number 20080041813
- Publication date Feb 21, 2008
- ATMEL CORPORATION
- Isaiah Olatunde Oladeji
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Structure and method for fabricating a bond pad structure
- Publication number 20060071350
- Publication date Apr 6, 2006
- Zhang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to fabricate aligned dual damacene openings
- Publication number 20060003573
- Publication date Jan 5, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Yeow Kheng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for fabricating a bond pad structure
- Publication number 20050127530
- Publication date Jun 16, 2005
- Zhang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to fabricate aligned dual damascene openings
- Publication number 20050090095
- Publication date Apr 28, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Yeow Kheng Lim
- H01 - BASIC ELECTRIC ELEMENTS

Alan Cuthbertson

Person

Patents Grantslast 30 patents

Method for fabricating conducting plates for a high-Q MIM capacitor

Method for fabricating a thick copper line and copper inductor resu...

Method for fabricating conducting plates for a high-Q MIM capacitor

Method to fabricate aligned dual damascene openings

Structure and method for fabricating a bond pad structure

Structure and method for fabricating a bond pad structure

Patents Applicationslast 30 patents

METHOD FOR FABRICATING CONDUCTING PLATES FOR A HIGH-Q MIM CAPACITOR

Method for fabricating conducting plates for a high-Q MIM capacitor

METHOD FOR FABRICATING A THICK COPPER LINE AND COPPER INDUCTOR RESU...

METHODS AND COMPOSITIONS FOR WET ETCHING

Structure and method for fabricating a bond pad structure

Method to fabricate aligned dual damacene openings

Structure and method for fabricating a bond pad structure

Method to fabricate aligned dual damascene openings