Aleksandar Aleksov

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hermetic sealing structures in microelectronic assemblies having di...
- Patent number 12,165,962
- Issue date Dec 10, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency antennas and waveguides for communication between i...
- Patent number 12,165,994
- Issue date Dec 10, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with mold patterning to create pac...
- Patent number 12,155,133
- Issue date Nov 26, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-filter die
- Patent number 12,155,372
- Issue date Nov 26, 2024
- Intel Corporation
- Georgios Dogiamis
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 12,150,271
- Issue date Nov 19, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for microelectronic assemblies having direct bonding
- Patent number 12,142,510
- Issue date Nov 12, 2024
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,136,596
- Issue date Nov 5, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic sealing structures in microelectronic assemblies having di...
- Patent number 12,119,291
- Issue date Oct 15, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with inductors in direct bonding regions
- Patent number 12,107,060
- Issue date Oct 1, 2024
- Intel Corproation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with inductors in direct bonding regions
- Patent number 12,062,631
- Issue date Aug 13, 2024
- Intel Corporation
- Adel A Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonding in microelectronic assemblies
- Patent number 12,057,402
- Issue date Aug 6, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated radio frequency (RF) front-end module (FEM)
- Patent number 12,040,776
- Issue date Jul 16, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive route patterning for electronic substrates
- Patent number 12,027,466
- Issue date Jul 2, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,007,170
- Issue date Jun 11, 2024
- Intel Corporation
- Feras Eid
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
High performance integrated RF passives using dual lithography process
- Patent number 12,002,745
- Issue date Jun 4, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonding in microelectronic assemblies
- Patent number 11,990,448
- Issue date May 21, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,942,334
- Issue date Mar 26, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finishes with low RBTV for fine and mixed bump pitch archit...
- Patent number 11,935,857
- Issue date Mar 19, 2024
- Intel Corporation
- Kristof Darmawaikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with high density interconnects
- Patent number 11,908,802
- Issue date Feb 20, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-package RF waveguides as high bandwidth chip-to-chip interconnec...
- Patent number 11,894,324
- Issue date Feb 6, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,876,053
- Issue date Jan 16, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package supports
- Patent number 11,854,834
- Issue date Dec 26, 2023
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with variable height conductive and dielectric elements
- Patent number 11,837,534
- Issue date Dec 5, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a modular side radiating waveguide...
- Patent number 11,830,831
- Issue date Nov 28, 2023
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 11,830,787
- Issue date Nov 28, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,824,008
- Issue date Nov 21, 2023
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated thin film capacitors using amorphous high-k di...
- Patent number 11,804,455
- Issue date Oct 31, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loss and low cross talk transmission lines with stacked dielect...
- Patent number 11,791,528
- Issue date Oct 17, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 11,784,108
- Issue date Oct 10, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS
- Publication number 20240355768
- Publication date Oct 24, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES
- Publication number 20240339410
- Publication date Oct 10, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES
- Publication number 20240274576
- Publication date Aug 15, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...
- Publication number 20240266745
- Publication date Aug 8, 2024
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS
- Publication number 20240222018
- Publication date Jul 4, 2024
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER ST...
- Publication number 20240178162
- Publication date May 30, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPLESS HYBRID ORGANIC GLASS INTERPOSER
- Publication number 20240162157
- Publication date May 16, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...
- Publication number 20240113005
- Publication date Apr 4, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20240071777
- Publication date Feb 29, 2024
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES
- Publication number 20240063072
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240038671
- Publication date Feb 1, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20240030150
- Publication date Jan 25, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240030098
- Publication date Jan 25, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DI...
- Publication number 20240014149
- Publication date Jan 11, 2024
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT VIA-PAD AND VIA-PLANE STRUCTURES
- Publication number 20240006292
- Publication date Jan 4, 2024
- Intel Corporation
- Veronica Aleman Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH MULTI-LAYERED METALLIZATION LINES
- Publication number 20240006327
- Publication date Jan 4, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20230395518
- Publication date Dec 7, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...
- Publication number 20230344131
- Publication date Oct 26, 2023
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATFORMS INCLUDING MICROELECTRONIC PACKAGES THEREIN COUPLED TO A C...
- Publication number 20230320021
- Publication date Oct 5, 2023
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...
- Publication number 20230246338
- Publication date Aug 3, 2023
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR WITH INTEGRATED MAGNETICS
- Publication number 20230207493
- Publication date Jun 29, 2023
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATE-UP HYBRID STRUCTURES USING MODIFIED GLASS PATTERNING PROCESSES
- Publication number 20230207407
- Publication date Jun 29, 2023
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL INDUCTOR WITH PLATED HIGH RESISTIVITY AND HIGH PERMEABILITY...
- Publication number 20230207492
- Publication date Jun 29, 2023
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCE...
- Publication number 20230207408
- Publication date Jun 29, 2023
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D ARRAYED GLASS-BASED MMWAVE AND THZ STRUCTURES
- Publication number 20230208010
- Publication date Jun 29, 2023
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL INDUCTORS FABRICATED THROUGH A DRILL-LESS VIA PROCESS
- Publication number 20230207404
- Publication date Jun 29, 2023
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDEBAND ANTENNAS IN GLASS THROUGH DIRECT VIA FEEDING AND GLASS STA...
- Publication number 20230208009
- Publication date Jun 29, 2023
- Neelam PRABHU GAUNKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BATTERIES WITHIN GLASS CORES OF PACKAGE SUBSTRATES
- Publication number 20230198058
- Publication date Jun 22, 2023
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY COUPLED TRENCH CAPACITORS WITHIN A SUBSTRATE
- Publication number 20230197770
- Publication date Jun 22, 2023
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS VIAS AND PLANES WITH REDUCED TAPERING
- Publication number 20230197541
- Publication date Jun 22, 2023
- Intel Corporation
- Veronica STRONG
- H01 - BASIC ELECTRIC ELEMENTS

Aleksandar Aleksov

Person

Patents Grantslast 30 patents

Hermetic sealing structures in microelectronic assemblies having di...

Radio frequency antennas and waveguides for communication between i...

Microelectronic devices designed with mold patterning to create pac...

Multi-filter die

Platforms including microelectronic packages therein coupled to a c...

Carrier for microelectronic assemblies having direct bonding

Microelectronic assemblies

Hermetic sealing structures in microelectronic assemblies having di...

Multi-chip package and method of providing die-to-die interconnects...

Microelectronic assemblies with inductors in direct bonding regions

Microelectronic assemblies with inductors in direct bonding regions

Direct bonding in microelectronic assemblies

Integrated radio frequency (RF) front-end module (FEM)

Conductive route patterning for electronic substrates

Thermal management in integrated circuit packages

High performance integrated RF passives using dual lithography process

Direct bonding in microelectronic assemblies

Microelectronic assemblies having conductive structures with differ...

Surface finishes with low RBTV for fine and mixed bump pitch archit...

Multi-chip package with high density interconnects

In-package RF waveguides as high bandwidth chip-to-chip interconnec...

Multi-chip package and method of providing die-to-die interconnects...

Integrated circuit package supports

Substrate with variable height conductive and dielectric elements

Semiconductor package including a modular side radiating waveguide...

Thermal management in integrated circuit packages

Multi-chip package and method of providing die-to-die interconnects...

Substrate integrated thin film capacitors using amorphous high-k di...

Low loss and low cross talk transmission lines with stacked dielect...

Thermal management in integrated circuit packages

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS

DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES

DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES

MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...

SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS

INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER ST...

BUMPLESS HYBRID ORGANIC GLASS INTERPOSER

HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...

INTEGRATED CIRCUIT PACKAGE SUPPORTS

LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

MICROELECTRONIC ASSEMBLIES

THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES

SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DI...

ALIGNMENT VIA-PAD AND VIA-PLANE STRUCTURES

INTEGRATED CIRCUIT PACKAGE WITH MULTI-LAYERED METALLIZATION LINES

MICROELECTRONIC ASSEMBLIES

MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...

PLATFORMS INCLUDING MICROELECTRONIC PACKAGES THEREIN COUPLED TO A C...

MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...

INDUCTOR WITH INTEGRATED MAGNETICS

PLATE-UP HYBRID STRUCTURES USING MODIFIED GLASS PATTERNING PROCESSES

COAXIAL INDUCTOR WITH PLATED HIGH RESISTIVITY AND HIGH PERMEABILITY...

SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCE...

3D ARRAYED GLASS-BASED MMWAVE AND THZ STRUCTURES

COAXIAL INDUCTORS FABRICATED THROUGH A DRILL-LESS VIA PROCESS

WIDEBAND ANTENNAS IN GLASS THROUGH DIRECT VIA FEEDING AND GLASS STA...

EMBEDDED BATTERIES WITHIN GLASS CORES OF PACKAGE SUBSTRATES

ELECTRICALLY COUPLED TRENCH CAPACITORS WITHIN A SUBSTRATE

GLASS VIAS AND PLANES WITH REDUCED TAPERING