Aleksander A. Owczarz

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 9,287,110
- Issue date Mar 15, 2016
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Controlled ambient system for interface engineering
- Patent number 9,117,860
- Issue date Aug 25, 2015
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid handling system for wafer electroless plating and associated...
- Patent number 8,844,461
- Issue date Sep 30, 2014
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for cleaning semiconductor wafers using compre...
- Patent number 8,535,451
- Issue date Sep 17, 2013
- Lam Research Corporation
- John M. de Larios
- B08 - CLEANING
Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 8,485,120
- Issue date Jul 16, 2013
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer electroless plating system and associated methods
- Patent number 8,314,027
- Issue date Nov 20, 2012
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer electroless plating system and associated methods
- Patent number 8,069,813
- Issue date Dec 6, 2011
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate gripper with integrated electrical contacts
- Patent number 7,780,825
- Issue date Aug 24, 2010
- Lam Research Corporation
- Aleksander Owczarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for applying a plating solution for electroless deposition
- Patent number 7,752,996
- Issue date Jul 13, 2010
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatuses and methods for cleaning a substrate
- Patent number 7,625,452
- Issue date Dec 1, 2009
- Lam Research Corporation
- John M. de Larios
- B08 - CLEANING
Information Patent Grant
Method and apparatus for cleaning semiconductor wafers using compre...
- Patent number 7,568,490
- Issue date Aug 4, 2009
- Lam Research Corporation
- John M. de Larios
- B08 - CLEANING
Information Patent Grant
System, method and apparatus for in-situ substrate inspection
- Patent number 7,542,134
- Issue date Jun 2, 2009
- Lam Research Corporation
- Aleksander Owczarz
- G01 - MEASURING TESTING
Information Patent Grant
Apparatuses and methods for cleaning a substrate
- Patent number 7,441,299
- Issue date Oct 28, 2008
- Lam Research Corporation
- John M. de Larios
- B08 - CLEANING
Information Patent Grant
System, method and apparatus for in-situ substrate inspection
- Patent number 7,397,555
- Issue date Jul 8, 2008
- Lam Research Corporation
- Aleksander Owczarz
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for real time metal film thickness measurement
- Patent number 7,309,618
- Issue date Dec 18, 2007
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus of arrayed, clustered or coupled eddy current...
- Patent number 7,205,166
- Issue date Apr 17, 2007
- Lam Research Corporation
- Yehiel Gotkis
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for cleaning a wafer bevel edge and notch usin...
- Patent number 7,179,154
- Issue date Feb 20, 2007
- Lam Research Corporation
- John M. Boyd
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor processing apparatus
- Patent number 7,138,016
- Issue date Nov 21, 2006
- Semitool, Inc.
- Timothy J. Reardon
- G11 - INFORMATION STORAGE
Information Patent Grant
Integration of sensor based metrology into semiconductor processing...
- Patent number 7,128,803
- Issue date Oct 31, 2006
- Lam Research Corporation
- Aleksander Owczarz
- B24 - GRINDING POLISHING
Information Patent Grant
Process tape for cleaning or processing the edge of a semiconductor...
- Patent number 7,115,023
- Issue date Oct 3, 2006
- Lam Research Corporation
- Aleksander Owczarz
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor processing apparatus
- Patent number 7,094,291
- Issue date Aug 22, 2006
- Semitool, Inc.
- Timothy J. Reardon
- G11 - INFORMATION STORAGE
Information Patent Grant
Enhancement of eddy current based measurement capabilities
- Patent number 7,084,621
- Issue date Aug 1, 2006
- Lam Research Corporation
- Yehiel Gotkis
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for aligning and setting the axis of rotation...
- Patent number 7,025,854
- Issue date Apr 11, 2006
- Lam Research Corporation
- John M. Boyd
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus of arrayed sensors for metrological control
- Patent number 6,951,624
- Issue date Oct 4, 2005
- Lam Research Corporation
- Yehiel Gotkis
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and methods for detecting transitions of wafer surface pr...
- Patent number 6,937,915
- Issue date Aug 30, 2005
- Lam Research Corporation
- Rodney Kistler
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for metal residue detection and mapping within a...
- Patent number 6,929,531
- Issue date Aug 16, 2005
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for detecting transitions of wafer surface properties in ch...
- Patent number 6,925,348
- Issue date Aug 2, 2005
- Lam Research Corporation
- Rodney Kistler
- B24 - GRINDING POLISHING
Information Patent Grant
Complementary sensors metrological process and method and apparatus...
- Patent number 6,922,053
- Issue date Jul 26, 2005
- Lam Research Corporation
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oscillating chemical mechanical planarization apparatus
- Patent number 6,902,466
- Issue date Jun 7, 2005
- Lam Research Corporation
- Miguel A. Saldana
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad ironing system
- Patent number 6,896,596
- Issue date May 24, 2005
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Method and Apparatus for Wafer Electroless Plating
- Publication number 20130280917
- Publication date Oct 24, 2013
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Electroless Plating System and Associated Methods
- Publication number 20120045897
- Publication date Feb 23, 2012
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus for Applying a Plating Solution for Electroless Deposition
- Publication number 20100239767
- Publication date Sep 23, 2010
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Apparatus for Cleaning Semiconductor Wafers Using Compre...
- Publication number 20090078282
- Publication date Mar 26, 2009
- Lam Research Corporation
- John M. de Larios
- B08 - CLEANING
Information Patent Application
APPARATUSES AND METHODS FOR CLEANING A SUBSTRATE
- Publication number 20090000044
- Publication date Jan 1, 2009
- John M. de Larios
- B08 - CLEANING
Information Patent Application
SUBSTRATE GRIPPER WITH INTEGRATED ELECTRICAL CONTACTS
- Publication number 20080289967
- Publication date Nov 27, 2008
- LAM RESEARCH CORPORATION
- Aleksander Owczarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, METHOD AND APPARATUS FOR IN-SITU SUBSTRATE INSPECTION
- Publication number 20080273195
- Publication date Nov 6, 2008
- Aleksander Owczarz
- G01 - MEASURING TESTING
Information Patent Application
Fluid Handling System for Wafer Electroless Plating and Associated...
- Publication number 20080251148
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Electroless Plating System and Associated Methods
- Publication number 20080254621
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Apparatus for Wafer Electroless Plating
- Publication number 20080254225
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
System, method and apparatus for in-situ substrate inspection
- Publication number 20060139450
- Publication date Jun 29, 2006
- Lam Research Corp.
- Aleksander Owczarz
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for cleaning semiconductor wafers using compre...
- Publication number 20050133060
- Publication date Jun 23, 2005
- John M. de Larios
- B08 - CLEANING
Information Patent Application
Apparatuses and methods for cleaning a substrate
- Publication number 20050133061
- Publication date Jun 23, 2005
- LAM RESEARCH CORPORATION
- John M. de Larios
- B08 - CLEANING
Information Patent Application
Integration of sensor based metrology into semiconductor processing...
- Publication number 20050072528
- Publication date Apr 7, 2005
- Lam Research Corporation
- Aleksander Owczarz
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for wafer mechanical stress monitoring and waf...
- Publication number 20050066739
- Publication date Mar 31, 2005
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Application
Methods for detecting transitions of wafer surface properties in ch...
- Publication number 20050054268
- Publication date Mar 10, 2005
- Lam Research Corporation
- Rodney Kistler
- B24 - GRINDING POLISHING
Information Patent Application
Complementary sensors metrological process and method and apparatus...
- Publication number 20050007107
- Publication date Jan 13, 2005
- Lam Research Corp.
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus of arrayed sensors for metrological control
- Publication number 20050000653
- Publication date Jan 6, 2005
- Lam Research Corporation
- Yehiel Gotkis
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus of arrayed, clustered or coupled eddy current...
- Publication number 20040206455
- Publication date Oct 21, 2004
- Lam Research Corporation
- Yehiel Gotkis
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR METROLOGICAL PROCESS CONTROL IMPLEMENTING...
- Publication number 20040119468
- Publication date Jun 24, 2004
- Lam Research Corp.
- Yehiel Gotkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhancement of eddy current based measurement capabilities
- Publication number 20040058545
- Publication date Mar 25, 2004
- Lam Research Corporation
- Yehiel Gotkis
- G01 - MEASURING TESTING
Information Patent Application
System and method for metal residue detection and mapping within a...
- Publication number 20040058620
- Publication date Mar 25, 2004
- LAM RESEARCH CORPORATION
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for applying differential removal rates to a s...
- Publication number 20040011462
- Publication date Jan 22, 2004
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for real time metal film thickness measurement
- Publication number 20040002171
- Publication date Jan 1, 2004
- Lam Research Corporation
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for aligning and setting the axis of rotation...
- Publication number 20030201067
- Publication date Oct 30, 2003
- Lam Research Corporation
- John M. Boyd
- B24 - GRINDING POLISHING
Information Patent Application
Polishing pad ironing system and methods for implementing the same
- Publication number 20030194956
- Publication date Oct 16, 2003
- LAM RESEARCH CORPORATION
- Yehiel Gotkis
- B24 - GRINDING POLISHING
Information Patent Application
Oscillating chemical mechanical planarization apparatus
- Publication number 20030134582
- Publication date Jul 17, 2003
- Lam Research Corp.
- Miguel A. Saldana
- B24 - GRINDING POLISHING
Information Patent Application
Motor drive assembly for a semiconductor wafer processing system
- Publication number 20020195132
- Publication date Dec 26, 2002
- Aleksander Owczarz
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
Adjustable force applying air platen and spindle system, and method...
- Publication number 20020142710
- Publication date Oct 3, 2002
- Miguel A. Saldana
- B24 - GRINDING POLISHING

Aleksander A. Owczarz

Person

Patents Grantslast 30 patents

Method and apparatus for wafer electroless plating

Controlled ambient system for interface engineering

Fluid handling system for wafer electroless plating and associated...

Method and apparatus for cleaning semiconductor wafers using compre...

Method and apparatus for wafer electroless plating

Wafer electroless plating system and associated methods

Wafer electroless plating system and associated methods

Substrate gripper with integrated electrical contacts

Apparatus for applying a plating solution for electroless deposition

Apparatuses and methods for cleaning a substrate

Method and apparatus for cleaning semiconductor wafers using compre...

System, method and apparatus for in-situ substrate inspection

Apparatuses and methods for cleaning a substrate

System, method and apparatus for in-situ substrate inspection

Method and apparatus for real time metal film thickness measurement

Method and apparatus of arrayed, clustered or coupled eddy current...

Method and apparatus for cleaning a wafer bevel edge and notch usin...

Semiconductor processing apparatus

Integration of sensor based metrology into semiconductor processing...

Process tape for cleaning or processing the edge of a semiconductor...

Semiconductor processing apparatus

Enhancement of eddy current based measurement capabilities

Method and apparatus for aligning and setting the axis of rotation...

Method and apparatus of arrayed sensors for metrological control

Apparatus and methods for detecting transitions of wafer surface pr...

System and method for metal residue detection and mapping within a...

Methods for detecting transitions of wafer surface properties in ch...

Complementary sensors metrological process and method and apparatus...

Oscillating chemical mechanical planarization apparatus

Polishing pad ironing system

Patents Applicationslast 30 patents

Method and Apparatus for Wafer Electroless Plating

Wafer Electroless Plating System and Associated Methods

Apparatus for Applying a Plating Solution for Electroless Deposition

Method and Apparatus for Cleaning Semiconductor Wafers Using Compre...

APPARATUSES AND METHODS FOR CLEANING A SUBSTRATE

SUBSTRATE GRIPPER WITH INTEGRATED ELECTRICAL CONTACTS

SYSTEM, METHOD AND APPARATUS FOR IN-SITU SUBSTRATE INSPECTION

Fluid Handling System for Wafer Electroless Plating and Associated...

Wafer Electroless Plating System and Associated Methods

Method and Apparatus for Wafer Electroless Plating

System, method and apparatus for in-situ substrate inspection

Method and apparatus for cleaning semiconductor wafers using compre...

Apparatuses and methods for cleaning a substrate

Integration of sensor based metrology into semiconductor processing...

Method and apparatus for wafer mechanical stress monitoring and waf...

Methods for detecting transitions of wafer surface properties in ch...

Complementary sensors metrological process and method and apparatus...

Method and apparatus of arrayed sensors for metrological control

Method and apparatus of arrayed, clustered or coupled eddy current...

METHOD AND APPARATUS FOR METROLOGICAL PROCESS CONTROL IMPLEMENTING...

Enhancement of eddy current based measurement capabilities

System and method for metal residue detection and mapping within a...

Method and apparatus for applying differential removal rates to a s...

Method and apparatus for real time metal film thickness measurement

Method and apparatus for aligning and setting the axis of rotation...

Polishing pad ironing system and methods for implementing the same

Oscillating chemical mechanical planarization apparatus

Motor drive assembly for a semiconductor wafer processing system

Adjustable force applying air platen and spindle system, and method...