Aleksander Zubelewicz

Person

Binghamton, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structure for reinforcing a semiconductor device to prevent cracking
- Patent number 6,492,724
- Issue date Dec 10, 2002
- International Business Machines Corporation
- Michael Anthony Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly process for flip chip package having a low stress chip and...
- Patent number 6,488,806
- Issue date Dec 3, 2002
- International Business Machines Corporation
- Timothy F. Carden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder interconnect techniques
- Patent number 6,347,901
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Seungbae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly process for flip chip package having a low stress chip and...
- Patent number 6,224,711
- Issue date May 1, 2001
- International Business Machines Corporation
- Timothy F. Carden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reinforcing a semiconductor device to prevent cracking
- Patent number 6,197,619
- Issue date Mar 6, 2001
- International Business Machines Corporation
- Michael Anthony Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heated circuit assembly tester and method
- Patent number 5,949,682
- Issue date Sep 7, 1999
- International Business Machines Corporation
- Gerard Truman Dickinson
- G01 - MEASURING TESTING
Information Patent Grant
Heated circuit assembly tester and method
- Patent number 5,838,568
- Issue date Nov 17, 1998
- International Business Machines Corporation
- Gerard Truman Dickinson
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board assembly torsion tester and method
- Patent number 5,789,682
- Issue date Aug 4, 1998
- International Business Machines Corporation
- Gerard Truman Dickinson
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board assembly torsion tester and method
- Patent number 5,736,646
- Issue date Apr 7, 1998
- International Business Machines Corporation
- Gerard Truman Dickinson
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board assembly torsion tester and method
- Patent number 5,567,884
- Issue date Oct 22, 1996
- International Business Machines Corporation
- Gerard T. Dickinson
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Solder Interconnect Joints For A Semiconductor Package
- Publication number 20080029888
- Publication date Feb 7, 2008
- International Business Machines Corporation
- Seungbae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Assembly process for flip chip package having a low stress chip and...
- Publication number 20010013392
- Publication date Aug 16, 2001
- International Business Machines Corporation
- Timothy F. Carden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for reinforcing a semiconductor device to prev...
- Publication number 20010009277
- Publication date Jul 26, 2001
- Michael Anthony Gaynes
- H01 - BASIC ELECTRIC ELEMENTS

Aleksander Zubelewicz

Person

Patents Grantslast 30 patents

Structure for reinforcing a semiconductor device to prevent cracking

Assembly process for flip chip package having a low stress chip and...

Solder interconnect techniques

Assembly process for flip chip package having a low stress chip and...

Method for reinforcing a semiconductor device to prevent cracking

Heated circuit assembly tester and method

Heated circuit assembly tester and method

Circuit board assembly torsion tester and method

Circuit board assembly torsion tester and method

Circuit board assembly torsion tester and method

Patents Applicationslast 30 patents

Solder Interconnect Joints For A Semiconductor Package

Assembly process for flip chip package having a low stress chip and...

Structure and method for reinforcing a semiconductor device to prev...