Alexander Ebermann

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Communicating optical signals between stacked dies
- Patent number 10,283,490
- Issue date May 7, 2019
- GLOBALFOUNDRIES Inc.
- Sven Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-die stacking
- Patent number 9,806,067
- Issue date Oct 31, 2017
- GLOBALFOUNDRIES Inc.
- Sven Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and method of forming a capacitor structure
- Patent number 9,698,179
- Issue date Jul 4, 2017
- GLOBALFOUNDRIES Inc.
- Elliot John Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method including a formation of a control gate of a nonvolatile mem...
- Patent number 9,548,312
- Issue date Jan 17, 2017
- GLOBALFOUNDRIES Inc.
- Sven Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating FinFET integrated circuits using laser inte...
- Patent number 9,123,825
- Issue date Sep 1, 2015
- GLOBALFOUNDRIES, INC.
- Sven Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating integrated circuits with fully silicided ga...
- Patent number 9,123,827
- Issue date Sep 1, 2015
- GLOBALFOUNDRIES, INC.
- Sven Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate electrode with a shrink spacer
- Patent number 9,040,405
- Issue date May 26, 2015
- GLOBALFOUNDRIES Inc.
- Tom Hasche
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
DIE-DIE STACKING
- Publication number 20180012877
- Publication date Jan 11, 2018
- GLOBALFOUNDRIES INC.
- Sven Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND METHOD OF FORMING A CAPACITOR STRUCTURE
- Publication number 20170040354
- Publication date Feb 9, 2017
- Elliot John Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-DIE STACKING
- Publication number 20170025398
- Publication date Jan 26, 2017
- GLOBALFOUNDRIES INC.
- Sven Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBUST POST-GATE SPACER PROCESSING AND DEVICE
- Publication number 20160071954
- Publication date Mar 10, 2016
- GLOBALFOUNDRIES INC.
- Jan HOENTSCHEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH FULLY SILICIDED GA...
- Publication number 20150200142
- Publication date Jul 16, 2015
- GLOBALFOUNDRIES, INC.
- Sven Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING FINFET INTEGRATED CIRCUITS USING LASER INTE...
- Publication number 20150200140
- Publication date Jul 16, 2015
- GLOBALFOUNDRIES, Inc.
- Sven Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE ELECTRODE WITH A SHRINK SPACER
- Publication number 20150091068
- Publication date Apr 2, 2015
- GLOBAL FOUNDRIES Inc.
- Tom Hasche
- H01 - BASIC ELECTRIC ELEMENTS

Alexander Ebermann

Person

Patents Grantslast 30 patents

Communicating optical signals between stacked dies

Die-die stacking

Capacitor structure and method of forming a capacitor structure

Method including a formation of a control gate of a nonvolatile mem...

Methods for fabricating FinFET integrated circuits using laser inte...

Methods for fabricating integrated circuits with fully silicided ga...

Gate electrode with a shrink spacer

Patents Applicationslast 30 patents

DIE-DIE STACKING

CAPACITOR STRUCTURE AND METHOD OF FORMING A CAPACITOR STRUCTURE

DIE-DIE STACKING

ROBUST POST-GATE SPACER PROCESSING AND DEVICE

METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH FULLY SILICIDED GA...

METHODS FOR FABRICATING FINFET INTEGRATED CIRCUITS USING LASER INTE...

GATE ELECTRODE WITH A SHRINK SPACER