Alexander Fluegel

Person

Bad Duerkheim, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Composition for copper bump electrodeposition comprising a polyamin...
- Patent number 12,134,834
- Issue date Nov 5, 2024
- BASF SE
- Marco Arnold
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for cobalt plating comprising additive for void-free su...
- Patent number 12,098,473
- Issue date Sep 24, 2024
- BASF SE
- Sathana Kitayaporn
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for tin-silver alloy electroplating comprising a comple...
- Patent number 12,054,842
- Issue date Aug 6, 2024
- BASF SE
- Katharina Fritzsche
- B32 - LAYERED PRODUCTS
Information Patent Grant
Composition for metal plating comprising suppressing agent for void...
- Patent number 11,926,918
- Issue date Mar 12, 2024
- BASF SE
- Marcel Patrik Kienle
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for tin or tin alloy electroplating comprising suppress...
- Patent number 11,840,771
- Issue date Dec 12, 2023
- BASF SE
- Alexander Fluegel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for tin or tin alloy electroplating comprising leveling...
- Patent number 11,535,946
- Issue date Dec 27, 2022
- BASF SE
- Alexander Fluegel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for tin or tin alloy electroplating comprising suppress...
- Patent number 11,459,665
- Issue date Oct 4, 2022
- BASF SE
- Alexander Fluegel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for metal electroplating comprising leveling agent
- Patent number 11,387,108
- Issue date Jul 12, 2022
- BASF SE
- Marcel Patrik Kienle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for cobalt electroplating comprising leveling agent
- Patent number 11,377,748
- Issue date Jul 5, 2022
- BASF SE
- Nadine Engelhardt
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for tin or tin alloy electroplating comprising suppress...
- Patent number 11,242,606
- Issue date Feb 8, 2022
- BASF SE
- Alexander Fluegel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for metal electroplating comprising leveling agent
- Patent number 9,758,885
- Issue date Sep 12, 2017
- BASF SE
- Marcel Patrik Kienle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition for metal electroplating comprising leveling agent
- Patent number 9,683,302
- Issue date Jun 20, 2017
- BASF SE
- Michael Siemer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition for metal electroplating comprising an additive for bot...
- Patent number 9,631,292
- Issue date Apr 25, 2017
- BASF SE
- Cornelia Roeger-Goepfert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITION FOR TIN-SILVER ALLOY ELECTROPLATING COMPRISING A COMPLE...
- Publication number 20240060201
- Publication date Feb 22, 2024
- BASF SE
- Marco ARNOLD
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING LEVELING...
- Publication number 20240052515
- Publication date Feb 15, 2024
- BASF SE
- Sabine FRISCHHUT
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Composition For Copper Electroplating On A Cobalt Seed
- Publication number 20230265576
- Publication date Aug 24, 2023
- BASF SE
- Charlotte EMNET
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Polyalkanolamines
- Publication number 20230235471
- Publication date Jul 27, 2023
- BASF SE
- Marco ARNOLD
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Alkaline Composition For Copper Electroplating Comprising A Defect...
- Publication number 20230203695
- Publication date Jun 29, 2023
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN R...
- Publication number 20230203694
- Publication date Jun 29, 2023
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A POLYAMIN...
- Publication number 20230142238
- Publication date May 11, 2023
- BASF SE
- Marco ARNOLD
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A LEVELING...
- Publication number 20220356592
- Publication date Nov 10, 2022
- BASF SE
- Marco ARNOLD
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A LEVELING...
- Publication number 20220333262
- Publication date Oct 20, 2022
- BASF SE
- Nadine ENGELHARDT
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Composition for Cobalt Electroplating Comprising Leveling Agent
- Publication number 20220298664
- Publication date Sep 22, 2022
- BASF SE
- Nadine ENGELHARDT
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING SUPPRESS...
- Publication number 20220119972
- Publication date Apr 21, 2022
- BASF SE
- Alexander FLUEGEL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SU...
- Publication number 20220018035
- Publication date Jan 20, 2022
- BASF SE
- Sathana Katayaporn
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING SUPPRESS...
- Publication number 20210180201
- Publication date Jun 17, 2021
- BASF SE
- Alexander FLUEGEL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING SUPPRESS...
- Publication number 20210079548
- Publication date Mar 18, 2021
- BASF SE
- Alexander FLUEGEL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SU...
- Publication number 20210040635
- Publication date Feb 11, 2021
- BASF SE
- Marcel Patrik KIENLE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR TIN-SILVER ALLOY ELECTROPLATING COMPRISING A COMPLE...
- Publication number 20210025070
- Publication date Jan 28, 2021
- BASF SE
- Katharina FRITZSCHE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR COBALT ELECTROPLATING COMPRISING LEVELING AGENT
- Publication number 20200347503
- Publication date Nov 5, 2020
- BASF SE
- Nadine ENGELHARDT
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT
- Publication number 20200185224
- Publication date Jun 11, 2020
- BASF SE
- Marcel Patrik KIENLE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING LEVELING...
- Publication number 20200115813
- Publication date Apr 16, 2020
- BASF SE
- Alexander FLUEGEL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID...
- Publication number 20190309429
- Publication date Oct 10, 2019
- BASF SE
- Marcel Patrik KIENLE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SU...
- Publication number 20190226107
- Publication date Jul 25, 2019
- BASF SE
- Marcel Patrik KIENLE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT
- Publication number 20150284865
- Publication date Oct 8, 2015
- BASF SE
- Marcel Patrik Kienle
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOT...
- Publication number 20140097092
- Publication date Apr 10, 2014
- BASF SE
- Cornelia Roeger-Goepfert
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT
- Publication number 20130068626
- Publication date Mar 21, 2013
- BASF SE
- Michael Siemer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Alexander Fluegel

Person

Patents Grantslast 30 patents

Composition for copper bump electrodeposition comprising a polyamin...

Composition for cobalt plating comprising additive for void-free su...

Composition for tin-silver alloy electroplating comprising a comple...

Composition for metal plating comprising suppressing agent for void...

Composition for tin or tin alloy electroplating comprising suppress...

Composition for tin or tin alloy electroplating comprising leveling...

Composition for tin or tin alloy electroplating comprising suppress...

Composition for metal electroplating comprising leveling agent

Composition for cobalt electroplating comprising leveling agent

Composition for tin or tin alloy electroplating comprising suppress...

Composition for metal electroplating comprising leveling agent

Composition for metal electroplating comprising leveling agent

Composition for metal electroplating comprising an additive for bot...

Patents Applicationslast 30 patents

COMPOSITION FOR TIN-SILVER ALLOY ELECTROPLATING COMPRISING A COMPLE...

COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING LEVELING...

Composition For Copper Electroplating On A Cobalt Seed

Polyalkanolamines

Alkaline Composition For Copper Electroplating Comprising A Defect...

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN R...

COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A POLYAMIN...

COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A LEVELING...

COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A LEVELING...

Composition for Cobalt Electroplating Comprising Leveling Agent

COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING SUPPRESS...

COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SU...

COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING SUPPRESS...

COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING SUPPRESS...

COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SU...

COMPOSITION FOR TIN-SILVER ALLOY ELECTROPLATING COMPRISING A COMPLE...

COMPOSITION FOR COBALT ELECTROPLATING COMPRISING LEVELING AGENT

COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT

COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING LEVELING...

COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID...

COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SU...

COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT

COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOT...

COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT