Alexander Roth

Person

Zeitlarn, DE

People

Patents Grantslast 30 patents

Information Patent Grant
DBC substrate for power semiconductor devices, method for fabricati...
- Patent number 12,119,284
- Issue date Oct 15, 2024
- Infineon Technologies Austria AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-plating of solder layer on solderable elements for diffusion so...
- Patent number 12,069,802
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layer structure with an intermetallic phase layer and a chip packag...
- Patent number 12,023,762
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing a metal-ceramic substrate with electrically co...
- Patent number 11,804,383
- Issue date Oct 31, 2023
- Infineon Technologies AG
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Semiconductor package with barrier to contain thermal interface mat...
- Patent number 11,626,351
- Issue date Apr 11, 2023
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a metal-ceramic substrate with at least one via
- Patent number 11,557,490
- Issue date Jan 17, 2023
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing power semiconductor module arrangement
- Patent number 11,557,522
- Issue date Jan 17, 2023
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material with two different size nickel particles
- Patent number 11,552,042
- Issue date Jan 10, 2023
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Leadframe package with isolation layer
- Patent number 11,404,359
- Issue date Aug 2, 2022
- Infineon Technologies AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-impregnated boron nitride body and a method for producing a r...
- Patent number 11,155,739
- Issue date Oct 26, 2021
- Infineon Technologies AG
- Alexander Roth
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Power semiconductor module arrangement
- Patent number 11,081,414
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a metal-ceramic substrate with at least one via
- Patent number 10,796,929
- Issue date Oct 6, 2020
- Infineon Technologies AG
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method for producing a metal-ceramic substrate
- Patent number 10,759,714
- Issue date Sep 1, 2020
- Infineon Technologies AG
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Chip module with spatially limited thermally conductive mounting body
- Patent number 10,679,978
- Issue date Jun 9, 2020
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier configured for delamination-free encapsulation and sta...
- Patent number 10,586,756
- Issue date Mar 10, 2020
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and multiple substrate, and method for producing thereof
- Patent number 10,206,279
- Issue date Feb 12, 2019
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
- Publication number 20240373548
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT
- Publication number 20240335912
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR MODULE HAVING A SUBSTRATE WITH AN INSULATING CERAMIC...
- Publication number 20240312795
- Publication date Sep 19, 2024
- Infineon Technologies Austria AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SEMICONDUCTOR TRANSISTOR PACKAGE HAVING ELECTRICAL CONTACT LAYERS...
- Publication number 20240266237
- Publication date Aug 8, 2024
- INFINEON TECHNOLOGIES AUSTRIA AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERABLE ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240266311
- Publication date Aug 8, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...
- Publication number 20230369166
- Publication date Nov 16, 2023
- Infineon Technologies Austria AG
- Timo Bohnenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Comprising a Combined Power and Logic Substrate
- Publication number 20230352462
- Publication date Nov 2, 2023
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER STRUCTURE AND CHIP PACKAGE THAT INCLUDES THE LAYER STRUCTURE
- Publication number 20230126663
- Publication date Apr 27, 2023
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...
- Publication number 20230095749
- Publication date Mar 30, 2023
- Alexander Heinrich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing a Metal-Ceramic Substrate with Electrically Co...
- Publication number 20230095753
- Publication date Mar 30, 2023
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
LEAD-FREE SOLDER MATERIAL, LAYER STRUCTURE, METHOD OF FORMING A SOL...
- Publication number 20220355422
- Publication date Nov 10, 2022
- INFINEON TECHNOLOGIES AG
- Alexander ROTH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Electronics Carrier
- Publication number 20220278017
- Publication date Sep 1, 2022
- Infineon Technologies Austria AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Barrier to Contain Thermal Interface Mat...
- Publication number 20220238422
- Publication date Jul 28, 2022
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH ISOLATION LAYER
- Publication number 20220122905
- Publication date Apr 21, 2022
- INFINEON TECHNOLOGIES AG
- Stefan SCHWAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
- Publication number 20220046792
- Publication date Feb 10, 2022
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Package Comprising a Thermal Interface Materia...
- Publication number 20220013433
- Publication date Jan 13, 2022
- Infineon Technologies Austria AG
- Martin Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING POWER SEMICONDUCTOR MODULE ARRANGEMENT
- Publication number 20210335682
- Publication date Oct 28, 2021
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Material, Layer Structure, Chip Package, Method of Forming a...
- Publication number 20210183804
- Publication date Jun 17, 2021
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Application
PACKAGE WITH ENCAPSULANT UNDER COMPRESSIVE STRESS
- Publication number 20210166986
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Alexander ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Metal-Ceramic Substrate with at Least One Via
- Publication number 20200395225
- Publication date Dec 17, 2020
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Method for Providing Coated Leadframes or for Measuring an Adhesion...
- Publication number 20200381314
- Publication date Dec 3, 2020
- INFINEON TECHNOLOGIES AG
- Wu Hu Li
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Corrosion Protected Mold Compound
- Publication number 20200231800
- Publication date Jul 23, 2020
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Arrangement and Method for Producing the...
- Publication number 20190237372
- Publication date Aug 1, 2019
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH SPATIALLY LIMITED THERMALLY CONDUCTIVE MOUNTING BODY
- Publication number 20180301444
- Publication date Oct 18, 2018
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-Impregnated Boron Nitride Body and a Method for Producing a R...
- Publication number 20180148623
- Publication date May 31, 2018
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for Producing a Metal-Ceramic Substrate, and a Metal-Ceramic...
- Publication number 20180093927
- Publication date Apr 5, 2018
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Chip carrier configured for delamination-free encapsulation and sta...
- Publication number 20180096919
- Publication date Apr 5, 2018
- INFINEON TECHNOLOGIES AG
- Alexander ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Metal-Ceramic Substrate with at Least One Via
- Publication number 20180061666
- Publication date Mar 1, 2018
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Substrate and Multiple Substrate, and Method for Producing Thereof
- Publication number 20170257945
- Publication date Sep 7, 2017
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Alexander Roth

Person

Patents Grantslast 30 patents

DBC substrate for power semiconductor devices, method for fabricati...

Pre-plating of solder layer on solderable elements for diffusion so...

Layer structure with an intermetallic phase layer and a chip packag...

Method for producing a metal-ceramic substrate with electrically co...

Semiconductor package with barrier to contain thermal interface mat...

Method for producing a metal-ceramic substrate with at least one via

Method for producing power semiconductor module arrangement

Solder material with two different size nickel particles

Leadframe package with isolation layer

Resin-impregnated boron nitride body and a method for producing a r...

Power semiconductor module arrangement

Method for producing a metal-ceramic substrate with at least one via

Method for producing a metal-ceramic substrate

Chip module with spatially limited thermally conductive mounting body

Chip carrier configured for delamination-free encapsulation and sta...

Substrate and multiple substrate, and method for producing thereof

Patents Applicationslast 30 patents

Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...

METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT

SEMICONDUCTOR MODULE HAVING A SUBSTRATE WITH AN INSULATING CERAMIC...

A SEMICONDUCTOR TRANSISTOR PACKAGE HAVING ELECTRICAL CONTACT LAYERS...

SOLDERABLE ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...

Semiconductor Package Comprising a Combined Power and Logic Substrate

LAYER STRUCTURE AND CHIP PACKAGE THAT INCLUDES THE LAYER STRUCTURE

SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...

Method for Producing a Metal-Ceramic Substrate with Electrically Co...

LEAD-FREE SOLDER MATERIAL, LAYER STRUCTURE, METHOD OF FORMING A SOL...

Power Electronics Carrier

Semiconductor Package with Barrier to Contain Thermal Interface Mat...

LEADFRAME PACKAGE WITH ISOLATION LAYER

Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...

Semiconductor Device Package Comprising a Thermal Interface Materia...

METHOD FOR PRODUCING POWER SEMICONDUCTOR MODULE ARRANGEMENT

Solder Material, Layer Structure, Chip Package, Method of Forming a...

PACKAGE WITH ENCAPSULANT UNDER COMPRESSIVE STRESS

Method for Producing a Metal-Ceramic Substrate with at Least One Via

Method for Providing Coated Leadframes or for Measuring an Adhesion...

Corrosion Protected Mold Compound

Power Semiconductor Module Arrangement and Method for Producing the...

CHIP MODULE WITH SPATIALLY LIMITED THERMALLY CONDUCTIVE MOUNTING BODY

Resin-Impregnated Boron Nitride Body and a Method for Producing a R...

Method for Producing a Metal-Ceramic Substrate, and a Metal-Ceramic...

Chip carrier configured for delamination-free encapsulation and sta...

Method for Producing a Metal-Ceramic Substrate with at Least One Via

Substrate and Multiple Substrate, and Method for Producing Thereof