Alexander W. Copia

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Thin stackable package and method
- Patent number 8,937,381
- Issue date Jan 20, 2015
- Amkor Technology, Inc.
- Brett Arnold Dunlap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked inverted flip chip package and fabrication method
- Patent number 8,836,115
- Issue date Sep 16, 2014
- Amkor Technology, Inc.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-mounting substrate and method incorporating dummy traces for im...
- Patent number 7,755,176
- Issue date Jul 13, 2010
- Amkor Technology, Inc.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making solder ball mounting pads on substrates
- Patent number 6,201,305
- Issue date Mar 13, 2001
- Amkor Technology, Inc.
- Robert F. Darveaux
- H01 - BASIC ELECTRIC ELEMENTS