Alfredo Mendoza

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Mesa, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with strain relieving bump design
- Patent number 7,208,841
- Issue date Apr 24, 2007
- Motorola, Inc.
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with strain relieving bump design
- Patent number 6,790,759
- Issue date Sep 14, 2004
- Freescale Semiconductor, Inc.
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device with strain relieving bump design
- Publication number 20050023680
- Publication date Feb 3, 2005
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS