John C. Carson, “Advances in Chip Level Packaging” (2002 Lecture notes, Johns Hopkins University). |
“MicroPro Proves Effective for uBGA Sphere Attach”, Speedline (a publication of Speedline Technologies), Issue #2 (Summer 2001). |
D. Light, D. Castillo, M. Beroz, M. Nguyen, and T. Wang, “Vertical Expansion (WAVE) Packaging Process Development” (published by Tessera Technologies, 2001). |
Joseph Fjelstad, “Strategies for Creating Compliant IC Packages at Near Chip Size” (INTERPACK 1999). |
K. Klein, T. Leichle, E. Moss, P. Sassone and X. Wei, “A Survey of Compliant Interconnects for Wafer Level Packaging” (Dec. 13, 2001). |