Allan R. Knoll

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of producing flex circuit with selectively plated gold
- Patent number 6,515,233
- Issue date Feb 4, 2003
- Daniel P. Labzentis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing flex circuit with selectively plated gold
- Patent number 6,383,401
- Issue date May 7, 2002
- International Flex Technologies, Inc.
- Daniel P. Labzentis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High adhesion performance roll sputtered strike layer
- Patent number 6,337,004
- Issue date Jan 8, 2002
- International Business Machines Corporation
- Kim Joseph Blackwell
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of forming adherent metal components on a polyimide substrate
- Patent number 6,284,329
- Issue date Sep 4, 2001
- International Business Machines Corporation
- Luis J. Matienzo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for coating a substrate with metallic layer
- Patent number 6,235,411
- Issue date May 22, 2001
- International Business Machines Corporation
- Kim Joseph Blackwell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming adherent metal components on a polyimide substrate
- Patent number 6,194,076
- Issue date Feb 27, 2001
- International Business Machines Corporation
- Luis J. Matienzo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for metallizing through holes in thin film substrates, and r...
- Patent number 5,525,369
- Issue date Jun 11, 1996
- International Business Machines Corporation
- Kim J. Blackwell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic package including lower water content polyimide film
- Patent number 5,461,203
- Issue date Oct 24, 1995
- International Business Machines Corporation
- Kim J. Blackwell
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for creating organic polymeric substrate with copper
- Patent number 5,372,848
- Issue date Dec 13, 1994
- International Business Machines Corporation
- Kim J. Blackwell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for metallizing through holes in thin film substrates, and r...
- Patent number 5,288,541
- Issue date Feb 22, 1994
- International Business Machines Corporation
- Kim J. Blackwell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of plasma etching a substrate with a gaseous organohalide co...
- Patent number 5,053,104
- Issue date Oct 1, 1991
- International Business Machines Corporation
- Suryadevara V. Babu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Allan R. Knoll

Person

Patents Grantslast 30 patents

Method of producing flex circuit with selectively plated gold

Method of producing flex circuit with selectively plated gold

High adhesion performance roll sputtered strike layer

Method of forming adherent metal components on a polyimide substrate

Process for coating a substrate with metallic layer

Method of forming adherent metal components on a polyimide substrate

Method for metallizing through holes in thin film substrates, and r...

Electronic package including lower water content polyimide film

Process for creating organic polymeric substrate with copper

Method for metallizing through holes in thin film substrates, and r...

Method of plasma etching a substrate with a gaseous organohalide co...