Alok Lohia

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Point of load module and heatsink therefor
- Patent number 11,910,517
- Issue date Feb 20, 2024
- Acleap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards with plated blind slots for improved vertica...
- Patent number 11,792,928
- Issue date Oct 17, 2023
- Acleap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Exposed pad integrated circuit package
- Patent number 11,769,247
- Issue date Sep 26, 2023
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board layout
- Patent number 11,770,900
- Issue date Sep 26, 2023
- ABB Schweiz AG
- Alok K. Lohia
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Piezoelectric sensor apparatus
- Patent number 11,487,381
- Issue date Nov 1, 2022
- Texas Instruments Incorporated
- Wei-Yan Shih
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interposer printed circuit boards for power modules
- Patent number 11,490,517
- Issue date Nov 1, 2022
- ABB POWER ELECTRONICS, INC.
- John Andrew Trelford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer printed circuit boards for power modules
- Patent number 11,439,013
- Issue date Sep 6, 2022
- ABB POWER ELECTRONICS, INC.
- John Andrew Trelford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed pad integrated circuit package
- Patent number 11,195,269
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interposer printed circuit boards for power modules
- Patent number 10,993,325
- Issue date Apr 27, 2021
- ABB POWER ELECTRONICS INC.
- John Andrew Trelford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead packages with electroplated edges
- Patent number 10,580,723
- Issue date Mar 3, 2020
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead packages with electroplated edges
- Patent number 10,366,947
- Issue date Jul 30, 2019
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated force sensing element
- Patent number 10,353,503
- Issue date Jul 16, 2019
- Texas Instruments Incorporated
- Wei-Yan Shih
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked die power converter
- Patent number 9,842,797
- Issue date Dec 12, 2017
- Texas Instruments Incorporated
- Brian A. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having stacked attached chips overhan...
- Patent number 9,768,098
- Issue date Sep 19, 2017
- Texas Instruments Incorporated
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-hermetic semiconductor package
- Patent number 9,721,859
- Issue date Aug 1, 2017
- Texas Instruments Incorporated
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead packages with electroplated edges
- Patent number 9,576,886
- Issue date Feb 21, 2017
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead packages with electroplated edges
- Patent number 9,373,569
- Issue date Jun 21, 2016
- Texas Instruments Incorporation
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices having solderable lead surfaces expo...
- Patent number 9,219,019
- Issue date Dec 22, 2015
- Texas Instruments Incorporated
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader and exchanger
- Patent number 7,477,517
- Issue date Jan 13, 2009
- International Business Machines Corporation
- Vijayeshwar D. Khanna
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POINT OF LOAD MODULE AND HEATSINK THEREFOR
- Publication number 20240138051
- Publication date Apr 25, 2024
- AcLeap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXPOSED PAD INTEGRATED CIRCUIT PACKAGE
- Publication number 20230377124
- Publication date Nov 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Inductor Mountable on a Circuit Board
- Publication number 20230260690
- Publication date Aug 17, 2023
- ABB Schweiz AG
- Arturo Silva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARDS WITH PLATED BLIND SLOTS FOR IMPROVED VERTICA...
- Publication number 20230199958
- Publication date Jun 22, 2023
- ABB Schweiz AG
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Point of Load Module and Heatsink Therefor
- Publication number 20230189427
- Publication date Jun 15, 2023
- ABB Schweiz AG
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board Layout
- Publication number 20230189443
- Publication date Jun 15, 2023
- ABB Schweiz AG
- Alok K. Lohia
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
EXPOSED PAD INTEGRATED CIRCUIT PACKAGE
- Publication number 20220092767
- Publication date Mar 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERPOSER PRINTED CIRCUIT BOARDS FOR POWER MODULES
- Publication number 20210212210
- Publication date Jul 8, 2021
- ABB Power Electronics, Inc.
- John Andrew Trelford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER PRINTED CIRCUIT BOARDS FOR POWER MODULES
- Publication number 20210037648
- Publication date Feb 4, 2021
- ABB POWER ELECTRONICS INC.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER PRINTED CIRCUIT BOARDS FOR POWER MODULES
- Publication number 20210037649
- Publication date Feb 4, 2021
- ABB POWER ELECTRONICS INC.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED FORCE SENSING ELEMENT
- Publication number 20190339806
- Publication date Nov 7, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Wei-Yan Shih
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Flat No-Lead Packages with Electroplated Edges
- Publication number 20190295935
- Publication date Sep 26, 2019
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat No-Lead Packages with Electroplated Edges
- Publication number 20170162489
- Publication date Jun 8, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FORCE SENSING ELEMENT
- Publication number 20170123548
- Publication date May 4, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Wei-Yan Shih
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMI-HERMETIC SEMICONDUCTOR PACKAGE
- Publication number 20170062297
- Publication date Mar 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT NO-LEAD PACKAGES WITH ELECTROPLATED EDGES
- Publication number 20170062315
- Publication date Mar 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED PAD INTEGRATED CIRCUIT PACKAGE
- Publication number 20160286652
- Publication date Sep 29, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING STACKED ATTACHED CHIPS OVERHAN...
- Publication number 20160233147
- Publication date Aug 11, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING ATTACHED CHIPS OVERHANGING THE...
- Publication number 20160181180
- Publication date Jun 23, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES HAVING SOLDERABLE LEAD SURFACES EXPO...
- Publication number 20160071788
- Publication date Mar 10, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...
- Publication number 20160005712
- Publication date Jan 7, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH QFN LEA...
- Publication number 20150262919
- Publication date Sep 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...
- Publication number 20150262918
- Publication date Sep 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES HAVING SOLDERABLE LEAD SURFACES EXPO...
- Publication number 20150262903
- Publication date Sep 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE POWER CONVERTER
- Publication number 20140061884
- Publication date Mar 6, 2014
- Brian A. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A STACKED INTEGRAT...
- Publication number 20090072373
- Publication date Mar 19, 2009
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER AND EXCHANGER
- Publication number 20080180914
- Publication date Jul 31, 2008
- International Business Machines Corporation
- Vijayeshwar D. Khanna
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Point of load module and heatsink therefor

Printed circuit boards with plated blind slots for improved vertica...

Exposed pad integrated circuit package

Printed circuit board layout

Piezoelectric sensor apparatus

Interposer printed circuit boards for power modules

Interposer printed circuit boards for power modules

Exposed pad integrated circuit package

Interposer printed circuit boards for power modules

Flat no-lead packages with electroplated edges

Flat no-lead packages with electroplated edges

Integrated force sensing element

Stacked die power converter

Packaged semiconductor device having stacked attached chips overhan...

Semi-hermetic semiconductor package

Flat no-lead packages with electroplated edges

Flat no-lead packages with electroplated edges

Packaged semiconductor devices having solderable lead surfaces expo...

Integrated heat spreader and exchanger

Patents Applicationslast 30 patents

POINT OF LOAD MODULE AND HEATSINK THEREFOR

EXPOSED PAD INTEGRATED CIRCUIT PACKAGE

Inductor Mountable on a Circuit Board

PRINTED CIRCUIT BOARDS WITH PLATED BLIND SLOTS FOR IMPROVED VERTICA...

Point of Load Module and Heatsink Therefor

Printed Circuit Board Layout

EXPOSED PAD INTEGRATED CIRCUIT PACKAGE

INTERPOSER PRINTED CIRCUIT BOARDS FOR POWER MODULES

INTERPOSER PRINTED CIRCUIT BOARDS FOR POWER MODULES

INTERPOSER PRINTED CIRCUIT BOARDS FOR POWER MODULES

INTEGRATED FORCE SENSING ELEMENT

Flat No-Lead Packages with Electroplated Edges

Flat No-Lead Packages with Electroplated Edges

INTEGRATED FORCE SENSING ELEMENT

SEMI-HERMETIC SEMICONDUCTOR PACKAGE

FLAT NO-LEAD PACKAGES WITH ELECTROPLATED EDGES

EXPOSED PAD INTEGRATED CIRCUIT PACKAGE

PACKAGED SEMICONDUCTOR DEVICE HAVING STACKED ATTACHED CHIPS OVERHAN...

PACKAGED SEMICONDUCTOR DEVICE HAVING ATTACHED CHIPS OVERHANGING THE...

PACKAGED SEMICONDUCTOR DEVICES HAVING SOLDERABLE LEAD SURFACES EXPO...

STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...

STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH QFN LEA...

STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...

PACKAGED SEMICONDUCTOR DEVICES HAVING SOLDERABLE LEAD SURFACES EXPO...

STACKED DIE POWER CONVERTER

PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A STACKED INTEGRAT...

INTEGRATED HEAT SPREADER AND EXCHANGER