Amram Eitan

Person

Hsinchu, TW

People

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION...
- Publication number 20250054786
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-PLASMA CLEAN INFRARED IMAGE INSPECTION FOR OXIDELESS BONDING A...
- Publication number 20250006690
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...
- Publication number 20240404839
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS O...
- Publication number 20240321817
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...
- Publication number 20240194633
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A STACKED FILM STRUCTURE TO REDUCE CRACK...
- Publication number 20240047408
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS

Amram Eitan

Person

Patents Applicationslast 30 patents

DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION...

POST-PLASMA CLEAN INFRARED IMAGE INSPECTION FOR OXIDELESS BONDING A...

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

IMPROVED BONDING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS O...

DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...

SEMICONDUCTOR PACKAGE WITH A STACKED FILM STRUCTURE TO REDUCE CRACK...