AN-JHIH SU

Person

TAOYUAN COUNTY, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method
- Patent number 12,368,280
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,347,749
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 12,341,104
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices employing thermal and mechanical enhanced layers and method...
- Patent number 12,327,819
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated package and method forming same
- Patent number 12,283,492
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,266,633
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure with molding layer
- Patent number 12,218,104
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including IPD and method of forming the same
- Patent number 12,159,853
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for component electrode connection
- Patent number 12,142,524
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with bump
- Patent number 12,119,320
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,087,745
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,062,602
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with bridge die laterally wrapped by insulating e...
- Patent number 12,033,949
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out structure and method of fabricating the same
- Patent number 12,020,953
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,021,051
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 12,009,335
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,935,836
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming device and package structure
- Patent number 11,929,322
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method of forming the same
- Patent number 11,908,795
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming photonic integrated package
- Patent number 11,901,196
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution structure for integrated circuit package and method...
- Patent number 11,854,994
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with conductive shielding film
- Patent number 11,855,047
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,842,983
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,837,587
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with molding layer
- Patent number 11,756,931
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,742,323
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,728,249
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package pad and methods of forming
- Patent number 11,721,559
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages and methods of forming packages
- Patent number 11,715,727
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POLYMER HYBRID BONDING FOR COMPOSITE PACKAGES AND METHODS OF FORMIN...
- Publication number 20250218912
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
- Publication number 20250218799
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210589
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250201770
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250167161
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH SIGNAL INTEGRATION AND THE METHODS OF M...
- Publication number 20250157989
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES
- Publication number 20250140757
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250110291
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20250096199
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME
- Publication number 20250054894
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240429142
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240413012
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure with Bump
- Publication number 20240387431
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via for Component Electrode Connection
- Publication number 20240387263
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371840
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240355721
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20240332202
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20240282743
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Stacking Structure and Method of Fabricating the Same
- Publication number 20240282686
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FOR SEMICONDUCTOR DEVICE CONNECTION
- Publication number 20240250020
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20240186252
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240178133
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME
- Publication number 20240153872
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
- Publication number 20240136203
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20240128211
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128218
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240128143
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Han Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION
- Publication number 20240107780
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240096848
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096811
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Chung Lu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device and method

Semiconductor packages

Methods of manufacturing semiconductor devices

Devices employing thermal and mechanical enhanced layers and method...

Photonic integrated package and method forming same

Semiconductor structure and method of forming the same

Method for forming chip package structure with molding layer

Package structure including IPD and method of forming the same

Via for component electrode connection

Chip package structure with bump

Package structure and manufacturing method thereof

Semiconductor package and method of manufacturing the same

Package structure with bridge die laterally wrapped by insulating e...

Fan-out structure and method of fabricating the same

Semiconductor package and method of forming the same

Structure and method of forming a joint assembly

Via for semiconductor device connection and methods of forming the...

Semiconductor devices

Method of forming device and package structure

Package structures and method of forming the same

Method for forming photonic integrated package

Redistribution structure for integrated circuit package and method...

Chip package structure with conductive shielding film

Semiconductor structure

Package structure and manufacturing method thereof

Chip package structure with molding layer

Semiconductor structure and method of forming the same

Semiconductor package and method

Integrated circuit package pad and methods of forming

Packages and methods of forming packages

Patents Applicationslast 30 patents

POLYMER HYBRID BONDING FOR COMPOSITE PACKAGES AND METHODS OF FORMIN...

PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR PACKAGES WITH SIGNAL INTEGRATION AND THE METHODS OF M...

CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING SAME

PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method

Chip Package Structure with Bump

Via for Component Electrode Connection

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME

Structure and Method of Forming a Joint Assembly

3D Stacking Structure and Method of Fabricating the Same

VIA FOR SEMICONDUCTOR DEVICE CONNECTION

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME

PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME

SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION

INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME