AN-JHIH SU

Person

TAOYUAN COUNTY, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,935,836
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming device and package structure
- Patent number 11,929,322
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method of forming the same
- Patent number 11,908,795
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming photonic integrated package
- Patent number 11,901,196
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution structure for integrated circuit package and method...
- Patent number 11,854,994
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with conductive shielding film
- Patent number 11,855,047
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,842,983
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,837,587
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with molding layer
- Patent number 11,756,931
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,742,323
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,728,249
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package pad and methods of forming
- Patent number 11,721,559
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages and methods of forming packages
- Patent number 11,715,727
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stacked package-on-package structures
- Patent number 11,664,322
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 11,646,220
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out structure and method of fabricating the same
- Patent number 11,626,296
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including IPD and method of forming the same
- Patent number 11,587,900
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated package and method forming same
- Patent number 11,527,419
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of fabricating the same
- Patent number 11,502,032
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including a first die and a second die and a brid...
- Patent number 11,482,497
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices employing thermal and mechanical enhanced layers and method...
- Patent number 11,469,218
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with molding layer and method for forming th...
- Patent number 11,469,215
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for coupling attached component upper electrode to substrate
- Patent number 11,469,138
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stack package-on-package structures
- Patent number 11,462,531
- Issue date Oct 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stack package-on-package structures
- Patent number 11,462,530
- Issue date Oct 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing the same
- Patent number 11,450,612
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and package structure and method of forming the same
- Patent number 11,444,021
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution structure for integrated circuit package and method...
- Patent number 11,444,034
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,444,020
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME
- Publication number 20240153872
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
- Publication number 20240136203
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20240128211
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128218
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240128143
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Han Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION
- Publication number 20240107780
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240096848
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096811
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Chung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE SHIELDING FILM
- Publication number 20240079381
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240072021
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240055315
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240055311
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230378130
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230335471
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Structure and Method of Fabricating the Same
- Publication number 20230245903
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME
- Publication number 20230154881
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Integrated Package and Method Forming Same
- Publication number 20230109686
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20230036283
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20220384350
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MOLDING LAYER
- Publication number 20220384213
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION STRUCTURE FOR INTEGRATED CIRCUIT PACKAGE AND METHOD...
- Publication number 20220367374
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via for Component Electrode Connection
- Publication number 20220359284
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via for Semiconductor Device Connection and Methods of Forming the...
- Publication number 20220359377
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure with Bump
- Publication number 20220359447
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices Employing Thermal and Mechanical Enhanced Layers and Method...
- Publication number 20220359470
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING DEVICE AND PACKAGE STRUCTURE
- Publication number 20220359383
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220344304
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20220302069
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package Pad and Methods of Forming
- Publication number 20220285171
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME
- Publication number 20220278067
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Via for semiconductor device connection and methods of forming the...

Semiconductor devices

Method of forming device and package structure

Package structures and method of forming the same

Method for forming photonic integrated package

Redistribution structure for integrated circuit package and method...

Chip package structure with conductive shielding film

Semiconductor structure

Package structure and manufacturing method thereof

Chip package structure with molding layer

Semiconductor structure and method of forming the same

Semiconductor package and method

Integrated circuit package pad and methods of forming

Packages and methods of forming packages

Multi-stacked package-on-package structures

Raised via for terminal connections on different planes

Fan-out structure and method of fabricating the same

Package structure including IPD and method of forming the same

Photonic integrated package and method forming same

Chip package and method of fabricating the same

Package structure including a first die and a second die and a brid...

Devices employing thermal and mechanical enhanced layers and method...

Chip package structure with molding layer and method for forming th...

Via for coupling attached component upper electrode to substrate

Multi-stack package-on-package structures

Multi-stack package-on-package structures

Semiconductor devices and methods of manufacturing the same

Device and package structure and method of forming the same

Redistribution structure for integrated circuit package and method...

Via for semiconductor device connection and methods of forming the...

Patents Applicationslast 30 patents

PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME

PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME

SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION

INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE SHIELDING FILM

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGES

Fan-Out Structure and Method of Fabricating the Same

PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME

Photonic Integrated Package and Method Forming Same

PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICES

METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MOLDING LAYER

REDISTRIBUTION STRUCTURE FOR INTEGRATED CIRCUIT PACKAGE AND METHOD...

Via for Component Electrode Connection

Via for Semiconductor Device Connection and Methods of Forming the...

Chip Package Structure with Bump

Devices Employing Thermal and Mechanical Enhanced Layers and Method...

METHOD OF FORMING DEVICE AND PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

Structure and Method of Forming a Joint Assembly

Integrated Circuit Package Pad and Methods of Forming

PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME