Anchuan WANG

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integration processes utilizing boron-doped silicon materials
- Patent number 12,334,358
- Issue date Jun 17, 2025
- Applied Materials, Inc.
- Takehito Koshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for selective metal compound removal
- Patent number 12,300,501
- Issue date May 13, 2025
- Applied Materials, Inc.
- Zhenjiang Cui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal oxide directional removal
- Patent number 12,272,563
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal deposition and etch in high aspect-ratio features
- Patent number 12,087,595
- Issue date Sep 10, 2024
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective removal of transition metal nitride materials
- Patent number 11,984,325
- Issue date May 14, 2024
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective removal of ruthenium-containing materials
- Patent number 11,798,813
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Baiwei Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for selective metal compound removal
- Patent number 11,769,671
- Issue date Sep 26, 2023
- Applied Materials, Inc.
- Zhenjiang Cui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Three-color 3D DRAM stack and methods of making
- Patent number 11,764,058
- Issue date Sep 19, 2023
- Applied Materials, Inc.
- Arvind Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airgap formation processes
- Patent number 11,735,467
- Issue date Aug 22, 2023
- Applied Materials, Inc.
- Ashish Pal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for nitride-containing film removal
- Patent number 11,728,177
- Issue date Aug 15, 2023
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal etch in high aspect-ratio features
- Patent number 11,631,589
- Issue date Apr 18, 2023
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for tungsten-containing film removal
- Patent number 11,488,835
- Issue date Nov 1, 2022
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate contact over active regions
- Patent number 11,462,411
- Issue date Oct 4, 2022
- Applied Materials, Inc.
- Gaurav Thareja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods to form airgaps
- Patent number 11,335,565
- Issue date May 17, 2022
- Applied Materials, Inc.
- Zhijun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airgap formation processes
- Patent number 11,211,286
- Issue date Dec 28, 2021
- Applied Materials, Inc.
- Ashish Pal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for aluminum-containing film removal
- Patent number 11,062,921
- Issue date Jul 13, 2021
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate contact over active processes
- Patent number 11,004,687
- Issue date May 11, 2021
- Applied Materials, Inc.
- Gaurav Thareja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal silicon etch
- Patent number 11,004,689
- Issue date May 11, 2021
- Applied Materials, Inc.
- Zihui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods utilizing solid-phase etchants
- Patent number 10,872,778
- Issue date Dec 22, 2020
- Applied Materials, Inc.
- Zhijun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-limiting selective etching systems and methods
- Patent number 10,755,941
- Issue date Aug 25, 2020
- Applied Materials, Inc.
- Zhijun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D NAND high aspect ratio structure etch
- Patent number 10,692,880
- Issue date Jun 23, 2020
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods to form airgaps
- Patent number 10,615,047
- Issue date Apr 7, 2020
- Applied Materials, Inc.
- Zhijun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Water-free etching methods
- Patent number 10,497,579
- Issue date Dec 3, 2019
- Applied Materials, Inc.
- Zhijun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide and metal removal
- Patent number 10,465,294
- Issue date Nov 5, 2019
- Applied Materials, Inc.
- Xikun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Water-free etching methods
- Patent number 10,468,267
- Issue date Nov 5, 2019
- Applied Materials, Inc.
- Zhijun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide etch selectivity systems and methods
- Patent number 10,424,463
- Issue date Sep 24, 2019
- Applied Materials, Inc.
- Lin Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Oxide etch selectivity systems and methods
- Patent number 10,424,464
- Issue date Sep 24, 2019
- Applied Materials, Inc.
- Lin Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermal silicon etch
- Patent number 10,319,600
- Issue date Jun 11, 2019
- Applied Materials, Inc.
- Zihui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective SiN lateral recess
- Patent number 10,319,603
- Issue date Jun 11, 2019
- Applied Materials, Inc.
- Zhijun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxygen treatment for nitride etching
- Patent number 10,283,324
- Issue date May 7, 2019
- Applied Materials, Inc.
- Zhijun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METAL OXIDE DIRECTIONAL REMOVAL
- Publication number 20250183053
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDE QUALITY DIFFERENTIATION
- Publication number 20250125154
- Publication date Apr 17, 2025
- Applied Materials, Inc.
- Lala Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCHING OF SILICON-AND-GERMANIUM-CONTAINING MATERIALS WIT...
- Publication number 20250112051
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Jiayin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SELECTIVE METAL-CONTAINING HARDMASK REMOVAL
- Publication number 20250087494
- Publication date Mar 13, 2025
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCHING BETWEEN SILICON-AND-GERMANIUM-CONTAINING MATERIAL...
- Publication number 20250029841
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Jiayin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-AND-GERMANIUM ETCHING
- Publication number 20240332027
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Anchuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHODS TO IMPROVE ETCHED SILICON-AND-GERMANIUM-CONTAINI...
- Publication number 20240290623
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Bin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENTS TO IMPROVE ETCHED SILICON-AND-GERMANIUM-CONTAINING MATER...
- Publication number 20240282585
- Publication date Aug 22, 2024
- Applied Materials, Inc.
- Bin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR TITANIUM-CONTAINING FILM REMOVAL
- Publication number 20240258116
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY CONFORMAL METAL ETCH IN HIGH ASPECT RATIO SEMICONDUCTOR FEAT...
- Publication number 20230386830
- Publication date Nov 30, 2023
- Applied Materials, Inc.
- Xiaolin C. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION PROCESS FOR CMOS DEVICES
- Publication number 20230377997
- Publication date Nov 23, 2023
- Applied Materials, Inc.
- Nicolas Louis BREIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE N-TYPE CONTACT EPI FORMATION
- Publication number 20230307506
- Publication date Sep 28, 2023
- Applied Materials, Inc.
- Nicolas Breil
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL DEPOSITION AND ETCH IN HIGH ASPECT-RATIO FEATURES
- Publication number 20230290647
- Publication date Sep 14, 2023
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-COLOR 3D DRAM STACK AND METHODS OF MAKING
- Publication number 20230102558
- Publication date Mar 30, 2023
- Applied Materials, Inc.
- Arvind Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE DIRECTIONAL REMOVAL
- Publication number 20230015080
- Publication date Jan 19, 2023
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE REMOVAL OF TRANSITION METAL NITRIDE MATERIALS
- Publication number 20230010978
- Publication date Jan 12, 2023
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING CHAMBER ADAPTER
- Publication number 20230005765
- Publication date Jan 5, 2023
- Applied Materials, Inc.
- Son T. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ETCH IN HIGH ASPECT-RATIO FEATURES
- Publication number 20220359214
- Publication date Nov 10, 2022
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SELECTIVE METAL COMPOUND REMOVAL
- Publication number 20220351979
- Publication date Nov 3, 2022
- Applied Materials, Inc.
- Zhenjiang Cui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE REMOVAL OF RUTHENIUM-CONTAINING MATERIALS
- Publication number 20220344172
- Publication date Oct 27, 2022
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR NITRIDE-CONTAINING FILM REMOVAL
- Publication number 20220254648
- Publication date Aug 11, 2022
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR TUNGSTEN-CONTAINING FILM REMOVAL
- Publication number 20220165580
- Publication date May 26, 2022
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAP FORMATION PROCESSES
- Publication number 20220115263
- Publication date Apr 14, 2022
- Applied Materials, Inc.
- Ashish Pal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SELECTIVE METAL COMPOUND REMOVAL
- Publication number 20220084832
- Publication date Mar 17, 2022
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION PROCESSES UTILIZING BORON-DOPED SILICON MATERIALS
- Publication number 20220020599
- Publication date Jan 20, 2022
- Applied Materials, Inc.
- Takehito Koshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CONTACT OVER ACTIVE REGIONS
- Publication number 20210249270
- Publication date Aug 12, 2021
- Applied Materials, Inc.
- Gaurav THAREJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CONTACT OVER ACTIVE PROCESSES
- Publication number 20200258744
- Publication date Aug 13, 2020
- Applied Materials, Inc.
- Gaurav THAREJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS TO FORM AIRGAPS
- Publication number 20200234971
- Publication date Jul 23, 2020
- Applied Materials, Inc.
- Zhijun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-LIMITING SELECTIVE ETCHING SYSTEMS AND METHODS
- Publication number 20200013628
- Publication date Jan 9, 2020
- Applied Materials, Inc.
- Zhijun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS UTILIZING SOLID-PHASE ETCHANTS
- Publication number 20200013632
- Publication date Jan 9, 2020
- Applied Materials, Inc.
- Zhijun Chen
- H01 - BASIC ELECTRIC ELEMENTS

Anchuan WANG

Person

Patents Grantslast 30 patents

Integration processes utilizing boron-doped silicon materials

Systems and methods for selective metal compound removal

Metal oxide directional removal

Metal deposition and etch in high aspect-ratio features

Selective removal of transition metal nitride materials

Selective removal of ruthenium-containing materials

Systems and methods for selective metal compound removal

Three-color 3D DRAM stack and methods of making

Airgap formation processes

Systems and methods for nitride-containing film removal

Metal etch in high aspect-ratio features

Systems and methods for tungsten-containing film removal

Gate contact over active regions

Systems and methods to form airgaps

Airgap formation processes

Systems and methods for aluminum-containing film removal

Gate contact over active processes

Thermal silicon etch

Systems and methods utilizing solid-phase etchants

Self-limiting selective etching systems and methods

3D NAND high aspect ratio structure etch

Systems and methods to form airgaps

Water-free etching methods

Oxide and metal removal

Water-free etching methods

Oxide etch selectivity systems and methods

Oxide etch selectivity systems and methods

Thermal silicon etch

Selective SiN lateral recess

Oxygen treatment for nitride etching

Patents Applicationslast 30 patents

METAL OXIDE DIRECTIONAL REMOVAL

OXIDE QUALITY DIFFERENTIATION

SELECTIVE ETCHING OF SILICON-AND-GERMANIUM-CONTAINING MATERIALS WIT...

SYSTEMS AND METHODS FOR SELECTIVE METAL-CONTAINING HARDMASK REMOVAL

SELECTIVE ETCHING BETWEEN SILICON-AND-GERMANIUM-CONTAINING MATERIAL...

SILICON-AND-GERMANIUM ETCHING

PROCESSING METHODS TO IMPROVE ETCHED SILICON-AND-GERMANIUM-CONTAINI...

TREATMENTS TO IMPROVE ETCHED SILICON-AND-GERMANIUM-CONTAINING MATER...

SYSTEMS AND METHODS FOR TITANIUM-CONTAINING FILM REMOVAL

HIGHLY CONFORMAL METAL ETCH IN HIGH ASPECT RATIO SEMICONDUCTOR FEAT...

CONTACT FORMATION PROCESS FOR CMOS DEVICES

LOW TEMPERATURE N-TYPE CONTACT EPI FORMATION

METAL DEPOSITION AND ETCH IN HIGH ASPECT-RATIO FEATURES

THREE-COLOR 3D DRAM STACK AND METHODS OF MAKING

METAL OXIDE DIRECTIONAL REMOVAL

SELECTIVE REMOVAL OF TRANSITION METAL NITRIDE MATERIALS

SEMICONDUCTOR PROCESSING CHAMBER ADAPTER

METAL ETCH IN HIGH ASPECT-RATIO FEATURES

SYSTEMS AND METHODS FOR SELECTIVE METAL COMPOUND REMOVAL

SELECTIVE REMOVAL OF RUTHENIUM-CONTAINING MATERIALS

SYSTEMS AND METHODS FOR NITRIDE-CONTAINING FILM REMOVAL

SYSTEMS AND METHODS FOR TUNGSTEN-CONTAINING FILM REMOVAL

AIRGAP FORMATION PROCESSES

SYSTEMS AND METHODS FOR SELECTIVE METAL COMPOUND REMOVAL

INTEGRATION PROCESSES UTILIZING BORON-DOPED SILICON MATERIALS

GATE CONTACT OVER ACTIVE REGIONS

GATE CONTACT OVER ACTIVE PROCESSES

SYSTEMS AND METHODS TO FORM AIRGAPS

SELF-LIMITING SELECTIVE ETCHING SYSTEMS AND METHODS

SYSTEMS AND METHODS UTILIZING SOLID-PHASE ETCHANTS