Andre Brockmeier

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Method with mechanical dicing process for producing MEMS components
- Patent number 12,060,266
- Issue date Aug 13, 2024
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a semiconductor device having frame structu...
- Patent number 11,990,520
- Issue date May 21, 2024
- Infineon Technologies AG
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method with stealth dicing process for fabricating MEMS semiconduct...
- Patent number 11,939,216
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for processing a layer structure and microelectromechanical...
- Patent number 11,787,686
- Issue date Oct 17, 2023
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Carrier, laminate and method of manufacturing semiconductor devices
- Patent number 11,576,259
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical power semiconductor device, semiconductor wafer or bare-di...
- Patent number 11,502,190
- Issue date Nov 15, 2022
- Infineon Technologies Austria AG
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package devices and method for forming semiconductor...
- Patent number 11,393,784
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 11,211,459
- Issue date Dec 28, 2021
- Infineon Technologies AG
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a layer structure and microelectromechanical...
- Patent number 11,180,362
- Issue date Nov 23, 2021
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Glass piece and methods of manufacturing glass pieces and semicondu...
- Patent number 11,148,943
- Issue date Oct 19, 2021
- Infineon Technologies AG
- Alexander Breymesser
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for processing a monocrystalline substrate and micromechanic...
- Patent number 11,046,577
- Issue date Jun 29, 2021
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for processing a layer structure and microelectromechanical...
- Patent number 10,766,766
- Issue date Sep 8, 2020
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with plated lead frame
- Patent number 10,748,787
- Issue date Aug 18, 2020
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a monocrystalline substrate and micromechanic...
- Patent number 10,611,630
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Superjunction structure in a power semiconductor device
- Patent number 10,615,040
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy filter for processing a power semiconductor device
- Patent number 10,403,468
- Issue date Sep 3, 2019
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices by using epitaxy and...
- Patent number 10,276,656
- Issue date Apr 30, 2019
- Infineon Technologies AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy filter for processing a power semiconductor device
- Patent number 10,242,840
- Issue date Mar 26, 2019
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a plurality of glass members, a method of m...
- Patent number 10,112,861
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Andre Brockmeier
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method of manufacturing a semiconductor device having a vertical ed...
- Patent number 10,049,912
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Alexander Breymesser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device with glass pieces
- Patent number 9,981,844
- Issue date May 29, 2018
- Infineon Technologies AG
- Alexander Breymesser
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with plated lead frame, and method for manufac...
- Patent number 9,847,235
- Issue date Dec 19, 2017
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 9,601,376
- Issue date Mar 21, 2017
- Infineon Technologies AG
- Alexander Breymesser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a vertical edge termination structur...
- Patent number 9,570,542
- Issue date Feb 14, 2017
- Infineon Technologies AG
- Alexander Breymesser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive microphone with insulated conductive plate
- Patent number 9,503,823
- Issue date Nov 22, 2016
- Infineon Technologies AG
- Stefan Barzen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing a plurality of microphone structures, micr...
- Patent number 9,439,017
- Issue date Sep 6, 2016
- Infineon Technologies AG
- Ursula Hedenig
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Devices with thinned wafer
- Patent number 9,428,381
- Issue date Aug 30, 2016
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Glass carrier with embedded semiconductor device and metal layers o...
- Patent number 9,385,075
- Issue date Jul 5, 2016
- Infineon Technologies AG
- Alexander Breymesser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, wafer assembly and methods of manufacturing w...
- Patent number 9,219,020
- Issue date Dec 22, 2015
- Infineon Technologies AG
- Alexander Breymesser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,841,768
- Issue date Sep 23, 2014
- Infineon Technologies AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3D DOME WAFER-LEVEL PACKAGE FOR OPTICAL MEMS MIRROR WITH REDUCED FO...
- Publication number 20230288695
- Publication date Sep 14, 2023
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE AT...
- Publication number 20220293558
- Publication date Sep 15, 2022
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING FRAME STRUCTU...
- Publication number 20220085174
- Publication date Mar 17, 2022
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS SENSOR WITH PARTICLE FILTER AND METHOD FOR PRODUCING IT
- Publication number 20220033249
- Publication date Feb 3, 2022
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Processing a Layer Structure and Microelectromechanical...
- Publication number 20210363002
- Publication date Nov 25, 2021
- INFINEON TECHNOLOGIES AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD WITH STEALTH DICING PROCESS FOR FABRICATING MEMS SEMICONDUCT...
- Publication number 20210309513
- Publication date Oct 7, 2021
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD WITH MECHANICAL DICING PROCESS FOR PRODUCING MEMS COMPONENTS
- Publication number 20210253421
- Publication date Aug 19, 2021
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Vertical Power Semiconductor Device, Semiconductor Wafer or Bare-Di...
- Publication number 20210167195
- Publication date Jun 3, 2021
- Infineon Technologies Austria AG
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GENERATING A MEMS DEVICE WITH GLASS COVER AND MEMS DEVICE
- Publication number 20200385264
- Publication date Dec 10, 2020
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Processing a Layer Structure and Microelectromechanical...
- Publication number 20200277183
- Publication date Sep 3, 2020
- INFINEON TECHNOLOGIES AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PROCESSING A MONOCRYSTALLINE SUBSTRATE AND MICROMECHANIC...
- Publication number 20200198963
- Publication date Jun 25, 2020
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Manufacturing a Semiconductor De...
- Publication number 20200194558
- Publication date Jun 18, 2020
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER, LAMINATE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20200068709
- Publication date Feb 27, 2020
- INFINEON TECHNOLOGIES AG
- Hans-Joachim SCHULZE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENERGY FILTER FOR PROCESSING A POWER SEMICONDUCTOR DEVICE
- Publication number 20190214219
- Publication date Jul 11, 2019
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A LAYER STRUCTURE AND MICROELECTROMECHANICAL...
- Publication number 20190071303
- Publication date Mar 7, 2019
- INFINEON TECHNOLOGIES AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Manufacturing a Plurality of Glass Members, a Method of M...
- Publication number 20190023600
- Publication date Jan 24, 2019
- INFINEON TECHNOLOGIES AG
- Andre Brockmeier
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Glass Piece and Methods of Manufacturing Glass Pieces and Semicondu...
- Publication number 20180265354
- Publication date Sep 20, 2018
- Alexander Breymesser
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Manufacturing Semiconductor Devices by Using Epitaxy and...
- Publication number 20180226471
- Publication date Aug 9, 2018
- INFINEON TECHNOLOGIES AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A MONOCRYSTALLINE SUBSTRATE AND MICROMECHANIC...
- Publication number 20180086630
- Publication date Mar 29, 2018
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Devices and Method for Forming Semiconductor Devices
- Publication number 20180068975
- Publication date Mar 8, 2018
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Plated Lead Frame
- Publication number 20180061671
- Publication date Mar 1, 2018
- INFINEON TECHNOLOGIES AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Superjunction Structure in a Power Semiconductor Device
- Publication number 20170358452
- Publication date Dec 14, 2017
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY FILTER FOR PROCESSING A POWER SEMICONDUCTOR DEVICE
- Publication number 20170352519
- Publication date Dec 7, 2017
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD, METHOD FOR PRODUCING A MOLD, AND METHOD FOR FORMING A MOLD AR...
- Publication number 20170197865
- Publication date Jul 13, 2017
- Infineon Technologies Austria AG
- Guenter Denifl
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of Manufacturing a Semiconductor Device Having a Vertical Ed...
- Publication number 20170148663
- Publication date May 25, 2017
- INFINEON TECHNOLOGIES AG
- Alexander Breymesser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Plurality of Glass Members, a Method of M...
- Publication number 20170029311
- Publication date Feb 2, 2017
- INFINEON TECHNOLOGIES AG
- Andre Brockmeier
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
DEVICES WITH THINNED WAFER
- Publication number 20160332873
- Publication date Nov 17, 2016
- INFINEON TECHNOLOGIES AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MICROPHONE WITH INSULATED CONDUCTIVE PLATE
- Publication number 20160192086
- Publication date Jun 30, 2016
- INFINEON TECHNOLOGIES AG
- Stefan Barzen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor Device and Method of Manufacturing a Semiconductor De...
- Publication number 20160086854
- Publication date Mar 24, 2016
- INFINEON TECHNOLOGIES AG
- Alexander Breymesser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A VERTICAL EDGE TERMINATION STRUCTUR...
- Publication number 20150279930
- Publication date Oct 1, 2015
- INFINEON TECHNOLOGIES AG
- Alexander Breymesser
- H01 - BASIC ELECTRIC ELEMENTS

Andre Brockmeier

Person

Patents Grantslast 30 patents

Method with mechanical dicing process for producing MEMS components

Method of manufacturing a semiconductor device having frame structu...

Method with stealth dicing process for fabricating MEMS semiconduct...

Method for processing a layer structure and microelectromechanical...

Carrier, laminate and method of manufacturing semiconductor devices

Vertical power semiconductor device, semiconductor wafer or bare-di...

Semiconductor package devices and method for forming semiconductor...

Semiconductor device and method of manufacturing a semiconductor de...

Method for processing a layer structure and microelectromechanical...

Glass piece and methods of manufacturing glass pieces and semicondu...

Method for processing a monocrystalline substrate and micromechanic...

Method for processing a layer structure and microelectromechanical...

Semiconductor device with plated lead frame

Method for processing a monocrystalline substrate and micromechanic...

Superjunction structure in a power semiconductor device

Energy filter for processing a power semiconductor device

Method of manufacturing semiconductor devices by using epitaxy and...

Energy filter for processing a power semiconductor device

Method of manufacturing a plurality of glass members, a method of m...

Method of manufacturing a semiconductor device having a vertical ed...

Method of manufacturing semiconductor device with glass pieces

Semiconductor device with plated lead frame, and method for manufac...

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor device including a vertical edge termination structur...

Capacitive microphone with insulated conductive plate

Method for manufacturing a plurality of microphone structures, micr...

Devices with thinned wafer

Glass carrier with embedded semiconductor device and metal layers o...

Semiconductor device, wafer assembly and methods of manufacturing w...

Chip package and a method for manufacturing a chip package

Patents Applicationslast 30 patents

3D DOME WAFER-LEVEL PACKAGE FOR OPTICAL MEMS MIRROR WITH REDUCED FO...

METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE AT...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING FRAME STRUCTU...

MEMS SENSOR WITH PARTICLE FILTER AND METHOD FOR PRODUCING IT

Method for Processing a Layer Structure and Microelectromechanical...

METHOD WITH STEALTH DICING PROCESS FOR FABRICATING MEMS SEMICONDUCT...

METHOD WITH MECHANICAL DICING PROCESS FOR PRODUCING MEMS COMPONENTS

Vertical Power Semiconductor Device, Semiconductor Wafer or Bare-Di...

GENERATING A MEMS DEVICE WITH GLASS COVER AND MEMS DEVICE

Method for Processing a Layer Structure and Microelectromechanical...

METHOD FOR PROCESSING A MONOCRYSTALLINE SUBSTRATE AND MICROMECHANIC...

Semiconductor Device and Method of Manufacturing a Semiconductor De...

CARRIER, LAMINATE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

ENERGY FILTER FOR PROCESSING A POWER SEMICONDUCTOR DEVICE

METHOD FOR PROCESSING A LAYER STRUCTURE AND MICROELECTROMECHANICAL...

Method of Manufacturing a Plurality of Glass Members, a Method of M...

Glass Piece and Methods of Manufacturing Glass Pieces and Semicondu...

Method of Manufacturing Semiconductor Devices by Using Epitaxy and...

METHOD FOR PROCESSING A MONOCRYSTALLINE SUBSTRATE AND MICROMECHANIC...

Semiconductor Devices and Method for Forming Semiconductor Devices

Semiconductor Device with Plated Lead Frame

Superjunction Structure in a Power Semiconductor Device

ENERGY FILTER FOR PROCESSING A POWER SEMICONDUCTOR DEVICE

MOLD, METHOD FOR PRODUCING A MOLD, AND METHOD FOR FORMING A MOLD AR...

Method of Manufacturing a Semiconductor Device Having a Vertical Ed...

Method of Manufacturing a Plurality of Glass Members, a Method of M...

DEVICES WITH THINNED WAFER

CAPACITIVE MICROPHONE WITH INSULATED CONDUCTIVE PLATE

Semiconductor Device and Method of Manufacturing a Semiconductor De...

SEMICONDUCTOR DEVICE INCLUDING A VERTICAL EDGE TERMINATION STRUCTUR...