Andre Uhlemann

Person

Dortmund, DE

People

Patents Grantslast 30 patents

Information Patent Grant
External contact element for a power semiconductor module and power...
- Patent number 11,810,889
- Issue date Nov 7, 2023
- Infineon Technologies AG
- Andre Uhlemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having a cooling area above and below a semiconductor...
- Patent number 11,778,735
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Snubber circuit and power semiconductor module with snubber circuit
- Patent number 11,631,974
- Issue date Apr 18, 2023
- Infineon Technologies AG
- Michael Schlueter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and method for producing a power semicon...
- Patent number 11,598,904
- Issue date Mar 7, 2023
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, chip cooling housing, assembly and method for coolin...
- Patent number 11,266,012
- Issue date Mar 1, 2022
- Infineon Technologies AG
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directly cooled substrates for semiconductor modules and correspond...
- Patent number 9,731,370
- Issue date Aug 15, 2017
- Infineon Technologies AG
- Andre Uhlemann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module with liquid cooling
- Patent number 9,578,789
- Issue date Feb 21, 2017
- Infineon Technologies AG
- Andre Uhlemann
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power module with cooling structure on bonding substrate for coolin...
- Patent number 9,275,926
- Issue date Mar 1, 2016
- Infineon Technologies AG
- Wolfram Hable
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including cladded base plate
- Patent number 8,963,321
- Issue date Feb 24, 2015
- Infineon Technologies AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with directly attached thermally conductive structures
- Patent number 8,872,332
- Issue date Oct 28, 2014
- Infineon Technologies AG
- Andre Uhlemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including cladded base plate
- Patent number 8,519,532
- Issue date Aug 27, 2013
- Infineon Technologies AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR MODULE, SYSTEM INCLUDING A POWER SEMICONDUCTOR...
- Publication number 20230317560
- Publication date Oct 5, 2023
- INFINEON TECHNOLOGIES AG
- Andre Uhlemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTERNAL CONTACT ELEMENT FOR A POWER SEMICONDUCTOR MODULE AND POWER...
- Publication number 20220278070
- Publication date Sep 1, 2022
- Andre Uhlemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD HAVING A COOLING AREA ABOVE AND BELOW A SEMICONDUCTOR...
- Publication number 20220183147
- Publication date Jun 9, 2022
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Snubber Circuit and Power Semiconductor Module with Snubber Circuit
- Publication number 20210006062
- Publication date Jan 7, 2021
- INFINEON TECHNOLOGIES AG
- Michael Schlueter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board, Chip Cooling Housing, Assembly and Method for Coolin...
- Publication number 20200196441
- Publication date Jun 18, 2020
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module and Method for Producing a Power Semicon...
- Publication number 20200183056
- Publication date Jun 11, 2020
- Ivan Nikitin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Directly Cooled Substrates for Semiconductor Modules
- Publication number 20170304922
- Publication date Oct 26, 2017
- INFINEON TECHNOLOGIES AG
- Andre Uhlemann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cold Plate, Device Comprising a Cold Plate and Method for Fabricati...
- Publication number 20160056088
- Publication date Feb 25, 2016
- INFINEON TECHNOLOGIES AG
- Andre Uhlemann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Semiconductor Module with Liquid Cooling
- Publication number 20140347818
- Publication date Nov 27, 2014
- Andre Uhlemann
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Power module with cooling structure on bonding substrate for coolin...
- Publication number 20140327127
- Publication date Nov 6, 2014
- Wolfram HABLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Directly Cooled Substrates for Semiconductor Modules and Correspond...
- Publication number 20140321063
- Publication date Oct 30, 2014
- Andre Uhlemann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Module with Directly Attached Thermally Conductive Structures
- Publication number 20130285234
- Publication date Oct 31, 2013
- INFINEON TECHNOLOGIES AG
- Andre Uhlemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CLADDED BASE PLATE
- Publication number 20130134572
- Publication date May 30, 2013
- INFINEON TECHNOLOGIES AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CLADDED BASE PLATE
- Publication number 20130062750
- Publication date Mar 14, 2013
- INFINEON TECHNOLOGIES AG
- Andreas Lenniger
- H01 - BASIC ELECTRIC ELEMENTS

Andre Uhlemann

Person

Patents Grantslast 30 patents

External contact element for a power semiconductor module and power...

Circuit board having a cooling area above and below a semiconductor...

Snubber circuit and power semiconductor module with snubber circuit

Power semiconductor module and method for producing a power semicon...

Circuit board, chip cooling housing, assembly and method for coolin...

Directly cooled substrates for semiconductor modules and correspond...

Power semiconductor module with liquid cooling

Power module with cooling structure on bonding substrate for coolin...

Semiconductor device including cladded base plate

Power module with directly attached thermally conductive structures

Semiconductor device including cladded base plate

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR MODULE, SYSTEM INCLUDING A POWER SEMICONDUCTOR...

EXTERNAL CONTACT ELEMENT FOR A POWER SEMICONDUCTOR MODULE AND POWER...

CIRCUIT BOARD HAVING A COOLING AREA ABOVE AND BELOW A SEMICONDUCTOR...

Snubber Circuit and Power Semiconductor Module with Snubber Circuit

Circuit Board, Chip Cooling Housing, Assembly and Method for Coolin...

Power Semiconductor Module and Method for Producing a Power Semicon...

Directly Cooled Substrates for Semiconductor Modules

Cold Plate, Device Comprising a Cold Plate and Method for Fabricati...

Power Semiconductor Module with Liquid Cooling

Power module with cooling structure on bonding substrate for coolin...

Directly Cooled Substrates for Semiconductor Modules and Correspond...

Power Module with Directly Attached Thermally Conductive Structures

SEMICONDUCTOR DEVICE INCLUDING CLADDED BASE PLATE

SEMICONDUCTOR DEVICE INCLUDING CLADDED BASE PLATE