Andreas Augustin

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Single metal cavity antenna in package connected to an integrated t...
- Patent number 11,784,143
- Issue date Oct 10, 2023
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages, and methods for forming semiconductor packages
- Patent number 11,764,187
- Issue date Sep 19, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package integrated cavity resonator antenna
- Patent number 11,646,498
- Issue date May 9, 2023
- Intel Corporation
- Kilian Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant LC tank package and method of manufacture
- Patent number 11,521,793
- Issue date Dec 6, 2022
- Intel Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic coils in locally thinned silicon bridges and methods of as...
- Patent number 11,456,116
- Issue date Sep 27, 2022
- Intel Corporation
- Andreas Augustin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch antennas stitched to systems in packages and methods of assem...
- Patent number 11,374,323
- Issue date Jun 28, 2022
- Intel Corporation
- Andreas Augustin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor inductors
- Patent number 11,127,813
- Issue date Sep 21, 2021
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna with graded dielectirc and method of making the same
- Patent number 11,031,699
- Issue date Jun 8, 2021
- Intel IP Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic silicon bridge stack including a hybrid baseband die sup...
- Patent number 11,018,114
- Issue date May 25, 2021
- Intel IP Corporation
- Bernd Waidhas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resonant LC tank package and method of manufacture
- Patent number 10,896,780
- Issue date Jan 19, 2021
- Intel IP Corporation
- Saravana Maruthamuthu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Component magnetic shielding for microelectronic devices
- Patent number 10,867,934
- Issue date Dec 15, 2020
- Intel IP Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for data compression
- Patent number 10,560,125
- Issue date Feb 11, 2020
- Intel Corporation
- Shilpa Talwar
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Monolithic silicon bridge stack including a hybrid baseband die sup...
- Patent number 10,403,602
- Issue date Sep 3, 2019
- Intel IP Corporation
- Bernd Waidhas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectromechanical system (MEMS) on application specific integr...
- Patent number 10,301,176
- Issue date May 28, 2019
- Intel IP Corporation
- Gerald Ofner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system (MEMS) on application specific integr...
- Patent number 10,150,668
- Issue date Dec 11, 2018
- Intel IP Corporation
- Gerald Ofner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wireless in-chip and chip to chip communication
- Patent number 10,122,420
- Issue date Nov 6, 2018
- Intel IP Corporation
- Thorsten Meyer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip arrangement and method for manufacturing a chip arrangement
- Patent number 9,856,136
- Issue date Jan 2, 2018
- INTEL DEUTSCHLAND GMBH
- Thorsten Meyer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system (MEMS) on application specific integr...
- Patent number 9,663,353
- Issue date May 30, 2017
- Intel IP Corporation
- Gerald Ofner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress buffer layer for integrated microelectromechanical systems (...
- Patent number 9,550,670
- Issue date Jan 24, 2017
- Intel IP Corporation
- Christian Geissler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress buffer layer for integrated microelectromechanical systems (...
- Patent number 9,056,763
- Issue date Jun 16, 2015
- Intel Corporation
- Christian Geissler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip arrangements
- Patent number 8,907,480
- Issue date Dec 9, 2014
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor in copper
- Patent number 6,750,113
- Issue date Jun 15, 2004
- International Business Machines Corporation
- Michael D. Armacost
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic Devices with Adjustable Received Sample Bit Width
- Publication number 20240097727
- Publication date Mar 21, 2024
- Apple Inc.
- Thomas Hauser
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PATCH ANTENNAS STITCHED TO SYSTEMS IN PACKAGES AND METHODS OF ASSEM...
- Publication number 20220294115
- Publication date Sep 15, 2022
- Intel Corporation
- Andreas Augustin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA WITH GRADED DIELECTIRC AND METHOD OF MAKING THE SAME
- Publication number 20210273342
- Publication date Sep 2, 2021
- Intel IP Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONANT LC TANK PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20210104359
- Publication date Apr 8, 2021
- Intel IP Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE METAL CAVITY ANTENNA IN PACKAGE CONNECTED TO AN INTEGRATED T...
- Publication number 20200373259
- Publication date Nov 26, 2020
- Intel Corporation
- Sonja KOLLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INTEGRATED CAVITY RESONATOR ANTENNA
- Publication number 20200365996
- Publication date Nov 19, 2020
- Intel Corporation
- Kilian ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages, and Methods for Forming Semiconductor Packages
- Publication number 20200227388
- Publication date Jul 16, 2020
- Intel IP Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INDUCTORS
- Publication number 20200185490
- Publication date Jun 11, 2020
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATCH ANTENNAS STITCHED TO SYSTEMS IN PACKAGES AND METHODS OF ASSEM...
- Publication number 20200144723
- Publication date May 7, 2020
- Intel IP Corporation
- Andreas Augustin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC COILS IN LOCALLY THINNED SILICON BRIDGES AND METHODS OF AS...
- Publication number 20200111607
- Publication date Apr 9, 2020
- Intel IP Corporation
- Andreas Augustin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA PILLARS FOR CONNECTING DICE AND METHODS OF ASSE...
- Publication number 20200006272
- Publication date Jan 2, 2020
- Andreas Augustin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC SILICON BRIDGE STACK INCLUDING A HYBRID BASEBAND DIE SUP...
- Publication number 20190341371
- Publication date Nov 7, 2019
- Intel IP Corporation
- Bernd Waidhas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT MAGNETIC SHIELDING FOR MICROELECTRONIC DEVICES
- Publication number 20190304922
- Publication date Oct 3, 2019
- Intel IP Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONANT LC TANK PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20190272950
- Publication date Sep 5, 2019
- Saravana Maruthamuthu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ANTENNA WITH GRADED DIELECTIRC AND METHOD OF MAKING THE SAME
- Publication number 20190252792
- Publication date Aug 15, 2019
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR DATA COMPRESSION
- Publication number 20190238163
- Publication date Aug 1, 2019
- Intel Corporation
- Shilpa Talwar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MONOLITHIC SILICON BRIDGE STACK INCLUDING A HYBRID BASEBAND DIE SUP...
- Publication number 20190006318
- Publication date Jan 3, 2019
- Intel Corporation
- Bernd Waidhas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGR...
- Publication number 20180186627
- Publication date Jul 5, 2018
- Intel IP Corporation
- Gerald Ofner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGR...
- Publication number 20170217766
- Publication date Aug 3, 2017
- Intel IP Corporation
- Gerald Ofner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRELESS IN-CHIP AND CHIP TO CHIP COMMUNICATION
- Publication number 20170180014
- Publication date Jun 22, 2017
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGR...
- Publication number 20160200566
- Publication date Jul 14, 2016
- Intel IP Corporation
- Gerald Ofner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS BUFFER LAYER FOR INTEGRATED MICROELECTROMECHANICAL SYSTEMS (...
- Publication number 20150266728
- Publication date Sep 24, 2015
- Christian Geissler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS BUFFER LAYER FOR INTEGRATED MICROELECTROMECHANICAL SYSTEMS (...
- Publication number 20150091167
- Publication date Apr 2, 2015
- Christian Geissler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20140361387
- Publication date Dec 11, 2014
- Thorsten Meyer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP ARRANGEMENTS
- Publication number 20140264832
- Publication date Sep 18, 2014
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20140252632
- Publication date Sep 11, 2014
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE DUAL GATE CMOS SWITCHING DEVICE AND METHOD
- Publication number 20080180160
- Publication date Jul 31, 2008
- Infineon Technologies AG
- Andreas Augustin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Zero mask MIMcap process for a low k BEOL
- Publication number 20020155676
- Publication date Oct 24, 2002
- Michael Stetter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-insulator-metal capacitor in copper
- Publication number 20020094656
- Publication date Jul 18, 2002
- International Business Machines Corporation
- Michael D. Armacost
- H01 - BASIC ELECTRIC ELEMENTS

Andreas Augustin

Person

Patents Grantslast 30 patents

Single metal cavity antenna in package connected to an integrated t...

Semiconductor packages, and methods for forming semiconductor packages

Package integrated cavity resonator antenna

Resonant LC tank package and method of manufacture

Magnetic coils in locally thinned silicon bridges and methods of as...

Patch antennas stitched to systems in packages and methods of assem...

Semiconductor inductors

Antenna with graded dielectirc and method of making the same

Monolithic silicon bridge stack including a hybrid baseband die sup...

Resonant LC tank package and method of manufacture

Component magnetic shielding for microelectronic devices

Techniques for data compression

Monolithic silicon bridge stack including a hybrid baseband die sup...

Microelectromechanical system (MEMS) on application specific integr...

Microelectromechanical system (MEMS) on application specific integr...

Wireless in-chip and chip to chip communication

Chip arrangement and method for manufacturing a chip arrangement

Microelectromechanical system (MEMS) on application specific integr...

Stress buffer layer for integrated microelectromechanical systems (...

Stress buffer layer for integrated microelectromechanical systems (...

Chip arrangements

Metal-insulator-metal capacitor in copper

Patents Applicationslast 30 patents

Electronic Devices with Adjustable Received Sample Bit Width

PATCH ANTENNAS STITCHED TO SYSTEMS IN PACKAGES AND METHODS OF ASSEM...

ANTENNA WITH GRADED DIELECTIRC AND METHOD OF MAKING THE SAME

RESONANT LC TANK PACKAGE AND METHOD OF MANUFACTURE

SINGLE METAL CAVITY ANTENNA IN PACKAGE CONNECTED TO AN INTEGRATED T...

PACKAGE INTEGRATED CAVITY RESONATOR ANTENNA

Semiconductor Packages, and Methods for Forming Semiconductor Packages

SEMICONDUCTOR INDUCTORS

PATCH ANTENNAS STITCHED TO SYSTEMS IN PACKAGES AND METHODS OF ASSEM...

MAGNETIC COILS IN LOCALLY THINNED SILICON BRIDGES AND METHODS OF AS...

THROUGH-SILICON VIA PILLARS FOR CONNECTING DICE AND METHODS OF ASSE...

MONOLITHIC SILICON BRIDGE STACK INCLUDING A HYBRID BASEBAND DIE SUP...

COMPONENT MAGNETIC SHIELDING FOR MICROELECTRONIC DEVICES

RESONANT LC TANK PACKAGE AND METHOD OF MANUFACTURE

ANTENNA WITH GRADED DIELECTIRC AND METHOD OF MAKING THE SAME

TECHNIQUES FOR DATA COMPRESSION

MONOLITHIC SILICON BRIDGE STACK INCLUDING A HYBRID BASEBAND DIE SUP...

MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGR...

MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGR...

WIRELESS IN-CHIP AND CHIP TO CHIP COMMUNICATION

MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGR...

STRESS BUFFER LAYER FOR INTEGRATED MICROELECTROMECHANICAL SYSTEMS (...

STRESS BUFFER LAYER FOR INTEGRATED MICROELECTROMECHANICAL SYSTEMS (...

CHIP ARRANGEMENT AND METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

CHIP ARRANGEMENTS

SEMICONDUCTOR DEVICES

HIGH VOLTAGE DUAL GATE CMOS SWITCHING DEVICE AND METHOD

Zero mask MIMcap process for a low k BEOL

Metal-insulator-metal capacitor in copper