Andreas C. Cangellaris

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Champaign, IL, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die package having mesh power and ground planes
- Patent number 6,803,650
- Issue date Oct 12, 2004
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor die package having mesh power and ground planes
- Publication number 20040222514
- Publication date Nov 11, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor die package having mesh power and ground planes
- Publication number 20020117751
- Publication date Aug 29, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS