Andreas Grassmann

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Leadframe, encapsulated package with punched lead and sawn side fla...
- Patent number 12,165,959
- Issue date Dec 10, 2024
- Infineon Technologies AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with semiconductor packages mounted on metal frame
- Patent number 11,973,012
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with encapsulated electronic component between laminate and...
- Patent number 11,908,760
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid-cooled package having shielding layer
- Patent number 11,862,533
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with barrier to contain thermal interface mat...
- Patent number 11,626,351
- Issue date Apr 11, 2023
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and method for producing a power semicon...
- Patent number 11,598,904
- Issue date Mar 7, 2023
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module comprising two substrates and method of manufacturing...
- Patent number 11,574,889
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Ottmar Geitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch manufacture of packages by sheet separated into carriers afte...
- Patent number 11,264,356
- Issue date Mar 1, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package cooled with cooling fluid and comprising shielding layer
- Patent number 11,244,886
- Issue date Feb 8, 2022
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor panels, semiconductor packages, and methods for manuf...
- Patent number 11,171,066
- Issue date Nov 9, 2021
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising chip contact element of two different electrical...
- Patent number 11,056,458
- Issue date Jul 6, 2021
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier with electrically conductive layer extending beyond th...
- Patent number 10,615,097
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier configured for delamination-free encapsulation and sta...
- Patent number 10,586,756
- Issue date Mar 10, 2020
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with partially encapsulated cooling channel for cooling an...
- Patent number 10,461,017
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Andreas Grassmann
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Package with roughened encapsulated surface for promoting adhesion
- Patent number 10,453,771
- Issue date Oct 22, 2019
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with roughened encapsulated surface for promoting adhesion
- Patent number 10,410,949
- Issue date Sep 10, 2019
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling techniques for semiconductor package
- Patent number 10,373,890
- Issue date Aug 6, 2019
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic sub-module including a leadframe and a semiconductor chi...
- Patent number 10,304,751
- Issue date May 28, 2019
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with interconnections having different melting temperatures
- Patent number 10,211,133
- Issue date Feb 19, 2019
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module cooling system
- Patent number 10,199,238
- Issue date Feb 5, 2019
- Infineon Technologies AG
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with vertically spaced partially encapsulated contact struc...
- Patent number 10,128,165
- Issue date Nov 13, 2018
- Infineon Technologies AG
- Wolfram Hable
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method of manufacturing a cooler for semiconductor modules
- Patent number 9,934,990
- Issue date Apr 3, 2018
- Infineon Technologies AG
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic switching element and integrated sensor
- Patent number 9,768,766
- Issue date Sep 19, 2017
- Infineon Technologies Austria AG
- Stefan Willkofer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Printed circuit board including a leadframe with inserted packaged...
- Patent number 9,721,863
- Issue date Aug 1, 2017
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic cooler for semiconductor modules
- Patent number 9,613,885
- Issue date Apr 4, 2017
- Infineon Technologies AG
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method of manufacturing the same
- Patent number 9,589,922
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, chip arrangement, and method for manufacturing the same
- Patent number 9,585,241
- Issue date Feb 28, 2017
- Infineon Technologies AG
- Wolfram Hable
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic cooler for semiconductor modules
- Patent number 9,564,384
- Issue date Feb 7, 2017
- Infineon Technologies AG
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with current sensor
- Patent number 9,370,113
- Issue date Jun 14, 2016
- Infineon Technologies AG
- Udo Ausserlechner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module with cooling structure on bonding substrate for coolin...
- Patent number 9,275,926
- Issue date Mar 1, 2016
- Infineon Technologies AG
- Wolfram Hable
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER ELECTRONIC SYSTEM INCLUDING A SEMICONDUCTOR MODULE AND A COOL...
- Publication number 20240387325
- Publication date Nov 21, 2024
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module with Semiconductor Packages Mounted on Metal Frame
- Publication number 20240258216
- Publication date Aug 1, 2024
- Infineon Technologies Austria AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ARRANGEMENT AND METHODS FOR PRODUCING A SUBSTRATE ARRANGE...
- Publication number 20240162129
- Publication date May 16, 2024
- INFINEON TECHNOLOGIES AG
- Christoph Bayer
- B82 - NANO-TECHNOLOGY
Information Patent Application
POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240162205
- Publication date May 16, 2024
- Infineon Technologies Austria AG
- Marcus BÖHM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE HAVING FIRST AND SECOND LEAD FRAMES
- Publication number 20230361088
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER SEMICONDUCTOR PACKAGE
- Publication number 20230361087
- Publication date Nov 9, 2023
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230352378
- Publication date Nov 2, 2023
- Infineon Technologies Austria AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Module Comprising Flexible Leads for the Purpo...
- Publication number 20230035550
- Publication date Feb 2, 2023
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module with Semiconductor Packages Mounted on Metal Frame
- Publication number 20230025736
- Publication date Jan 26, 2023
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device for Producing a Housing
- Publication number 20220285178
- Publication date Sep 8, 2022
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SIDED COOLING MODULE WITH POWER TRANSISTOR SUBMODULES
- Publication number 20220238413
- Publication date Jul 28, 2022
- INFINEON TECHNOLOGIES AG
- Andreas GRASSMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Barrier to Contain Thermal Interface Mat...
- Publication number 20220238422
- Publication date Jul 28, 2022
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ENCAPSULATED ELECTRONIC COMPONENT BETWEEN LAMINATE AND...
- Publication number 20220230930
- Publication date Jul 21, 2022
- INFINEON TECHNOLOGIES AG
- Andreas GRASSMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid-Cooled Package Having Shielding Layer
- Publication number 20220115293
- Publication date Apr 14, 2022
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...
- Publication number 20210225744
- Publication date Jul 22, 2021
- INFINEON TECHNOLOGIES AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH MANUFACTURE OF PACKAGES BY SHEET SEPARATED INTO CARRIERS AFTE...
- Publication number 20200365553
- Publication date Nov 19, 2020
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PANELS, SEMICONDUCTOR PACKAGES, AND METHODS FOR MANUF...
- Publication number 20200203238
- Publication date Jun 25, 2020
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module and Method for Producing a Power Semicon...
- Publication number 20200183056
- Publication date Jun 11, 2020
- Ivan Nikitin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE COMPRISING CHIP CONTACT ELEMENT OF TWO DIFFERENT ELECTRICAL...
- Publication number 20200176412
- Publication date Jun 4, 2020
- INFINEON TECHNOLOGIES AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING TECHNIQUES FOR SEMICONDUCTOR PACKAGE
- Publication number 20190318976
- Publication date Oct 17, 2019
- INFINEON TECHNOLOGIES AG
- Juergen Hoegerl
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Package with interconnections having different melting temperatures
- Publication number 20190157192
- Publication date May 23, 2019
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module Cooling System
- Publication number 20180182643
- Publication date Jun 28, 2018
- INFINEON TECHNOLOGIES AG
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with interconnections having different melting temperatures
- Publication number 20180138111
- Publication date May 17, 2018
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with vertically spaced partially encapsulated contact struc...
- Publication number 20180122720
- Publication date May 3, 2018
- INFINEON TECHNOLOGIES AG
- Wolfram HABLE
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Chip carrier with electrically conductive layer extending beyond th...
- Publication number 20180102302
- Publication date Apr 12, 2018
- INFINEON TECHNOLOGIES AG
- Andreas GRASSMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip carrier configured for delamination-free encapsulation and sta...
- Publication number 20180096919
- Publication date Apr 5, 2018
- INFINEON TECHNOLOGIES AG
- Alexander ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with roughened encapsulated surface for promoting adhesion
- Publication number 20180082921
- Publication date Mar 22, 2018
- INFINEON TECHNOLOGIES AG
- Andreas GRASSMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package cooled with cooling fluid and comprising shielding layer
- Publication number 20180082925
- Publication date Mar 22, 2018
- INFINEON TECHNOLOGIES AG
- Andreas GRASSMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with partially encapsulated cooling channel for cooling an...
- Publication number 20180040537
- Publication date Feb 8, 2018
- INFINEON TECHNOLOGIES AG
- Andreas GRASSMANN
- B60 - VEHICLES IN GENERAL
Information Patent Application
Electronic Sub-Module Including a Leadframe and a Semiconductor Chi...
- Publication number 20170316999
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS

Andreas Grassmann

Person

Patents Grantslast 30 patents

Leadframe, encapsulated package with punched lead and sawn side fla...

Power module with semiconductor packages mounted on metal frame

Package with encapsulated electronic component between laminate and...

Fluid-cooled package having shielding layer

Semiconductor package with barrier to contain thermal interface mat...

Power semiconductor module and method for producing a power semicon...

Power module comprising two substrates and method of manufacturing...

Batch manufacture of packages by sheet separated into carriers afte...

Package cooled with cooling fluid and comprising shielding layer

Semiconductor panels, semiconductor packages, and methods for manuf...

Package comprising chip contact element of two different electrical...

Chip carrier with electrically conductive layer extending beyond th...

Chip carrier configured for delamination-free encapsulation and sta...

Package with partially encapsulated cooling channel for cooling an...

Package with roughened encapsulated surface for promoting adhesion

Package with roughened encapsulated surface for promoting adhesion

Cooling techniques for semiconductor package

Electronic sub-module including a leadframe and a semiconductor chi...

Package with interconnections having different melting temperatures

Semiconductor module cooling system

Package with vertically spaced partially encapsulated contact struc...

Method of manufacturing a cooler for semiconductor modules

Electronic switching element and integrated sensor

Printed circuit board including a leadframe with inserted packaged...

Plastic cooler for semiconductor modules

Electronic module and method of manufacturing the same

Substrate, chip arrangement, and method for manufacturing the same

Plastic cooler for semiconductor modules

Power semiconductor module with current sensor

Power module with cooling structure on bonding substrate for coolin...

Patents Applicationslast 30 patents

POWER ELECTRONIC SYSTEM INCLUDING A SEMICONDUCTOR MODULE AND A COOL...

Power Module with Semiconductor Packages Mounted on Metal Frame

SUBSTRATE ARRANGEMENT AND METHODS FOR PRODUCING A SUBSTRATE ARRANGE...

POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

POWER SEMICONDUCTOR PACKAGE HAVING FIRST AND SECOND LEAD FRAMES

MOLDED POWER SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Semiconductor Device Module Comprising Flexible Leads for the Purpo...

Power Module with Semiconductor Packages Mounted on Metal Frame

Method and Device for Producing a Housing

DOUBLE SIDED COOLING MODULE WITH POWER TRANSISTOR SUBMODULES

Semiconductor Package with Barrier to Contain Thermal Interface Mat...

PACKAGE WITH ENCAPSULATED ELECTRONIC COMPONENT BETWEEN LAMINATE AND...

Fluid-Cooled Package Having Shielding Layer

Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...

BATCH MANUFACTURE OF PACKAGES BY SHEET SEPARATED INTO CARRIERS AFTE...

SEMICONDUCTOR PANELS, SEMICONDUCTOR PACKAGES, AND METHODS FOR MANUF...

Power Semiconductor Module and Method for Producing a Power Semicon...

PACKAGE COMPRISING CHIP CONTACT ELEMENT OF TWO DIFFERENT ELECTRICAL...

COOLING TECHNIQUES FOR SEMICONDUCTOR PACKAGE

Package with interconnections having different melting temperatures

Semiconductor Module Cooling System

Package with interconnections having different melting temperatures

Package with vertically spaced partially encapsulated contact struc...

Chip carrier with electrically conductive layer extending beyond th...

Chip carrier configured for delamination-free encapsulation and sta...

Package with roughened encapsulated surface for promoting adhesion

Package cooled with cooling fluid and comprising shielding layer

Package with partially encapsulated cooling channel for cooling an...

Electronic Sub-Module Including a Leadframe and a Semiconductor Chi...