Andreas Huber

Person

Leonberg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Discrete electronic device embedded in chip module
- Patent number 10,734,317
- Issue date Aug 4, 2020
- International Business Machines Corporation
- Andreas Huber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete electronic device embedded in chip module
- Patent number 10,354,946
- Issue date Jul 16, 2019
- International Business Machines Corporation
- Andreas Huber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discrete electronic device embedded in chip module
- Patent number 9,980,385
- Issue date May 22, 2018
- International Business Machines Corporation
- Andreas Huber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding a discrete electrical device in a printed circuit board
- Patent number 9,839,131
- Issue date Dec 5, 2017
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discrete electronic device embedded in chip module
- Patent number 9,673,179
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Andreas Huber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing a product using a soldering process
- Patent number 9,398,702
- Issue date Jul 19, 2016
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transferring heat through an optical layer of integrated circuitry
- Patent number 9,337,122
- Issue date May 10, 2016
- GLOBALFOUNDRIES INC.
- Harry Barowski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transferring heat through an optical layer of integrated circuitry
- Patent number 9,064,080
- Issue date Jun 23, 2015
- International Business Machines Corporation
- Harry Barowski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transferring heat through an optical layer of integrated circuitry
- Patent number 9,058,461
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Harry Barowski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit package connected to an optical data transmissio...
- Patent number 8,989,532
- Issue date Mar 24, 2015
- International Business Machines Corporation
- Harry Barowski
- G02 - OPTICS
Information Patent Grant
Integrated circuit package connected to a data transmission medium
- Patent number 8,805,132
- Issue date Aug 12, 2014
- International Business Machines Corporation
- Harry Barowski
- G02 - OPTICS
Information Patent Grant
Cost-function based routing techniques for reducing crosstalk in el...
- Patent number 8,751,989
- Issue date Jun 10, 2014
- International Business Machines Corporation
- Hubert Harrer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optimized semiconductor packaging in a three-dimensional stack
- Patent number 8,476,112
- Issue date Jul 2, 2013
- International Business Machines Corporation
- Harry Barowski
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thermal power plane for integrated circuits
- Patent number 8,427,833
- Issue date Apr 23, 2013
- International Business Machines Corporation
- Harry Barowski
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Heat sink integrated power delivery and distribution for integrated...
- Patent number 8,405,998
- Issue date Mar 26, 2013
- International Business Machines Corporation
- Harry Barowski
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Optimized semiconductor packaging in a three-dimensional stack
- Patent number 8,253,234
- Issue date Aug 28, 2012
- International Business Machines Corporation
- Harry Barowski
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Ceramic package in which far end noise is reduced using capacitive...
- Patent number 7,904,849
- Issue date Mar 8, 2011
- International Business Machines Corporation
- Anand Haridass
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Design method and system for minimizing blind via current loops
- Patent number 7,765,504
- Issue date Jul 27, 2010
- International Business Machines Corporation
- Daniel Douriet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for facilitating signal transmission using dif...
- Patent number 7,671,273
- Issue date Mar 2, 2010
- International Business Machines Corporation
- Daniel Douriet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating substrates having low inductance via arrangements
- Patent number 7,614,141
- Issue date Nov 10, 2009
- International Business Machines Corporation
- Daniel Douriet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for far end noise reduction using capacitive c...
- Patent number 7,430,800
- Issue date Oct 7, 2008
- International Business Machines Corporation
- Anand Haridass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and chip module
- Patent number 7,355,125
- Issue date Apr 8, 2008
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for delta-noise reduction
- Patent number 6,774,836
- Issue date Aug 10, 2004
- International Business Machines Corporation
- Roland Frech
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method and system for quantifying the integrity of an on-chip power...
- Patent number 6,665,843
- Issue date Dec 16, 2003
- International Business Machines Corporation
- Roland Frech
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
DISCRETE ELECTRONIC DEVICE EMBEDDED IN CHIP MODULE
- Publication number 20190295938
- Publication date Sep 26, 2019
- International Business Machines Corporation
- Andreas Huber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE ELECTRONIC DEVICE EMBEDDED IN CHIP MODULE
- Publication number 20180228028
- Publication date Aug 9, 2018
- International Business Machines Corporation
- Andreas Huber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISCRETE ELECTRONIC DEVICE EMBEDDED IN CHIP MODULE
- Publication number 20180027659
- Publication date Jan 25, 2018
- International Business Machines Corporation
- Andreas Huber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDING A DISCRETE ELECTRICAL DEVICE IN A PRINTED CIRCUIT BOARD
- Publication number 20170118844
- Publication date Apr 27, 2017
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDING A DISCRETE ELECTRICAL DEVICE IN A PRINTED CIRCUIT BOARD
- Publication number 20170118842
- Publication date Apr 27, 2017
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTIMIZING POWER DISTRIBUTION FROM A POWER SOURCE THROUGH A C4 SOLD...
- Publication number 20170053899
- Publication date Feb 23, 2017
- International Business Machines Corporation
- Gerald K. Bartley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING A PRODUCT USING A SOLDERING PROCESS
- Publication number 20160270240
- Publication date Sep 15, 2016
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTIMIZING POWER DISTRIBUTION FROM A POWER SOURCE THROUGH A C4 SOLD...
- Publication number 20160071822
- Publication date Mar 10, 2016
- International Business Machines Corporation
- Gerald K. Bartley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFERRING HEAT THROUGH AN OPTICAL LAYER OF INTEGRATED CIRCUITRY
- Publication number 20150221575
- Publication date Aug 6, 2015
- International Business Machines Corporation
- Harry Barowski
- G02 - OPTICS
Information Patent Application
MANUFACTURING A PRODUCT USING A SOLDERING PROCESS
- Publication number 20140345123
- Publication date Nov 27, 2014
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSFERRING HEAT THROUGH AN OPTICAL LAYER OF INTEGRATED CIRCUITRY
- Publication number 20140095121
- Publication date Apr 3, 2014
- International Business Machines Corporation
- Harry Barowski
- G02 - OPTICS
Information Patent Application
Optimized Semiconductor Packaging in a Three-Dimensional Stack
- Publication number 20120290999
- Publication date Nov 15, 2012
- International Business Machines Corporation
- Harry Barowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFERRING HEAT THROUGH AN OPTICAL LAYER OF INTEGRATED CIRCUITRY
- Publication number 20120189243
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Harry Barowski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGE CONNECTED TO A DATA TRANSMISSION MEDIUM
- Publication number 20120148187
- Publication date Jun 14, 2012
- International Business Machines Corporation
- Harry Barowski
- G02 - OPTICS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE CONNECTED TO AN OPTICAL DATA TRANSMISSIO...
- Publication number 20120147559
- Publication date Jun 14, 2012
- International Business Machines Corporation
- Harry Barowski
- G02 - OPTICS
Information Patent Application
Heat Sink Integrated Power Delivery and Distribution for Integrated...
- Publication number 20120106074
- Publication date May 3, 2012
- International Business Machines Corporation
- Harry Barowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optimized Semiconductor Packaging in a Three-Dimensional Stack
- Publication number 20120105144
- Publication date May 3, 2012
- International Business Machines Corporation
- Harry Barowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Power Plane for Integrated Circuits
- Publication number 20120105145
- Publication date May 3, 2012
- International Business Machines Corporation
- Harry Barowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device For Supplying Power to a Microelectronic Chip
- Publication number 20110109378
- Publication date May 12, 2011
- International Business Machines Corporation
- Thomas Buechner
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR FACILITATING SIGNAL TRANSMISSION USING DIF...
- Publication number 20090091401
- Publication date Apr 9, 2009
- Daniel Douriet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Design Method and System for Minimizing Blind Via Current Loops
- Publication number 20090031270
- Publication date Jan 29, 2009
- Daniel Douriet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Ceramic Package in Which Far End Noise is Reduced Using Capacitive...
- Publication number 20080087457
- Publication date Apr 17, 2008
- Anand Haridass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ceramic Package in Which Far End Noise is Reduced Using Capacitive...
- Publication number 20080092101
- Publication date Apr 17, 2008
- Anand Haridass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low inductance via arrangement for multilayer ceramic substrates
- Publication number 20070187468
- Publication date Aug 16, 2007
- Daniel Douriet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and chip module
- Publication number 20070109726
- Publication date May 17, 2007
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for far end noise reduction using capacitive c...
- Publication number 20060272851
- Publication date Dec 7, 2006
- Anand Haridass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector with conductors exposed to exterior air to facilitate hea...
- Publication number 20060035488
- Publication date Feb 16, 2006
- International Business Machines Corp.
- Frank E. Bosco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for delta-I noise reduction
- Publication number 20040051511
- Publication date Mar 18, 2004
- International Business Machines Corporation
- Roland Frech
- G05 - CONTROLLING REGULATING
Information Patent Application
Method and system for quantifying dynamic on-chip power disribution
- Publication number 20030088395
- Publication date May 8, 2003
- Roland Frech
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and system for quantifying the integrity of an on-chip power...
- Publication number 20020125897
- Publication date Sep 12, 2002
- International Business Machines Corporation
- Roland Frech
- G06 - COMPUTING CALCULATING COUNTING

Andreas Huber

Person

Patents Grantslast 30 patents

Discrete electronic device embedded in chip module

Discrete electronic device embedded in chip module

Discrete electronic device embedded in chip module

Embedding a discrete electrical device in a printed circuit board

Discrete electronic device embedded in chip module

Manufacturing a product using a soldering process

Transferring heat through an optical layer of integrated circuitry

Transferring heat through an optical layer of integrated circuitry

Transferring heat through an optical layer of integrated circuitry

Integrated circuit package connected to an optical data transmissio...

Integrated circuit package connected to a data transmission medium

Cost-function based routing techniques for reducing crosstalk in el...

Optimized semiconductor packaging in a three-dimensional stack

Thermal power plane for integrated circuits

Heat sink integrated power delivery and distribution for integrated...

Optimized semiconductor packaging in a three-dimensional stack

Ceramic package in which far end noise is reduced using capacitive...

Design method and system for minimizing blind via current loops

Method and apparatus for facilitating signal transmission using dif...

Fabricating substrates having low inductance via arrangements

Apparatus and method for far end noise reduction using capacitive c...

Printed circuit board and chip module

Method for delta-noise reduction

Method and system for quantifying the integrity of an on-chip power...

Patents Applicationslast 30 patents

DISCRETE ELECTRONIC DEVICE EMBEDDED IN CHIP MODULE

DISCRETE ELECTRONIC DEVICE EMBEDDED IN CHIP MODULE

DISCRETE ELECTRONIC DEVICE EMBEDDED IN CHIP MODULE

EMBEDDING A DISCRETE ELECTRICAL DEVICE IN A PRINTED CIRCUIT BOARD

EMBEDDING A DISCRETE ELECTRICAL DEVICE IN A PRINTED CIRCUIT BOARD

OPTIMIZING POWER DISTRIBUTION FROM A POWER SOURCE THROUGH A C4 SOLD...

MANUFACTURING A PRODUCT USING A SOLDERING PROCESS

OPTIMIZING POWER DISTRIBUTION FROM A POWER SOURCE THROUGH A C4 SOLD...

TRANSFERRING HEAT THROUGH AN OPTICAL LAYER OF INTEGRATED CIRCUITRY

MANUFACTURING A PRODUCT USING A SOLDERING PROCESS

TRANSFERRING HEAT THROUGH AN OPTICAL LAYER OF INTEGRATED CIRCUITRY

Optimized Semiconductor Packaging in a Three-Dimensional Stack

TRANSFERRING HEAT THROUGH AN OPTICAL LAYER OF INTEGRATED CIRCUITRY

INTEGRATED CIRCUIT PACKAGE CONNECTED TO A DATA TRANSMISSION MEDIUM

INTEGRATED CIRCUIT PACKAGE CONNECTED TO AN OPTICAL DATA TRANSMISSIO...

Heat Sink Integrated Power Delivery and Distribution for Integrated...

Optimized Semiconductor Packaging in a Three-Dimensional Stack

Thermal Power Plane for Integrated Circuits

Method and Device For Supplying Power to a Microelectronic Chip

METHOD AND APPARATUS FOR FACILITATING SIGNAL TRANSMISSION USING DIF...

Design Method and System for Minimizing Blind Via Current Loops

Ceramic Package in Which Far End Noise is Reduced Using Capacitive...

Ceramic Package in Which Far End Noise is Reduced Using Capacitive...

Low inductance via arrangement for multilayer ceramic substrates

Printed circuit board and chip module

Apparatus and method for far end noise reduction using capacitive c...

Connector with conductors exposed to exterior air to facilitate hea...

Method for delta-I noise reduction

Method and system for quantifying dynamic on-chip power disribution

Method and system for quantifying the integrity of an on-chip power...