Andreas Wolter

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Assembly of 2XD module using high density interconnect bridges
- Patent number 12,125,815
- Issue date Oct 22, 2024
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 11,984,246
- Issue date May 14, 2024
- Intel Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stacking using chip to wafer bonding
- Patent number 11,955,462
- Issue date Apr 9, 2024
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single metal cavity antenna in package connected to an integrated t...
- Patent number 11,784,143
- Issue date Oct 10, 2023
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package integrated cavity resonator antenna
- Patent number 11,646,498
- Issue date May 9, 2023
- Intel Corporation
- Kilian Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant LC tank package and method of manufacture
- Patent number 11,521,793
- Issue date Dec 6, 2022
- Intel Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing reduced height s...
- Patent number 11,469,213
- Issue date Oct 11, 2022
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices with front-end metal structures
- Patent number 11,410,908
- Issue date Aug 9, 2022
- Intel Corporation
- Reinhard Mahnkopf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch antennas stitched to systems in packages and methods of assem...
- Patent number 11,374,323
- Issue date Jun 28, 2022
- Intel Corporation
- Andreas Augustin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare-die smart bridge connected with copper pillars for system-in-p...
- Patent number 11,270,941
- Issue date Mar 8, 2022
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 11,250,981
- Issue date Feb 15, 2022
- Intel Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stacking using chip to wafer bonding
- Patent number 11,239,199
- Issue date Feb 1, 2022
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical and lateral interconnects between dies
- Patent number 11,177,220
- Issue date Nov 16, 2021
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor inductors
- Patent number 11,127,813
- Issue date Sep 21, 2021
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for stacked die in a microelectronic device
- Patent number 11,107,763
- Issue date Aug 31, 2021
- Intel Corporation
- Thomas Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic silicon bridge stack including a hybrid baseband die sup...
- Patent number 11,018,114
- Issue date May 25, 2021
- Intel IP Corporation
- Bernd Waidhas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resonant LC tank package and method of manufacture
- Patent number 10,896,780
- Issue date Jan 19, 2021
- Intel IP Corporation
- Saravana Maruthamuthu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Component magnetic shielding for microelectronic devices
- Patent number 10,867,934
- Issue date Dec 15, 2020
- Intel IP Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages including an optical redistribution layer
- Patent number 10,816,742
- Issue date Oct 27, 2020
- Intel IP Corporation
- Georg Seidemann
- G02 - OPTICS
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 10,784,033
- Issue date Sep 22, 2020
- Intel IP Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded-bridge substrate connectors and methods of assembling same
- Patent number 10,727,197
- Issue date Jul 28, 2020
- Intel IP Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, and a method for forming a semiconductor device
- Patent number 10,535,578
- Issue date Jan 14, 2020
- Intel IP Corporation
- Reinhard Mahnkopf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package having a passive microelectronic device dis...
- Patent number 10,522,454
- Issue date Dec 31, 2019
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device and a method for forming an electrical device
- Patent number 10,522,485
- Issue date Dec 31, 2019
- Intel IP Corporation
- Christian Geissler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical wire connections for integrated circuit package
- Patent number 10,490,527
- Issue date Nov 26, 2019
- Intel IP Corporation
- Christian Geissler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cross-connected multi-chip modules coupled by silicon bent-bridge i...
- Patent number 10,431,545
- Issue date Oct 1, 2019
- Intel IP Corporation
- Georg Seidemann
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic package with illuminated backside exterior
- Patent number 10,411,000
- Issue date Sep 10, 2019
- Intel IP Corporation
- Marc Stephan Dittes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package devices and methods for forming system-in-package...
- Patent number 10,403,609
- Issue date Sep 3, 2019
- Intel IP Corporation
- Christian Geissler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic silicon bridge stack including a hybrid baseband die sup...
- Patent number 10,403,602
- Issue date Sep 3, 2019
- Intel IP Corporation
- Bernd Waidhas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit package configurations to reduce stiffness
- Patent number 10,373,844
- Issue date Aug 6, 2019
- Intel IP Corporation
- Sven Albers
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STACKING USING CHIP TO WAFER BONDING
- Publication number 20240213225
- Publication date Jun 27, 2024
- Intel Corporation
- Georg SEIDEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES
- Publication number 20240128223
- Publication date Apr 18, 2024
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATCH ANTENNAS STITCHED TO SYSTEMS IN PACKAGES AND METHODS OF ASSEM...
- Publication number 20220294115
- Publication date Sep 15, 2022
- Intel Corporation
- Andreas Augustin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES
- Publication number 20220199562
- Publication date Jun 23, 2022
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INDUCTOR FOR WLCSP
- Publication number 20220122756
- Publication date Apr 21, 2022
- Intel IP Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STACKING USING CHIP TO WAFER BONDING
- Publication number 20220108976
- Publication date Apr 7, 2022
- Intel Corporation
- Georg SEIDEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONANT LC TANK PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20210104359
- Publication date Apr 8, 2021
- Intel IP Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INDUCTOR FOR WLCSP
- Publication number 20200381161
- Publication date Dec 3, 2020
- Intel IP Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE METAL CAVITY ANTENNA IN PACKAGE CONNECTED TO AN INTEGRATED T...
- Publication number 20200373259
- Publication date Nov 26, 2020
- Intel Corporation
- Sonja KOLLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INTEGRATED CAVITY RESONATOR ANTENNA
- Publication number 20200365996
- Publication date Nov 19, 2020
- Intel Corporation
- Kilian ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME
- Publication number 20200328182
- Publication date Oct 15, 2020
- Intel IP Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages, and Methods for Forming Semiconductor Packages
- Publication number 20200227388
- Publication date Jul 16, 2020
- Intel IP Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INDUCTORS
- Publication number 20200185490
- Publication date Jun 11, 2020
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATCH ANTENNAS STITCHED TO SYSTEMS IN PACKAGES AND METHODS OF ASSEM...
- Publication number 20200144723
- Publication date May 7, 2020
- Intel IP Corporation
- Andreas Augustin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL AND LATERAL INTERCONNECTS BETWEEN DIES
- Publication number 20200126922
- Publication date Apr 23, 2020
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT TERMINATIONS FOR SEMICONDUCTOR PACKAGES
- Publication number 20200068711
- Publication date Feb 27, 2020
- Intel IP Corporation
- Andreas Wolter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE DEVICES HAVING A BALL GRID ARRAY WITH SIDE WALL CONTACT PADS
- Publication number 20200066692
- Publication date Feb 27, 2020
- Intel IP Corporation
- Andreas WOLTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR STACKED DIE IN A MICROELECTRONIC DEVICE
- Publication number 20200020629
- Publication date Jan 16, 2020
- Intel IP Corporation
- Thomas Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES OF STACKING INTEGRATED CIRCUITS
- Publication number 20190393191
- Publication date Dec 26, 2019
- Intel IP Corporation
- Klaus REINGRUBER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH FRONT-END METAL STRUCTURES
- Publication number 20190393130
- Publication date Dec 26, 2019
- Intel IP Corporation
- Reinhard Mahnkopf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC SILICON BRIDGE STACK INCLUDING A HYBRID BASEBAND DIE SUP...
- Publication number 20190341371
- Publication date Nov 7, 2019
- Intel IP Corporation
- Bernd Waidhas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE
- Publication number 20190333886
- Publication date Oct 31, 2019
- Intel IP Corporation
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MAGNETIC SHIELDING FOR MICROELECTRONIC DEVICES
- Publication number 20190304922
- Publication date Oct 3, 2019
- Intel IP Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE-DIE SMART BRIDGE CONNECTED WITH COPPER PILLARS FOR SYSTEM-IN-P...
- Publication number 20190287904
- Publication date Sep 19, 2019
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONANT LC TANK PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20190272950
- Publication date Sep 5, 2019
- Saravana Maruthamuthu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
VERTICAL INDUCTOR FOR WLCSP
- Publication number 20190221349
- Publication date Jul 18, 2019
- Intel IP Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTION DEVICES AND METHODS FOR EMBEDDED ELECTRONIC DEVICES
- Publication number 20190214327
- Publication date Jul 11, 2019
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING REDUCED HEIGHT S...
- Publication number 20190214369
- Publication date Jul 11, 2019
- Intel IP Corporation
- Georg SEIDEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPLB/EWLB BASED POP FOR HBM OR CUSTOMIZED PACKAGE STACK
- Publication number 20190206833
- Publication date Jul 4, 2019
- Intel IP Corporation
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL FIBER CONNECTION ON PACKAGE EDGE
- Publication number 20190121041
- Publication date Apr 25, 2019
- Intel IP Corporation
- Sven Albers
- G02 - OPTICS

Andreas Wolter

Person

Patents Grantslast 30 patents

Assembly of 2XD module using high density interconnect bridges

Vertical inductor for WLCSP

Package stacking using chip to wafer bonding

Single metal cavity antenna in package connected to an integrated t...

Package integrated cavity resonator antenna

Resonant LC tank package and method of manufacture

Systems, methods, and apparatuses for implementing reduced height s...

Integrated circuit devices with front-end metal structures

Patch antennas stitched to systems in packages and methods of assem...

Bare-die smart bridge connected with copper pillars for system-in-p...

Vertical inductor for WLCSP

Package stacking using chip to wafer bonding

Vertical and lateral interconnects between dies

Semiconductor inductors

Interconnect structure for stacked die in a microelectronic device

Monolithic silicon bridge stack including a hybrid baseband die sup...

Resonant LC tank package and method of manufacture

Component magnetic shielding for microelectronic devices

Integrated circuit packages including an optical redistribution layer

Vertical inductor for WLCSP

Embedded-bridge substrate connectors and methods of assembling same

Semiconductor devices, and a method for forming a semiconductor device

Microelectronic package having a passive microelectronic device dis...

Electrical device and a method for forming an electrical device

Vertical wire connections for integrated circuit package

Cross-connected multi-chip modules coupled by silicon bent-bridge i...

Microelectronic package with illuminated backside exterior

System-in-package devices and methods for forming system-in-package...

Monolithic silicon bridge stack including a hybrid baseband die sup...

Integrated circuit package configurations to reduce stiffness

Patents Applicationslast 30 patents

PACKAGE STACKING USING CHIP TO WAFER BONDING

ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES

PATCH ANTENNAS STITCHED TO SYSTEMS IN PACKAGES AND METHODS OF ASSEM...

ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES

VERTICAL INDUCTOR FOR WLCSP

PACKAGE STACKING USING CHIP TO WAFER BONDING

RESONANT LC TANK PACKAGE AND METHOD OF MANUFACTURE

VERTICAL INDUCTOR FOR WLCSP

SINGLE METAL CAVITY ANTENNA IN PACKAGE CONNECTED TO AN INTEGRATED T...

PACKAGE INTEGRATED CAVITY RESONATOR ANTENNA

EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME

Semiconductor Packages, and Methods for Forming Semiconductor Packages

SEMICONDUCTOR INDUCTORS

PATCH ANTENNAS STITCHED TO SYSTEMS IN PACKAGES AND METHODS OF ASSEM...

VERTICAL AND LATERAL INTERCONNECTS BETWEEN DIES

COMPONENT TERMINATIONS FOR SEMICONDUCTOR PACKAGES

PACKAGE DEVICES HAVING A BALL GRID ARRAY WITH SIDE WALL CONTACT PADS

INTERCONNECT STRUCTURE FOR STACKED DIE IN A MICROELECTRONIC DEVICE

PACKAGES OF STACKING INTEGRATED CIRCUITS

INTEGRATED CIRCUIT DEVICES WITH FRONT-END METAL STRUCTURES

MONOLITHIC SILICON BRIDGE STACK INCLUDING A HYBRID BASEBAND DIE SUP...

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE

COMPONENT MAGNETIC SHIELDING FOR MICROELECTRONIC DEVICES

BARE-DIE SMART BRIDGE CONNECTED WITH COPPER PILLARS FOR SYSTEM-IN-P...

RESONANT LC TANK PACKAGE AND METHOD OF MANUFACTURE

VERTICAL INDUCTOR FOR WLCSP

THERMAL CONDUCTION DEVICES AND METHODS FOR EMBEDDED ELECTRONIC DEVICES

SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING REDUCED HEIGHT S...

EPLB/EWLB BASED POP FOR HBM OR CUSTOMIZED PACKAGE STACK

OPTICAL FIBER CONNECTION ON PACKAGE EDGE