This disclosure pertains to optical fiber connections on package edges, and more particularly, to mechanical and optical connections of optical fibers on package edges.
Light is getting more arid more interesting in the field of data processing. By transferring the data by light, losses (e.g., through wire attenuation) can be reduced. To use light for data transfer, electrical signals are translated into light signals and are inserted into an optical fiber (or fiber optics). On the receiver side, the light is transferred back into electrical signals. On both sides of the optical fiber, the fiber has to be fixed to a chip or package to achieve both mechanical coupling for stability and optical coupling to receive optical signals from the electrical circuitry and emit optical signals to the electrical circuitry.
This disclosure describes a chip package that facilitates a self-aligning optical and mechanical edge connection to an optical fiber. The chip package described herein facilitates the connection of optical fibers directly with the chip package. The chip package described herein allows for shorter connection lengths and reduces the footprint of the system. Additionally, the integration ratio can be increased.
The chip package formation process can include the following features:
1. Implementation of a “optical window component” into the package;
2. Creation of a connector-retaining shape by, e.g., mold pressing or sawing; and
3. Exposure of an optical element (or window) during the chip package singulation process.
Other features are readily apparent by the following disclosure, accompanying figures, and the claims.
The chip package 100 also includes an encasement 114. Encasement 114 can include a mold compound, such as that used in embedded Wafer Level Ball Grid Array (eWLB) processing or other fan-out WLB processing techniques and flip-chip, or any other process that uses a mold cap. (EG filled epoxy-based materials). The mold compound used during formation of the encasement 114 can be a solid molding compound or a liquid molding compound. Examples of a mold compound include an EG-tilled epoxy-based material.
The encasement 114 can include a notch 116. The notch 116 can be formed on the top surface of the encasement 114 at a location proximate the optical transducer 104. For example, the notch 116 can be formed on the top surface of the encasement 114 above the optical transducer 104 and near the edge of the chip package 100. The notch 116 can be formed via mold pressing. The notch 116 can have a predetermined shape and size, and can be positioned to facilitate self-alignment of die optical connector component (shown in
The optical element 106 resides proximate the edge of the chip package 100. The optical element 106 held in place by the encasement 114 or sandwiched between the encasement 114 and the base 108. In some embodiments, a side of the optical element can be flush (or substantially flush) with the edge of the chip package 100 and, in some embodiments, flush or substantially flush, with the encasement 114. A the side of the optical element 106 that is flush with the edge of the chip package 100 is exposed at the edge of the chip package 102 to transmit (i.e., optically transmit) optical signals to and from an optical fiber.
The optical fiber connector 302 can include a fiber guide 306. Fiber guide 306 can be configured to receive an optical fiber 310 The fiber guide 306 can provide structure support and strain relief for the optical fiber 310. The fiber guide 306 can hold the optical fiber 310 in place, and when the optical fiber connector 302 is connected to the chip package 300, the fiber guide 306 can hold the optical fiber 310 in place and in contact with the optical element 106, so that optical signals can be transmitted from the optical fiber 310 to the optical element 106, and optical signals can be transmitted from the optical element 106 to the optical fiber 310.
In some embodiments, a glue 308 can be used to add further structural support to the connection between the optical fiber connector 302 and the chip package 300. The glue 308 can be an optically transparent glue. The glue 308 can bind the optical fiber connector 302 to the encasement 114 and other parts of the chip package 300 as needed.
In some embodiments, the optical fiber connector 302 includes a connector hook 304. Connector hook 304 can fit into a notch/cut 318. In
When connecting the optical fiber connector 302, the optical fiber connector 302 can slide over the encasement 114, and the connector hook 304 can connect into the notch/cut 318. Hie connection between the connector hook 304 and the notch/cut 318 can create a mechanical stop, preventing the optical fiber connector 302 from moving towards or away from the chip package 300. When a notch is used, the connection between the notch and the connector hook 304 may also prevent the optical fiber connector 302 from moving side-to-side, relative the chip package.
The connector hook 304 and the notch/cut 318 also facilitate self-alignment of the optical fiber connector 302 (and the optical fiber 310) with the chip package 300. By creating the notch/cut 318 in a predetermined position proximate the optical transducer 104 and/or the optical element 106, the notch/cut 318 acts as a guide and hard stop for receiving the connector hook 304.
In some embodiments, solder balls 306 are used to add further mechanical fixation between the optical fiber connector 302 and the base 108.
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In some embodiments, the optical transducers 404a is structured such that each optical element 406 is adjacent to and in optical communication with an optical transducers 404a. In some embodiments, the optical transducers 404a-b are structured such that each optical element 406 is adjacent to and in optical communication with an optical transducers 404a-b (i.e., one optical transducer 404a on one side of the optical element 406 and one optical transducer 404b on the other side of the optical element 406).
The arrangement of the chips 402a-b and the optical transducers 404a-b and the optical element 406 can be as follows. A chip 402a can reside adjacent to an optical transducer 404a. The optical transducer 404a can reside adjacent to the optical element 406, such that the optical transducer 404a is between the chip 402a and the optical element 406. The chip 402a and the optical transducer 404a can be electrical coupled through a redistribution layer, discussed later. A second optical transducer 404b can reside adjacent to the optical element 406, such that the optical element 406 is between the optical transducer 404a and the optical transducer 404b. A chip 402b can reside adjacent to the optical transducer 404b, such that the optical transducer 404b is between the optical element 406 and the chip 402b. The chip 402b and the optical transducer 404b can be electrical coupled through a redistribution layer, discussed later.
A predetermined number of chips, optical transducers, and optical elements can be placed on the earner 410 in the above described orientation, depending on the size of the carrier.
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The chip package can be sawed through the center of each optical element, e.g., at a location 424. This sawing location can result in the optical element being at an edge of each resulting singulated chip package. Further, the optical element, after singulation, is exposed to the air. Sawing is performed in such a manner that die optical element is cleanly cut. In some embodiments, the optical element can be polished after singulation.
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In some embodiments, the optical transducers 604a is structured such that each optical element 406 is adjacent to and in optical communication with an optical transducers 604a. In some embodiments, the optical transducers 604a-b are structured such that each optical element 606 is adjacent to and in optical communication with an optical transducers 604a-b (i.e., one optical transducer 604a on one side of the optical element 606 and one optical transducer 604b on the other side of the optical element 606).
The arrangement of the chips 602a-b and the optical transducers 604a-b and the optical element 606 can be as follows. A chip 602a can reside adjacent to an optical transducer 604a. The optical transducer 604a can reside adjacent to the optical element 606, such that the optical transducer 604a is between the chip 402a and the optical element 606. The chip 602a and the optical transducer 604a can be electrical coupled through a redistribution layer, discussed later. A second optical transducer 604b can reside adjacent to the optical element 606, such that the optical element 606 is between the optical transducer 604a and the optical transducer 604b. A chip 602b can reside adjacent to the optical transducer 604b, such that the optical transducer 604b is between the optical element 606 and the chip 602b. The chip 602b and the optical transducer 604b can be electrical coupled through a redistribution layer, discussed later.
A predetermined number of chips, optical transducers, and optical elements can be placed on the flip chip substrate+RDL 612 in the above described orientation, depending on the size of the substrate.
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The chip package can be sawed through the center of each optical element, e.g., at a location 624. This sawing location can result in the optical element being at an edge of each resulting singulated chip package. Further, the optical element, after singulation, is exposed to the air. Sawing is performed in such a manner that the optical element is cleanly cut. In some embodiments, the optical element can be polished after singulation.
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The computing device 700 may include one or more mass storage devices 706 (such as flash memory devices or any other mass storage device suitable for inclusion in a flexible IC package). The system memory 704 and the mass storage device 706 may include any suitable storage devices, such as volatile memory (e.g., dynamic random access memory (DRAM)), nonvolatile memory (e.g., read-only memory (ROM)), and flash memory. The computing device 700 may include one or more I/O devices 708 (such as display, user input device, network interface cards, modems, and so forth, suitable for inclusion in a flexible IC device). The elements may be coupled to each other via a system bus 712, which represents one or more buses.
Each of these elements may perform its conventional functions known in the art. In particular, the system memory 704 and the mass storage device 706 may be employed to store a working copy and a permanent copy of programming instructions 722.
The permanent copy of the programming instructions 722 may be placed into permanent mass storage devices 706 in the factory or through a communication device included in the I/O devices 708 (e.g., from a distribution server (not shown)). The constitution of elements 702-712 are known, and accordingly will not be further described.
Machine-accessible media (including non-transitory computer-readable storage media), methods, systems, and devices for performing the above-described techniques are illustrative examples of embodiments disclosed herein for thermal management of an IC device. For example, a computer-readable media (e.g., the system memory 704 and/or the mass storage device 706) may have stored thereon instructions (e.g., the instructions 722) such that, when the instructions are executed by one or more of the processors 702.
As noted above, although the thermal management systems and techniques disclosed herein may be particularly advantageous when used to thermally manage flexible IC packages, these systems and techniques may also be implemented to improve thermal management of conventional, rigid IC packages. Thus, any of the embodiments disclosed herein and described as applicable in a flexible IC package may also apply in a conventional, rigid IC package setting. Such a rigid IC package may include, for example, a rigid substrate material and/or a rigid overmold material.
Additionally, although the thermal management systems and techniques disclosed herein may be particularly advantageous when used to thermally manage components (or “component sections,” as discussed above), these systems and techniques may be used to thermally manage any devices included in an IC package, such as a resistor, capacitor, transistor, inductor, radio, memory, processor, laser, light-emitting diode (LED), sensor, a memory gate, combinational or state logic, or ocher digital or analog component. A device thermally managed by the thermal management systems and techniques disclosed herein may be a packaged component (e.g., a surface mount, flip chip, ball grid array, land grid array, bumpless buildup layer, or other package) or an unpackaged component.
The relative sizes of features shown in the figures are not drawn to scale.
The following paragraphs provide examples of various ones of the embodiments disclosed herein.
Example 1 is a method comprising: providing an optical transducer and an optical element adjacent to the optical transducer on a carrier; encasing the optical transducer and the optical element with an encasement; and cutting the encasement and the optical element to expose a side of the optical element
Example 2 may include the subject matter of example 1, further comprising providing an integrated circuit proximate the optical transducer, the optical transducer between the optical element and the integrated circuit.
Example 3 may include the subject matter of any of examples 1 or 2, wherein the optical transducer is a first optical transducer, and wherein the first optical transducer resides on a first side of the optical element, the method further comprising: providing a second optical transducer residing on a second side of the optical element, opposite the first side of the optical element; and wherein cutting the encasement and the optical element comprises: cutting through the optical element to divide the optical element into two segments, a first segment of the optical element adjacent to the first optical transducer and a second segment of the optical element adjacent to the second optical transducer.
Example 4 may include the subject matter of example 1, wherein cutting the encasement comprises sawing through the encasement.
Example 5 may include the subject matter of example 1, wherein providing the optical transducer and optical element comprises arranging the optical transducer adjacent to the optical element on a carrier using an adhesive; and lifting off the encasement and the optical transducer and the optical element from the carrier.
Example 6 may include the subject matter of any of examples 1 or 5, further a comprising forming a base on an exposed side of the optical transducer and forming a redistribution layer in the base.
Example 7 may include the subject matter of any of examples 1 or 5 or 6, further comprising forming one or more solder balls electrically connected to the optical transducer through a redistribution layer in the base.
Example 8 may include the subject matter of example 6, wherein the base comprises a dielectric material.
Example 9 may include the subject matter of example 1, further comprising forming a connector receiver in the encasement at a top side of the encasement at a location proximate to the optical transducer.
Example 10 may include the subject matter of example 9, wherein forming the connector receiver comprises pressing a notch-negative into the encasement to form a notch in the encasement.
Example 11 may include the subject matter of example 9, wherein forming connector receiver comprises sawing the encasement to form a cut through the entire width of the encasement.
Example 12 may include the subject matter of example 1, wherein providing an optical transducer and an optical element adjacent to the optical transducer on a carrier comprises soldering the optical transducer to a prefabricated substrate, the prefabricated substrate comprising an integrated redistribution layer (RDL), wherein soldering the optical transducer to the prefabricated substrate comprises soldering the optical transducer to a contact pad of the RDL.
Example 13 may include the subject matter of example 12, further comprising forming a solder ball to a landing pad of the RDL, the solder ball electrically connected to the optical transducer through the RDL.
Example 14 is an apparatus comprising: a base comprising a redistribution layer; an optical transducer circuit element on the base electrically connected to the redistribution layer; an optical element adjacent to the optical transducer circuit element and at an edge of the base: and an encasement encasing the optical transducer circuit element and a portion of the optical element, wherein one side of the optical element is exposed at an edge of the encasement and at the edge of the printed circuit board.
Example 15 may include the subject matter of example 14, further comprising a connector receiver in a top side of the encasement at a location in the encasement proximate the optical transducer, the connector receiver configured to receive a tooth of an optical fiber connector.
Example 16 may include the subject matter of example 15, wherein the connector receiver comprises one of a notch or a cut.
Example 17 may include the subject matter of example 14, further comprising an integrated circuit residing on the base and electrically connected to the redistribution layer, the optical transducer residing between the optical element and the integrated circuit.
Example 18 is a computing system comprising: a base comprising a redistribution layer; an optical transducer circuit element on the base electrically connected to the redistribution layer; an optical element adjacent to the optical transducer circuit element and at an edge of the base; an encasement encasing the optical transducer circuit element and a portion of the optical element, wherein one side of the optical element is exposed at an edge of the encasement and at the edge of the printed circuit board, and an integrated circuit residing on the base and electrically connected to the redistribution layer, the optical transducer residing between the optical element and the integrated circuit.
Example 19 may include the subject matter of example 18, further comprising a redistribution layer interconnecting the integrated circuit chip and the optical transducer.
Example 20 may include the subject matter of example 18, further comprising one or more solder bails formed on the redistribution layer and in electrical connectivity with the integrated circuit chip.
Example 21 may include the subject matter of example 18, wherein the optical element comprises an optical-quality glass.
Example 22 may include the subject matter of example 18, further comprising a connector receiver in a top side of the encasement at a location in the encasement proximate the optical transducer, the connector receiver configured to receive a tooth of an optical fiber connector.
Example 23 may include the subject matter of any of examples 18 or 22, further comprising an optical fiber connector connected to the edge of the encasement, the optical fiber connector comprising a clamp and a tooth on an inner portion of the clamp, the tooth received in the connector receiver.
Example 24 may include the subject matter of example 23, wherein the optical fiber connector comprises an optical fiber in contact with the exposed portion of the optical element, the optical fiber connector securing the optical fiber in place.
Example 25 may include the subject matter of example 23, further comprising a transparent glue securing the optical fiber connector against the edge of the encasement.
Example 26 may include the subject matter of example 22, wherein the connector receiver comprises one of a notch or a cut.
Filing Document | Filing Date | Country | Kind |
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PCT/US2016/024400 | 3/28/2016 | WO | 00 |