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Andrew Cao
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Fremont, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Method of fabricating a carrier-less silicon interposer using photo...
Patent number
10,403,510
Issue date
Sep 3, 2019
Invensas Corporation
Andrew Cao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method for integrated circuits packaging with increas...
Patent number
10,381,326
Issue date
Aug 13, 2019
Invensas Corporation
Charles G. Woychik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier-less silicon interposer using photo patterned polymer as su...
Patent number
9,691,693
Issue date
Jun 27, 2017
Invensas Corporation
Andrew Cao
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Carrier-Less Silicon Interposer Using Photo Patterned Polymer as Su...
Publication number
20170294321
Publication date
Oct 12, 2017
Invensas Corporation
Andrew Cao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD FOR INTEGRATED CIRCUITS PACKAGING WITH INCREAS...
Publication number
20150348940
Publication date
Dec 3, 2015
Invensas Corporation
Charles G. WOYCHIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER-LESS SILICON INTERPOSER USING PHOTO PATTERNED POLYMER AS SU...
Publication number
20150155230
Publication date
Jun 4, 2015
Invensas Corporation
Andrew Cao
H01 - BASIC ELECTRIC ELEMENTS