Andrew H. Simon

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Confined bridge cell phase change memory
- Patent number 11,980,111
- Issue date May 7, 2024
- International Business Machines Corporation
- Injo Ok
Information Patent Grant
Phase change memory cell spacer
- Patent number 11,930,724
- Issue date Mar 12, 2024
- International Business Machines Corporation
- Injo Ok
Information Patent Grant
Phase change memory cell with a projection liner
- Patent number 11,476,418
- Issue date Oct 18, 2022
- International Business Machines Corporation
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change memory cell with a wrap around and ring type of electr...
- Patent number 11,456,415
- Issue date Sep 27, 2022
- International Business Machines Corporation
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having subtractive etch feature and damascen...
- Patent number 10,256,186
- Issue date Apr 9, 2019
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure for metal fuse applications
- Patent number 10,229,875
- Issue date Mar 12, 2019
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming air gap
- Patent number 10,224,236
- Issue date Mar 5, 2019
- GLOBALFOUNDRIES Inc.
- Samuel S. Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive etch interconnects
- Patent number 10,177,031
- Issue date Jan 8, 2019
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming
- Patent number 10,177,091
- Issue date Jan 8, 2019
- GLOBALFOUNDRIES Inc.
- Andrew H. Simon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detecting a void between a via and a wiring line
- Patent number 10,103,068
- Issue date Oct 16, 2018
- GLOBALFOUNDRIES Inc.
- Griselda Bonilla
- G01 - MEASURING TESTING
Information Patent Grant
Insulating a via in a semiconductor substrate
- Patent number 10,079,175
- Issue date Sep 18, 2018
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end electrically programmable fuse
- Patent number 9,893,011
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having substractive etch feature and damasce...
- Patent number 9,852,980
- Issue date Dec 26, 2017
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of IC structure with metal plug
- Patent number 9,793,216
- Issue date Oct 17, 2017
- GLOBALFOUNDRIES Inc.
- Joyeeta Nag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating a via in a semiconductor substrate
- Patent number 9,728,450
- Issue date Aug 8, 2017
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end electrically programmable fuse
- Patent number 9,685,404
- Issue date Jun 20, 2017
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having improved electromigration performance and...
- Patent number 9,679,810
- Issue date Jun 13, 2017
- GLOBALFOUNDRIES Inc.
- Joyeeta Nag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with enhanced reliability
- Patent number 9,673,089
- Issue date Jun 6, 2017
- AURIGA INNOVATIONS, INC
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having subtractive etch feature and damascen...
- Patent number 9,601,426
- Issue date Mar 21, 2017
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subsurface wires of integrated chip and methods of forming
- Patent number 9,601,513
- Issue date Mar 21, 2017
- GLOBALFOUNDRIES Inc.
- Terence B. Hook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance refractory metal / copper interconnects to elimina...
- Patent number 9,536,830
- Issue date Jan 3, 2017
- GLOBALFOUNDRIES Inc.
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure with air gap crack stop
- Patent number 9,536,842
- Issue date Jan 3, 2017
- GLOBALFOUNDRIES, INC.
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect scaling method including forming dielectric layer over...
- Patent number 9,502,350
- Issue date Nov 22, 2016
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package that includes a plurality of integrated circuit...
- Patent number 9,461,017
- Issue date Oct 4, 2016
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective local metal cap layer formation for improved electromigra...
- Patent number 9,455,186
- Issue date Sep 27, 2016
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene-metal E-fuse
- Patent number 9,431,346
- Issue date Aug 30, 2016
- GLOBALFOUNDRIES, INC.
- Junjing Bao
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Alternate dual damascene method for forming interconnects
- Patent number 9,431,292
- Issue date Aug 30, 2016
- GLOBALFOUNDRIES Inc.
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal fuse structure for improved programming capability
- Patent number 9,425,144
- Issue date Aug 23, 2016
- GLOBALFOUNDRIES, INC.
- Griselda Bonilla
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Constrained nanosecond laser anneal of metal interconnect structures
- Patent number 9,412,658
- Issue date Aug 9, 2016
- International Business Machines Corporation
- Oleg Gluschenkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective local metal cap layer formation for improved electromigra...
- Patent number 9,406,560
- Issue date Aug 2, 2016
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MIDDLE OF THE LINE ARCHITECTURE WITH SUBTRACTIVE SOURCE/DRAIN CONTACT
- Publication number 20240222448
- Publication date Jul 4, 2024
- International Business Machines Corporation
- Eric Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL WITH A VARIABLE ELEMENT AND A PHASE CHANGE MEMORY
- Publication number 20240215462
- Publication date Jun 27, 2024
- International Business Machines Corporation
- Ning Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET TRANSISTORS WITH BURIED POWER RAILS
- Publication number 20230094466
- Publication date Mar 30, 2023
- International Business Machines Corporation
- Julien Frougier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE MEMORY CELL SIDEWALL PROJECTION LINER
- Publication number 20230098562
- Publication date Mar 30, 2023
- International Business Machines Corporation
- Kevin W. Brew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY INSULATED PROJECTION LINER FOR AI DEVICE
- Publication number 20230085288
- Publication date Mar 16, 2023
- International Business Machines Corporation
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFINED BRIDGE CELL PHASE CHANGE MEMORY
- Publication number 20230075622
- Publication date Mar 9, 2023
- International Business Machines Corporation
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE MEMORY CELL SPACER
- Publication number 20230058218
- Publication date Feb 23, 2023
- International Business Machines Corporation
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE MEMORY CELL WITH A PROJECTION LINER
- Publication number 20220181547
- Publication date Jun 9, 2022
- International Business Machines Corporation
- Injo OK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE MEMORY CELL WITH A WRAP AROUND AND RING TYPE OF ELECTR...
- Publication number 20220181546
- Publication date Jun 9, 2022
- International Business Machines Corporation
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING AIR GAP
- Publication number 20180076082
- Publication date Mar 15, 2018
- GLOBALFOUNDRIES INC.
- Samuel S. Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SCALING
- Publication number 20180076133
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING AIR GAP
- Publication number 20170365504
- Publication date Dec 21, 2017
- GLOBALFOUNDRIES INC.
- Samuel S. Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING A VIA IN A SEMICONDUCTOR SUBSTRATE
- Publication number 20170256447
- Publication date Sep 7, 2017
- International Business Machines Corporation
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING
- Publication number 20170243827
- Publication date Aug 24, 2017
- GLOBALFOUNDRIES INC.
- Andrew H. Simon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING IMPROVED ELECTROMIGRATION PERFORMANCE AND...
- Publication number 20170236780
- Publication date Aug 17, 2017
- GLOBALFOUNDRIES INC.
- Joyeeta Nag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SCALING
- Publication number 20170221815
- Publication date Aug 3, 2017
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF IC STRUCTURE WITH METAL PLUG
- Publication number 20170213792
- Publication date Jul 27, 2017
- GLOBALFOUNDRIES INC.
- Joyeeta Nag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING A VIA IN A SEMICONDUCTOR SUBSTRATE
- Publication number 20160379876
- Publication date Dec 29, 2016
- International Business Machines Corporation
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTING A VOID BETWEEN A VIA AND A WIRING LINE
- Publication number 20160370421
- Publication date Dec 22, 2016
- GLOBALFOUNDRIES INC.
- Griselda Bonilla
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC PACKAGE THAT INCLUDES A PLURALITY OF INTEGRATED CIRCUIT...
- Publication number 20160300814
- Publication date Oct 13, 2016
- GLOBALFOUNDRIES INC.
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIA STRUCTURE FOR METAL FUSE APPLICATIONS
- Publication number 20160197039
- Publication date Jul 7, 2016
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS AIR GAP CRACK STOP
- Publication number 20160181208
- Publication date Jun 23, 2016
- GLOBALFOUNDRIES INC.
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE ETCH INTERCONNECTS
- Publication number 20160181200
- Publication date Jun 23, 2016
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONSTRAINED NANOSECOND LASER ANNEAL OF METAL INTERCONNECT STRUCTURES
- Publication number 20160086849
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Oleg Gluschenkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END ELECTRICALLY PROGRAMMABLE FUSE
- Publication number 20160027733
- Publication date Jan 28, 2016
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...
- Publication number 20150255343
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...
- Publication number 20150255398
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPING OF COPPER WIRING STRUCTURES IN BACK END OF LINE PROCESSING
- Publication number 20150255397
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Thomas W. Dyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...
- Publication number 20150255342
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUNDANT VIA STRUCTURE FOR METAL FUSE APPLICATIONS
- Publication number 20150235946
- Publication date Aug 20, 2015
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS

Andrew H. Simon

Person

Patents Grantslast 30 patents

Confined bridge cell phase change memory

Phase change memory cell spacer

Phase change memory cell with a projection liner

Phase change memory cell with a wrap around and ring type of electr...

Interconnect structure having subtractive etch feature and damascen...

Stacked via structure for metal fuse applications

Forming air gap

Subtractive etch interconnects

Interconnect structure and method of forming

Detecting a void between a via and a wiring line

Insulating a via in a semiconductor substrate

Back-end electrically programmable fuse

Interconnect structure having substractive etch feature and damasce...

Fabrication of IC structure with metal plug

Insulating a via in a semiconductor substrate

Back-end electrically programmable fuse

Integrated circuit having improved electromigration performance and...

Interconnect structure with enhanced reliability

Interconnect structure having subtractive etch feature and damascen...

Subsurface wires of integrated chip and methods of forming

High performance refractory metal / copper interconnects to elimina...

Structure with air gap crack stop

Interconnect scaling method including forming dielectric layer over...

Electronic package that includes a plurality of integrated circuit...

Selective local metal cap layer formation for improved electromigra...

Graphene-metal E-fuse

Alternate dual damascene method for forming interconnects

Metal fuse structure for improved programming capability

Constrained nanosecond laser anneal of metal interconnect structures

Selective local metal cap layer formation for improved electromigra...

Patents Applicationslast 30 patents

MIDDLE OF THE LINE ARCHITECTURE WITH SUBTRACTIVE SOURCE/DRAIN CONTACT

MEMORY CELL WITH A VARIABLE ELEMENT AND A PHASE CHANGE MEMORY

NANOSHEET TRANSISTORS WITH BURIED POWER RAILS

PHASE CHANGE MEMORY CELL SIDEWALL PROJECTION LINER

ELECTRICALLY INSULATED PROJECTION LINER FOR AI DEVICE

CONFINED BRIDGE CELL PHASE CHANGE MEMORY

PHASE CHANGE MEMORY CELL SPACER

PHASE CHANGE MEMORY CELL WITH A PROJECTION LINER

PHASE CHANGE MEMORY CELL WITH A WRAP AROUND AND RING TYPE OF ELECTR...

FORMING AIR GAP

INTERCONNECT SCALING

FORMING AIR GAP

INSULATING A VIA IN A SEMICONDUCTOR SUBSTRATE

INTERCONNECT STRUCTURE AND METHOD OF FORMING

INTEGRATED CIRCUIT HAVING IMPROVED ELECTROMIGRATION PERFORMANCE AND...

INTERCONNECT SCALING

FABRICATION OF IC STRUCTURE WITH METAL PLUG

INSULATING A VIA IN A SEMICONDUCTOR SUBSTRATE

DETECTING A VOID BETWEEN A VIA AND A WIRING LINE

ELECTRONIC PACKAGE THAT INCLUDES A PLURALITY OF INTEGRATED CIRCUIT...

STACKED VIA STRUCTURE FOR METAL FUSE APPLICATIONS

DISCONTINUOUS AIR GAP CRACK STOP

SUBTRACTIVE ETCH INTERCONNECTS

CONSTRAINED NANOSECOND LASER ANNEAL OF METAL INTERCONNECT STRUCTURES

BACK-END ELECTRICALLY PROGRAMMABLE FUSE

SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...

SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...

DOPING OF COPPER WIRING STRUCTURES IN BACK END OF LINE PROCESSING

SELECTIVE LOCAL METAL CAP LAYER FORMATION FOR IMPROVED ELECTROMIGRA...

REDUNDANT VIA STRUCTURE FOR METAL FUSE APPLICATIONS