Andrew J. Mawer

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor device assembly
- Patent number 11,908,784
- Issue date Feb 20, 2024
- NXP USA, INC.
- Akhilesh Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a ball grid array and method therefor
- Patent number 6,552,436
- Issue date Apr 22, 2003
- Motorola, Inc.
- Terry E. Burnette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Masking of circuit board vias to reduce heat-induced board and chip...
- Patent number 5,511,306
- Issue date Apr 30, 1996
- Compaq Computer Corporation
- Ronald D. Denton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STACKING A SEMICONDUCTOR DIE AND CHIP-SCALE-PACKAGE UNIT
- Publication number 20230137977
- Publication date May 4, 2023
- NXP B.V.
- Akhilesh Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE ASSEMBLY
- Publication number 20220093499
- Publication date Mar 24, 2022
- NXP USA, Inc.
- Akhilesh Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ISOLATION STRUCTURE
- Publication number 20190157222
- Publication date May 23, 2019
- NXP USA, Inc.
- Nishant LAKHERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a ball grid array and method therefor
- Publication number 20030102535
- Publication date Jun 5, 2003
- Terry E. Burnette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having a ball grid array and method therefor
- Publication number 20020070451
- Publication date Jun 13, 2002
- Terry E. Burnette
- H01 - BASIC ELECTRIC ELEMENTS