Andrew Kao

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Fremont, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
High density interconnect system having rapid fabrication cycle
- Patent number 7,884,634
- Issue date Feb 8, 2011
- Verigy (Singapore) PTE, Ltd.
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Grant
High density interconnect system having rapid fabrication cycle
- Patent number 7,872,482
- Issue date Jan 18, 2011
- Verigy (Singapore) Pte. Ltd.
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Grant
High density interconnect system having rapid fabrication cycle
- Patent number 7,382,142
- Issue date Jun 3, 2008
- NanoNexus, Inc.
- Fu Chiung Chong
- G01 - MEASURING TESTING
Information Patent Grant
Method for magneto-resistive head electrostatic popping detection
- Patent number 6,556,006
- Issue date Apr 29, 2003
- Samsung Electronics Co., Ltd.
- Zhaohui Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Scheme to avoid electrostatic discharge damage to MR/GMR head gimba...
- Patent number 6,326,553
- Issue date Dec 4, 2001
- Samsung Electronics, Co., Ltd.
- Pyongwon Yim
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
High Density Interconnect System Having Rapid Fabrication Cycle
- Publication number 20090153165
- Publication date Jun 18, 2009
- Fu Chiung CHONG
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTERCONNECT SYSTEM HAVING RAPID FABRICATION CYCLE
- Publication number 20080246500
- Publication date Oct 9, 2008
- Fu Chiung CHONG
- G01 - MEASURING TESTING
Information Patent Application
High density interconnect system having rapid fabrication cycle
- Publication number 20050275418
- Publication date Dec 15, 2005
- Fu Chiung Chong
- G01 - MEASURING TESTING