Andrew N. Sawle

Person

East Grinstead, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including a semiconductor die having redistri...
- Patent number 10,103,076
- Issue date Oct 16, 2018
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a reliable solderable contact
- Patent number 9,852,940
- Issue date Dec 26, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderable contact and passivation for semiconductor dies
- Patent number 9,852,939
- Issue date Dec 26, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package with conductive carr...
- Patent number 9,673,109
- Issue date Jun 6, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a semiconductor die having redistri...
- Patent number 9,633,951
- Issue date Apr 25, 2017
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked half-bridge package
- Patent number 9,601,418
- Issue date Mar 21, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked half-bridge package
- Patent number 9,583,477
- Issue date Feb 28, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including conductive carrier coupled power sw...
- Patent number 9,576,887
- Issue date Feb 21, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package having vertically stacked driver IC
- Patent number 9,502,395
- Issue date Nov 22, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with a common conductive clip
- Patent number 9,461,022
- Issue date Oct 4, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter package including top-drain configured power FET
- Patent number 9,397,212
- Issue date Jul 19, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked half-bridge package with a common leadframe
- Patent number 9,349,677
- Issue date May 24, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a power semiconductor package including vert...
- Patent number 9,299,690
- Issue date Mar 29, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package with conductive carr...
- Patent number 9,269,655
- Issue date Feb 23, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter package including vertically stacked driver IC
- Patent number 9,159,703
- Issue date Oct 13, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive carrier integrated heat spreader
- Patent number 9,111,921
- Issue date Aug 18, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge package with a conductive clip
- Patent number 9,048,230
- Issue date Jun 2, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buck converter power package
- Patent number 8,860,194
- Issue date Oct 14, 2014
- International Rectifier Corporation
- Ling Ma
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Stacked half-bridge package with a common conductive clip
- Patent number 8,680,627
- Issue date Mar 25, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked half-bridge package with a current carrying layer
- Patent number 8,674,497
- Issue date Mar 18, 2014
- International Business Machines Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package
- Patent number 8,466,546
- Issue date Jun 18, 2013
- International Rectifier Corporation
- Andy Farlow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked half-bridge package with a common conductive leadframe
- Patent number 8,426,952
- Issue date Apr 23, 2013
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderable top metalization and passivation for source mounted package
- Patent number 8,368,211
- Issue date Feb 5, 2013
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Autoclave capable chip-scale package
- Patent number 8,143,729
- Issue date Mar 27, 2012
- International Rectifier Corporation
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective barrier layer for semiconductor device electrodes
- Patent number 8,125,083
- Issue date Feb 28, 2012
- International Rectifier Corporation
- Martin Carroll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal pad arrangement for surface mounted semiconductor devices
- Patent number 7,968,984
- Issue date Jun 28, 2011
- International Rectifier Corporation
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Use of solder paste for heat dissipation
- Patent number 7,417,312
- Issue date Aug 26, 2008
- International Rectifier Corporation
- Andrew Neil Sawle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package fabrication
- Patent number 7,402,507
- Issue date Jul 22, 2008
- International Rectifier Corporation
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mounted package with die bottom spaced from support board
- Patent number 7,285,866
- Issue date Oct 23, 2007
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounted package with die bottom spaced from support board
- Patent number 6,930,397
- Issue date Aug 16, 2005
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...
- Publication number 20180366380
- Publication date Dec 20, 2018
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...
- Publication number 20170148692
- Publication date May 25, 2017
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Half-Bridge Package
- Publication number 20160260697
- Publication date Sep 8, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabricating a Semiconductor Package with Conductive Carrier
- Publication number 20160155674
- Publication date Jun 2, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package Having Vertically Stacked Driver IC
- Publication number 20160035699
- Publication date Feb 4, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A POWER SEMICONDUCTOR PACKAGE INCLUDING VERT...
- Publication number 20160027767
- Publication date Jan 28, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Package with Conductive Carr...
- Publication number 20150348887
- Publication date Dec 3, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Heat Spreader
- Publication number 20150348888
- Publication date Dec 3, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package with a Common Conductive Clip
- Publication number 20150279821
- Publication date Oct 1, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Half-Bridge Package with a Conductive Clip
- Publication number 20140203419
- Publication date Jul 24, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Half-Bridge Package
- Publication number 20140191337
- Publication date Jul 10, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buck Converter Power Package
- Publication number 20140118032
- Publication date May 1, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Ling Ma
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Power Converter Package Including Top-Drain Configured Power FET
- Publication number 20140110788
- Publication date Apr 24, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Conductive Carrier Integrated Heat Spreader
- Publication number 20140110796
- Publication date Apr 24, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Converter Package Including Vertically Stacked Driver IC
- Publication number 20140110863
- Publication date Apr 24, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Conductive Carrier Coupled Power Sw...
- Publication number 20140110776
- Publication date Apr 24, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Half-Bridge Package with a Common Leadframe
- Publication number 20130228794
- Publication date Sep 5, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderable Contact and Passivation for Semiconductor Dies
- Publication number 20130140701
- Publication date Jun 6, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Reliable Solderable Contact
- Publication number 20130143399
- Publication date Jun 6, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Half-Bridge Package with a Current Carrying Layer
- Publication number 20120181681
- Publication date Jul 19, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Half-Bridge Package with a Common Conductive Leadframe
- Publication number 20120181674
- Publication date Jul 19, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Half-Bridge Package with a Common Conductive Clip
- Publication number 20120181624
- Publication date Jul 19, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOCLAVE CAPABLE CHIP-SCALE PACKAGE
- Publication number 20090218684
- Publication date Sep 3, 2009
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20070158796
- Publication date Jul 12, 2007
- International Rectifier Corporation
- Andrew N. Sawle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package including a semiconductor die having redistri...
- Publication number 20070108585
- Publication date May 17, 2007
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL PAD ARRANGEMENT FOR SURFACE MOUNTED SEMICONDUCTOR DEVICES
- Publication number 20070091546
- Publication date Apr 26, 2007
- INTERNATIONAL RECTIFIER CORPORATION
- Martin Standing
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Protective barrier layer for semiconductor device electrodes
- Publication number 20070052099
- Publication date Mar 8, 2007
- Martin Carroll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of solder paste for heat dissipation
- Publication number 20060267183
- Publication date Nov 30, 2006
- International Rectifier Corporation
- Andrew Neil Sawle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip-scale package
- Publication number 20060249836
- Publication date Nov 9, 2006
- Andy Farlow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package fabrication
- Publication number 20060205112
- Publication date Sep 14, 2006
- Martin Standing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Andrew N. Sawle

Person

Patents Grantslast 30 patents

Semiconductor package including a semiconductor die having redistri...

Method for forming a reliable solderable contact

Solderable contact and passivation for semiconductor dies

Method for fabricating a semiconductor package with conductive carr...

Semiconductor package including a semiconductor die having redistri...

Stacked half-bridge package

Stacked half-bridge package

Semiconductor package including conductive carrier coupled power sw...

Power semiconductor package having vertically stacked driver IC

Power semiconductor package with a common conductive clip

Power converter package including top-drain configured power FET

Stacked half-bridge package with a common leadframe

Method for fabricating a power semiconductor package including vert...

Method for fabricating a semiconductor package with conductive carr...

Power converter package including vertically stacked driver IC

Semiconductor package with conductive carrier integrated heat spreader

Half-bridge package with a conductive clip

Buck converter power package

Stacked half-bridge package with a common conductive clip

Stacked half-bridge package with a current carrying layer

Chip-scale package

Stacked half-bridge package with a common conductive leadframe

Solderable top metalization and passivation for source mounted package

Autoclave capable chip-scale package

Protective barrier layer for semiconductor device electrodes

Universal pad arrangement for surface mounted semiconductor devices

Use of solder paste for heat dissipation

Semiconductor package fabrication

Surface mounted package with die bottom spaced from support board

Surface mounted package with die bottom spaced from support board

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...

SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...

Stacked Half-Bridge Package

Fabricating a Semiconductor Package with Conductive Carrier

Power Semiconductor Package Having Vertically Stacked Driver IC

METHOD FOR FABRICATING A POWER SEMICONDUCTOR PACKAGE INCLUDING VERT...

Method for Fabricating a Semiconductor Package with Conductive Carr...

Semiconductor Package with Integrated Heat Spreader

Power Semiconductor Package with a Common Conductive Clip

Half-Bridge Package with a Conductive Clip

Stacked Half-Bridge Package

Buck Converter Power Package

Power Converter Package Including Top-Drain Configured Power FET

Semiconductor Package with Conductive Carrier Integrated Heat Spreader

Power Converter Package Including Vertically Stacked Driver IC

Semiconductor Package Including Conductive Carrier Coupled Power Sw...

Stacked Half-Bridge Package with a Common Leadframe

Solderable Contact and Passivation for Semiconductor Dies

Method for Forming a Reliable Solderable Contact

Stacked Half-Bridge Package with a Current Carrying Layer

Stacked Half-Bridge Package with a Common Conductive Leadframe

Stacked Half-Bridge Package with a Common Conductive Clip

AUTOCLAVE CAPABLE CHIP-SCALE PACKAGE

Semiconductor package

Semiconductor package including a semiconductor die having redistri...

UNIVERSAL PAD ARRANGEMENT FOR SURFACE MOUNTED SEMICONDUCTOR DEVICES

Protective barrier layer for semiconductor device electrodes

Use of solder paste for heat dissipation

Chip-scale package

Semiconductor package fabrication