Andrew W. Yeoh

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 12,142,667
- Issue date Nov 12, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi version library cell handling and integrated circuit structur...
- Patent number 12,067,338
- Issue date Aug 20, 2024
- Intel Corporation
- Ranjith Kumar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 11,955,534
- Issue date Apr 9, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 11,581,419
- Issue date Feb 14, 2023
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plugs for interconnect lines for advanced integrated circuit struct...
- Patent number 11,404,559
- Issue date Aug 2, 2022
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi version library cell handling and integrated circuit structur...
- Patent number 11,271,010
- Issue date Mar 8, 2022
- Intel Corporation
- Ranjith Kumar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 11,031,487
- Issue date Jun 8, 2021
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch-stop layer topography for advanced integrated circuit structur...
- Patent number 10,943,817
- Issue date Mar 9, 2021
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 10,854,731
- Issue date Dec 1, 2020
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plugs for interconnect lines for advanced integrated circuit struct...
- Patent number 10,818,774
- Issue date Oct 27, 2020
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch-stop layer topography for advanced integrated circuit structur...
- Patent number 10,796,951
- Issue date Oct 6, 2020
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 10,777,655
- Issue date Sep 15, 2020
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 10,541,316
- Issue date Jan 21, 2020
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thickened stress relief and power distribution layer
- Patent number 10,229,879
- Issue date Mar 12, 2019
- Intel Corporation
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anchored interconnect
- Patent number 9,818,710
- Issue date Nov 14, 2017
- Intel Corporation
- Jiho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Necked interconnect fuse structure for integrated circuits
- Patent number 9,679,845
- Issue date Jun 13, 2017
- Intel Corporation
- Zhanping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D interconnect structure comprising through-silicon vias combined...
- Patent number 9,530,740
- Issue date Dec 27, 2016
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thickened stress relief and power distribution layer
- Patent number 9,496,173
- Issue date Nov 15, 2016
- Intel Corporation
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D interconnect structure comprising fine pitch single damascene ba...
- Patent number 9,449,913
- Issue date Sep 20, 2016
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit package with window interposer
- Patent number 9,391,013
- Issue date Jul 12, 2016
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D interconnect structure comprising through-silicon vias combined...
- Patent number 9,142,510
- Issue date Sep 22, 2015
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit package with window interposer
- Patent number 9,129,958
- Issue date Sep 8, 2015
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal sensor using a vibrating MEMS resonator of a chip interconn...
- Patent number 8,827,550
- Issue date Sep 9, 2014
- Intel Corporation
- Mohamed A. Abdelmoneum
- G01 - MEASURING TESTING
Information Patent Grant
Hardening of copper to improve copper CMP performance
- Patent number 7,285,496
- Issue date Oct 23, 2007
- Intel Corporation
- Andrew Yeoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hardening of copper to improve copper CMP performance
- Patent number 7,145,244
- Issue date Dec 5, 2006
- Intel Corporation
- Andrew Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under bump metallization layer to enable use of high tin content so...
- Patent number 7,064,446
- Issue date Jun 20, 2006
- Intel Corporation
- John P. Barnak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hardening of copper to improve copper CMP performance
- Patent number 6,979,646
- Issue date Dec 27, 2005
- Intel Corporation
- Andrew Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hardening of copper to improve copper CMP performance
- Patent number 6,909,192
- Issue date Jun 21, 2005
- Intel Corporation
- Andrew Yeoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI VERSION LIBRARY CELL HANDLING AND INTEGRATED CIRCUIT STRUCTUR...
- Publication number 20240362391
- Publication date Oct 31, 2024
- Intel Corporation
- Ranjith KUMAR
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20240047556
- Publication date Feb 8, 2024
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE ALL AROUND BACKSIDE POWER RAIL WITH DIFFUSION BREAK
- Publication number 20230260909
- Publication date Aug 17, 2023
- Applied Materials, Inc.
- Andrew Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE ALL AROUND BACKSIDE POWER RAIL FORMATION WITH MULTI-COLOR BACK...
- Publication number 20230260908
- Publication date Aug 17, 2023
- Applied Materials, Inc.
- Andrew Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20230144607
- Publication date May 11, 2023
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20230101723
- Publication date Mar 30, 2023
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER RAIL TO DEEP VIAS
- Publication number 20230068312
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED WIDE BACKSIDE POWER RAIL CONTACTS TO MULTIPLE TRANSIST...
- Publication number 20230064183
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ULTRA THINNING OF WAFER
- Publication number 20230061392
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REMOVING ETCH STOP LAYERS
- Publication number 20230035288
- Publication date Feb 2, 2023
- Suketu PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR REMOVING ETCH STOP LAYERS
- Publication number 20230031381
- Publication date Feb 2, 2023
- Suketu PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...
- Publication number 20220336633
- Publication date Oct 20, 2022
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI VERSION LIBRARY CELL HANDLING AND INTEGRATED CIRCUIT STRUCTUR...
- Publication number 20220149075
- Publication date May 12, 2022
- Intel Corporation
- Ranjith KUMAR
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20210234022
- Publication date Jul 29, 2021
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20210066475
- Publication date Mar 4, 2021
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...
- Publication number 20210013323
- Publication date Jan 14, 2021
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI VERSION LIBRARY CELL HANDLING AND INTEGRATED CIRCUIT STRUCTUR...
- Publication number 20200357823
- Publication date Nov 12, 2020
- Intel Corporation
- Ranjith KUMAR
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20200105906
- Publication date Apr 2, 2020
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH-DIVIDED INTERCONNECTS FOR ADVANCED INTEGRATED CIRCUIT STRUCTU...
- Publication number 20200043850
- Publication date Feb 6, 2020
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20200044049
- Publication date Feb 6, 2020
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH-STOP LAYER TOPOGRAPHY FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...
- Publication number 20200027781
- Publication date Jan 23, 2020
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH-STOP LAYER TOPOGRAPHY FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...
- Publication number 20190164818
- Publication date May 30, 2019
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...
- Publication number 20190164814
- Publication date May 30, 2019
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20190164765
- Publication date May 30, 2019
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20190164897
- Publication date May 30, 2019
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH-DIVIDED INTERCONNECTS FOR ADVANCED INTEGRATED CIRCUIT STRUCTU...
- Publication number 20190164890
- Publication date May 30, 2019
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANCHORED INTERCONNECT
- Publication number 20170069589
- Publication date Mar 9, 2017
- Intel Corporation
- JIHO KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NECKED INTERCONNECT FUSE STRUCTURE FOR INTEGRATED CIRCUITS
- Publication number 20170018499
- Publication date Jan 19, 2017
- Zhanping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thickened Stress Relief and Power Distribution Layer
- Publication number 20170011997
- Publication date Jan 12, 2017
- Intel Corporation
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED...
- Publication number 20150364425
- Publication date Dec 17, 2015
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS

Andrew W. Yeoh

Person

Patents Grantslast 30 patents

Contact over active gate structures for advanced integrated circuit...

Multi version library cell handling and integrated circuit structur...

Heterogeneous metal line compositions for advanced integrated circu...

Heterogeneous metal line compositions for advanced integrated circu...

Plugs for interconnect lines for advanced integrated circuit struct...

Multi version library cell handling and integrated circuit structur...

Contact over active gate structures for advanced integrated circuit...

Etch-stop layer topography for advanced integrated circuit structur...

Heterogeneous metal line compositions for advanced integrated circu...

Plugs for interconnect lines for advanced integrated circuit struct...

Etch-stop layer topography for advanced integrated circuit structur...

Heterogeneous metal line compositions for advanced integrated circu...

Contact over active gate structures for advanced integrated circuit...

Thickened stress relief and power distribution layer

Anchored interconnect

Necked interconnect fuse structure for integrated circuits

3D interconnect structure comprising through-silicon vias combined...

Thickened stress relief and power distribution layer

3D interconnect structure comprising fine pitch single damascene ba...

3D integrated circuit package with window interposer

3D interconnect structure comprising through-silicon vias combined...

3D integrated circuit package with window interposer

Thermal sensor using a vibrating MEMS resonator of a chip interconn...

Hardening of copper to improve copper CMP performance

Hardening of copper to improve copper CMP performance

Under bump metallization layer to enable use of high tin content so...

Hardening of copper to improve copper CMP performance

Hardening of copper to improve copper CMP performance

Patents Applicationslast 30 patents

MULTI VERSION LIBRARY CELL HANDLING AND INTEGRATED CIRCUIT STRUCTUR...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

GATE ALL AROUND BACKSIDE POWER RAIL WITH DIFFUSION BREAK

GATE ALL AROUND BACKSIDE POWER RAIL FORMATION WITH MULTI-COLOR BACK...

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

BACKSIDE POWER RAIL TO DEEP VIAS

SELF-ALIGNED WIDE BACKSIDE POWER RAIL CONTACTS TO MULTIPLE TRANSIST...

METHOD OF ULTRA THINNING OF WAFER

METHODS FOR REMOVING ETCH STOP LAYERS

APPARATUS FOR REMOVING ETCH STOP LAYERS

PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...

MULTI VERSION LIBRARY CELL HANDLING AND INTEGRATED CIRCUIT STRUCTUR...

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...

MULTI VERSION LIBRARY CELL HANDLING AND INTEGRATED CIRCUIT STRUCTUR...

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

PITCH-DIVIDED INTERCONNECTS FOR ADVANCED INTEGRATED CIRCUIT STRUCTU...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

ETCH-STOP LAYER TOPOGRAPHY FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...

ETCH-STOP LAYER TOPOGRAPHY FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...

PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

PITCH-DIVIDED INTERCONNECTS FOR ADVANCED INTEGRATED CIRCUIT STRUCTU...

ANCHORED INTERCONNECT

NECKED INTERCONNECT FUSE STRUCTURE FOR INTEGRATED CIRCUITS

Thickened Stress Relief and Power Distribution Layer

3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED...